Surface Mount Technology companies
Manufacturer of high precision cleaning products and services for all required applications in the electronics manufacturing industry.
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Zestron - Technical Center: Cleaning equipment for PCB, stencil, maintenance cleaning
ZESTRON is the global market and technology leader for cleaning products and services for high precision cleaning applications. With the expertise gained through more than 25 years experience in precision cleaning, we develop customized solutions for your specific cleaning applications.
ZESTRON's unique MPC Technology (HMIS rating 0-0-0) gives water-based cleaning agents the performance of solvent-based cleaners. ZESTRON's state-of-the-art Application Technology Centers enable us to tailor our products specifically to your process requirements and provide the technical know-how for timely product quality assessments.
You can test all ZESTRON products free of charge at our three Technical Centers in Europe, America or Asia.
The Technical Centers with more than 35 cleaning machines from leading system manufacturers, offer you the opportunity to carry out free product trials in all types of systems.
Three main cleaning product groups currently are available:
At ZESTRON's Analytical Center, you have the opportunity to evaluate the substrate surface cleanliness according to latest industry standards including IPC, MIL or J-STD employing a variety of test techniques.
Moreover, you'll also be provided with a comprehensive technical report providing detailed analyses of tests performed. Wash bath quality can also be analyzed confirming specified concentration and effectiveness.
In addition, ZESTRON also provides tools/accessories that could be used to measure actual concentration of cleaning agents independent of dissolved contamination. These tools includes manual methods using Bath Analyzers and automatic methods using the ZESTRON® EYE.
Jun 28, 2011 | ZESTRON
ZESTRON America’s spring edition of ZESTRON News goes back to basics providing the latest information on the topics of cleaning in the electronics manufacturing industry....
Dec 22, 2009 | Dr. Harald Wack, Umut Tosun, M.S.Chem.Eng., Dr. Joachim Becht, Dr. Helmut Schweigart
While most cleaning applications in the North American market rely on cleaning with DI-water only, for removing OA fluxes in first place, recent market studies show that water has reached its limitations in cleaning performance while favoring usage of aqueous processes. The term aqueous implies the use of aqueous-based chemistries with active ingredients and are usually diluted with DI-water. The nature of these active ingredients in the aqueous chemistries varies between manufacturer and his R&D knowledge. ...
Sep 18, 2009 | Harald Wack, Ph.D., Umut Tosun, Naveen Ravindran, Sylvain Chamousset, Joachim Becht, Ph.D.; ZESTRON, Steve Stach, Austin American Technology Corp.
In recent years, various studies have been issued on cleaning under low standoff components; most however, with incomplete information. It is essential to revisit and describe the latest challenges in the market, identifying obvious gaps in available information. Such information is crucial for potential and existing users to fully address the cleanliness levels under their respective components. With the emergence of lead-free soldering and even smaller components, new challenges have arisen including cleaning in gaps of less than 1-mil....
Jul 01, 2009 | Steve Stach, Austin American Technology Harald Wack, Ph.D., Umut Tosun, Naveen Ravindran, ZESTRON America, John M. Radman, Daniel D. Phillips, Trace Laboratories East
During the last 5 years, the processes to remove flux residues especially for lead-free and challenging geometries have demonstrated new cleaning obstacles which have to be overcome.i A new methodology has been recently developed to further increase the propensity for successful cleaning.ii At the core of this method is the thermal identification of the residue matrix. Thermal energy changes the physical state, i.e. transitions between liquid, solid and gas phases. By taking advantage of such specific information during phase transitions, the cleaning process can be tailored to such settings, which in turn increases the cleaning success significantly....
Jan 06, 2009 | Steve Stach, Austin America; Harald Wack, Ph.D., Naveen Ravindran, Zestron America; Joachim Becht, Zestron Europe
To prevent malfunctions in high-power electronics, flux residues must be removed from flip chip components prior to subsequent processes. As a result, integrating a suitable cleaning application into the manufacturing process of flip chip components is often required. Solvent based applications have re-emerged, and with that, an overall process solution is necessary....
Nov 12, 2013 | ZESTRON is pleased to announce that GT Yeoh, Senior Application Engineer, ZESTRON South Asia, will present “Determine Critical Cleaning Process Parameters for QFNs” at the IPC Southeast Asia Conference on Assembly and Reliability on November 20th in Bangkok, Thailand.
Nov 09, 2013 | ZESTRON is pleased to announce that Ravi Parthasarathy, M.S.Chem.Eng., Senior Process Engineer, ZESTRON, will present “Reliability Requirements for Class 3 Medical Assemblies” at the SMTA iNEMI Medical Electronics Symposium on Tuesday, November 12th at 3:00 PM.
Nov 06, 2013 | ZESTRONis pleased to announce that Electri-Rep is now representing its complete line of cleaning process solutions and services in Missouri, Nebraska, Kansas, Illinois, and Wisconsin.
Nov 06, 2013 | ZESTRON is pleased to announce that Jigar Patel, M.S.Chem.Eng., will present “Defluxing in a No-clean and OA World” at the Cleaning, Testing, and Coating Workshop in Toronto, Ontario, on Tuesday, November 19th, and on Thursday, November 21st, in Montreal, Quebec.
Nov 04, 2013 | ZESTRONis pleased to announce that Naveen Ravindran, M.S.Chem.Eng., Application Engineer, ZESTRON, is a featured presenter at the 2013 SMTA LA/Orange County Tech Forum and Expo.
Oct 29, 2013 | ZESTRON is pleased to announce that Axel Vargas, Application Engineer, ZESTRON, is a featured presenter at the 2013 SMTA Guadalajara Tech Forum and Expo. Mr. Vargas will present “Determine Critical Cleaning Process Parameters for QFNs” in Spanish on October 30th.
Oct 28, 2013 | ZESTRON is pleased to announce that Kalyan Nukala, M.S.Chem.Eng., Application Engineer, ZESTRON, will present “Why Clean PCBs” at the SMTA Heartland (Kansas, Missouri) Chapter Meeting on October 29th.
Oct 15, 2013 | ZESTRON is pleased to announce that Ravi Parthasarathy, M.S.Chem.Eng., Senior Process Engineer, ZESTRON, will present “Comparative Cleaning Study to Showcase the Effective Removal of OA Flux Residues” at the SMTA Connecticut Expo and Tech Forum on October 22nd.
Oct 09, 2013 | ZESTRON will host live demonstrations of the ZESTRON® EYE, the latest innovation in concentration monitoring technology, at SMTAI 2013, booth #416.
Oct 07, 2013 | ZESTRON is pleased to announce the final installment of ZESTRON @cademy’s 2013 free-of-charge 10-part Cleaning Webinar Series titled “Solutions for Difficult to Clean SMT & Through Hole Components.”
11285 Assett Loop
Manassas, Virginia, 20109
Ingolstadt 85053, Germany
ZESTRON East China
1/F, Building 9, , Zun Xuan Industrial Park, Lane 1199, Ji Di Road, Minhang District,
Shanghai 201107, China
ZESTRON South China
1A/ Building B6, No. 3009 Guan Guang Rd.
Shenzhen 518107, China
ZESTRON South Asia
No. 22, Jalan Persiaran 1 , Taman Kulim Avenue
Kulim, Kedah 09000, Malaysia