Surface Mount Technology companies
Manufacturer of high precision cleaning products and services for all required applications in the electronics manufacturing industry.
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MPC® Technology's cleaning properties allow a wide application range and power the complete removal of all contaminants from electronic substrate surfaces.
ZESTRON is the global market and technology leader for cleaning products and services for high precision cleaning applications. With the expertise gained through more than 25 years experience in precision cleaning, we develop customized solutions for your specific cleaning applications.
ZESTRON's unique MPC Technology (HMIS rating 0-0-0) gives water-based cleaning agents the performance of solvent-based cleaners. ZESTRON's state-of-the-art Application Technology Centers enable us to tailor our products specifically to your process requirements and provide the technical know-how for timely product quality assessments.
You can test all ZESTRON products free of charge at our three Technical Centers in Europe, America or Asia.
The Technical Centers with more than 35 cleaning machines from leading system manufacturers, offer you the opportunity to carry out free product trials in all types of systems.
Three main cleaning product groups currently are available:
At ZESTRON's Analytical Center, you have the opportunity to evaluate the substrate surface cleanliness according to latest industry standards including IPC, MIL or J-STD employing a variety of test techniques.
Moreover, you'll also be provided with a comprehensive technical report providing detailed analyses of tests performed. Wash bath quality can also be analyzed confirming specified concentration and effectiveness.
In addition, ZESTRON also provides tools/accessories that could be used to measure actual concentration of cleaning agents independent of dissolved contamination. These tools includes manual methods using Bath Analyzers and automatic methods using the ZESTRON® EYE.
HYDRON® WS 400, based on the FAST® Technology, is an aqueous based cleaning agent specifically designed to remove water-soluble (OA) flux residues from electronic assemblies and is compatible with sensitive metals. Applied at low concentra...
The World’s First Automated Concentration Measurement System For Electronics Cleaning Processes The ZESTRON® EYE consists of a sensor and a controller that can be fully integrated with commonly used cleaning machine types...
VIGON US is a water-based medium specifically developed for the use in ultrasonic, spray-under-immersion and centrifugal cleaning equipment. Based on MPC Technology, VIGON US removes all types of flux residues from electronic assemblies, cerami...
PCB Cleaning Medium with a Mild Formulation Especially for Sensitive Metal Alloys VIGON A 250 is a water-based MPC® cleaning agent designed to remove flux residues and solder pastes from electronic assemblies. Due to its mild f...
Water-based Cleaning Medium for Reflow and Wave Solder Equipment. Based on the MPC® Technology, VIGON® RC 101 was specifically developed to remove all types of baked-on flux residues from reflow and wave solder equipment. I...
HYDRON® WS 325 is a FAST® Technology based cleaning agent specifically designed to remove water-soluble (OA) flux residues from electronic assemblies. Applied at low concentrations, the cleaning agent has been specifica...
Water-based, pH-neutral defluxing agent Based on the MPC® Technology, ZESTRON’s latest pH-neutral cleaning agent has been specifically developed for use at low operating concentrations in spray-in-air inline and batch cle...
ATRON® AC 207 is a FAST® Technology-based cleaning agent specifically designed to operate at low concentration levels. The product was developed to improve the cleaning performance and bath life of traditional surfactan...
As part of a maintenance cleaning program, the most prevalent types of contamination, such as burnt-in fluxes and condensed gas emissions from the soldering process, must be removed to ensure a reliable and fai...
Stencil / Screen / Misprint Cleaning Solder pastes, SMT adhesives as well as thick film pastes, which are most commonly used during the assembly process, are typically applied via screens and stencils. Residues that are left behind...
Jun 28, 2011 | ZESTRON
ZESTRON America’s spring edition of ZESTRON News goes back to basics providing the latest information on the topics of cleaning in the electronics manufacturing industry....
Dec 22, 2009 | Dr. Harald Wack, Umut Tosun, M.S.Chem.Eng., Dr. Joachim Becht, Dr. Helmut Schweigart
While most cleaning applications in the North American market rely on cleaning with DI-water only, for removing OA fluxes in first place, recent market studies show that water has reached its limitations in cleaning performance while favoring usage of aqueous processes. The term aqueous implies the use of aqueous-based chemistries with active ingredients and are usually diluted with DI-water. The nature of these active ingredients in the aqueous chemistries varies between manufacturer and his R&D knowledge. ...
