Sukhadha Viswanathan, Tomonori Ogawa, Kaya Demir, Timothy B. Huang, P. Markondeya Raj, Fuhan Liu, Venky Sundaram, Rao Tummala; Georgia Institute of Technology
This paper demonstrates the high frequency performance and thermo-mechanical reliability of through vias with 25 µm diameter at 50 µm pitch in 100 µm thin glass substrates. Scaling of through via interconnect diameter and pitch has several electrical performance advantages for high bandwidth 2.5D interposers as well as mm-wave components for 5G modules.
This paper focuses on the assessment of thermo-mechanical reliability, of high aspect ratio TPVs at ultra-fine pitch, metallized using a via-first approach, and the accurate electrical modelling of TPVs and transmission lines with TPVs up to 40 GHz, using ANSYS HFSSTM.
SMTA - Surface Mount Technology Association is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies.
IPC - Association Connecting Electronics Industries is a US-based trade association dedicated to the competitive excellence and financial success of its nearly 2,600 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly.