Sep 18, 2009 | Harald Wack, Ph.D., Umut Tosun, Naveen Ravindran, Sylvain Chamousset, Joachim Becht, Ph.D.; ZESTRON, Steve Stach, Austin American Technology Corp.
In recent years, various studies have been issued on cleaning under low standoff components; most however, with incomplete information. It is essential to revisit and describe the latest challenges in the market, identifying obvious gaps in available information. Such information is crucial for potential and existing users to fully address the cleanliness levels under their respective components. With the emergence of lead-free soldering and even smaller components, new challenges have arisen including cleaning in gaps of less than 1-mil....
Jul 01, 2009 | Steve Stach, Austin American Technology Harald Wack, Ph.D., Umut Tosun, Naveen Ravindran, ZESTRON America, John M. Radman, Daniel D. Phillips, Trace Laboratories East
During the last 5 years, the processes to remove flux residues especially for lead-free and challenging geometries have demonstrated new cleaning obstacles which have to be overcome.i A new methodology has been recently developed to further increase the propensity for successful cleaning.ii At the core of this method is the thermal identification of the residue matrix. Thermal energy changes the physical state, i.e. transitions between liquid, solid and gas phases. By taking advantage of such specific information during phase transitions, the cleaning process can be tailored to such settings, which in turn increases the cleaning success significantly....
Jan 06, 2009 | Steve Stach, Austin America; Harald Wack, Ph.D., Naveen Ravindran, Zestron America; Joachim Becht, Zestron Europe
To prevent malfunctions in high-power electronics, flux residues must be removed from flip chip components prior to subsequent processes. As a result, integrating a suitable cleaning application into the manufacturing process of flip chip components is often required. Solvent based applications have re-emerged, and with that, an overall process solution is necessary....
Nov 14, 2015 | ZESTRON is pleased to announce that Jigar Patel, M.S.Ch.E., Senior Process Engineer, will be presenting at the SMTA/CALCE LED A.R.T Symposium on November 17th.
Nov 04, 2015 | ZESTRON will be exhibiting the latest in pH neutral cleaning solutions at the SMTA Space Coast Expo and Tech Forum.
Nov 01, 2015 | ZESTRON is pleased to announce the addition of Mr. Sean Harvey as the new Regional Sales Manager. In his role, Mr. Harvey will focus on growing ZESTRON’s product and service business while expanding the current customer base in the Western American and Canadian regions.
Oct 21, 2015 | ZESTRON will be exhibiting the latest in pH neutral cleaning solutions at the SMTA Connecticut Expo and Tech Forum.
Oct 12, 2015 | ZESTRON is pleased to announce its newest and seventh facility, located in South Korea.
Oct 07, 2015 | ZESTRON is pleased to announce that the eighth and last installment of ZESTRON Academy's 2015 webinar series, "pH Neutral vs Alkaline Cleaning Agents" will be held on October 22nd, at 1:30 PM EDT.
Oct 05, 2015 | ZESTRON is pleased to announce the standardization of ZESTRON’s products labels and Safety Data Sheets to the United Nations' new Globally Harmonized System of Classification and Labeling of Chemicals (GHS).
Sep 30, 2015 | ZESTRON is pleased to announce that Umut Tosun, M.S.Ch.E., Application Technology Manager, ZESTRON Americas, will present “Impact of Multiple Thermal Cycles on the Cleaning Process” at SMTA International 2015.
Sep 22, 2015 | ZESTRON is pleased to announce that Ravi Parthasarathy, Senior Process Engineer, ZESTRON, will present “Impact of Cleaning Technologies on Lead Frame Packages: The Difference in Wire Bond Yields” at IMAPS’s Advances in Semiconductor Packaging Exhibition on September 24th.
Sep 14, 2015 | ZESTRON is pleased to announce that Jigar Patel, M.S.Ch.E., Senior Process Engineer, ZESTRON Americas, will present “Electronic Assemblies & Devices for the Medical Industry: Cleaning & Material Compatibility Challenges” at the 2015 Medical Electronics Symposium.
Ingolstadt, 85053, Germany
ZESTRON East China
1/F, Building 9,
Zun Xuan Industrial Park, Lane 1199, Ji Di Road, Minhang District,
Shanghai, 201107, China
ZESTRON South China
1A/ Building B6, No. 3009 Guan Guang Rd.
Shenzhen, 518107, China
ZESTRON South Asia
No. 22, Jalan Persiaran 1
Taman Kulim Avenue
Kulim, Kedah, 09000, Malaysia