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MPC® Technology's cleaning properties allow a wide application range and power the complete removal of all contaminants from electronic substrate surfaces.
Headquartered in Manassas, Virginia, and operating in more than 35 countries, ZESTRON is the globally leading provider of high precision cleaning products, services and training solutions for the electronics and semiconductor manufacturing industry.
With 7 worldwide technical centers offering more than 90 cleaning machines from leading international manufacturers and the largest team of engineers focused on high precision cleaning, ZESTRON’s commitment to ensuring that its customers surpass even the most stringent cleaning requirements is without equal.
ZESTRON offers a complete range of true pH neutral, alkaline and engineered solvent process solutions for the aerospace, military, automotive, communications, and medical industries. With cleanliness assessment services onsite, ZESTRON’s Application Engineering team performs in-depth cleanliness assessments consisting of ionic contamination testing, ion chromatography, visual inspection, SIR C3 extraction testing, climatic reliability, and failure analysis.
Offering complete process solutions, ZESTRON Academy provides training on the latest solutions and best practices through webinars, workshops, technical papers, and customized training.
Cleaning questions? ZESTRON has answers.
ZESTRON Americas Postings
Incorporating the ZESTRON® EYE's 3P-Technology, the ZESTRON® EYE CM monitors and controls wash bath concentration in real time. This stand alone concentration management system easily integrates with batch and inline c...
The World’s First Automated Concentration Measurement System For Electronics Cleaning Processes The ZESTRON® EYE consists of a sensor and a controller that can be fully integrated with commonly used cleaning machine types and...
pH neutral cleaning agent for semiconductor applications. HYDRON® SE 220 is a water-based, single-phase cleaning agent specifically developed for use in immersion and ultrasonic processes. HYDRON® SE 220 removes flux residues f...
HYDRON® WS 400, based on the FAST® Technology, is an aqueous based cleaning agent specifically designed to remove water-soluble (OA) flux residues from electronic assemblies and is compatible with sensitive metals. Applied at low concentra...
Water-based, pH-neutral defluxing agent Based on the MPC® Technology, ZESTRON’s latest pH-neutral cleaning agent has been specifically developed for use at low operating concentrations in spray-in-air inline and batch cleanin...
pH Neutral Cleaning Agent for Power Electronic Applications. VIGON® PE 180, based on the MPC® Technology (Micro Phase Cleaning), is a water-based, pH neutral cleaning agent specifically developed for the use in s...
PCB Cleaning Medium with a Mild Formulation Especially for Sensitive Metal Alloys VIGON A 250 is a water-based MPC® cleaning agent designed to remove flux residues and solder pastes from electronic assemblies. Due to its mild formu...
VIGON US is a water-based medium specifically developed for the use in ultrasonic, spray-under-immersion and centrifugal cleaning equipment. Based on MPC Technology, VIGON US removes all types of flux residues from electronic assemblies, ceramic h...
Water-based Cleaning Medium for Reflow and Wave Solder Equipment. Based on the MPC® Technology, VIGON® RC 101 was specifically developed to remove all types of baked-on flux residues from reflow and wave solder equipment. It re...
ATRON® AC 207 is a FAST® Technology-based cleaning agent specifically designed to operate at low concentration levels. The product was developed to improve the cleaning performance and bath life of traditional surfactant-b...
- Cleaning Before Conformal Coating - Online Webinar
Thu, Jun 21, 2018
- Cleaning for Reliability - Overcoming Challenges for Class III Assemblies - Online Webinar
Thu, Jul 26, 2018
- Defluxing Advanced Packages - Online Webinar
Thu, Apr 26, 2018
- DI-water vs Chemistry - Online Webinar
Thu, Oct 25, 2018
- LED Cleaning and Reliability - Online Webinar
Thu, Sep 27, 2018
- Should You Clean PCBs? - Online Webinar
Thu, Mar 22, 2018
- Stencil, Underside Wipe and Misprint Cleaning - Online Webinar
Thu, Aug 30, 2018
- Surface Cleanliness Assessment - Online Webinar
Thu, May 24, 2018
Feb 25, 2016 | Umut Tosun, Jigar Patel, Kalyan Nukula, Fernando Gazcon, ZESTRON America
With regard to precision cleaning applications within electronics manufacturing, pH neutral product development was a major breakthrough in recent years. The impetus for this development resulted from changes with regard to solder paste formulations and resulting assembly processes.
The greater use of lead-free solder paste and the required higher reflow profiles have resulted in even more difficult to remove burnt-in flux residues. Coupled with increases in component density, larger component packages, higher lead counts, finer lead spacing, and lower standoff distances, effective cleaning is greatly challenged. The aqueous alkaline based cleaning agents can effectively remove these flux residues, however, the process often requires an increase in wash temperature and exposure time, chemical concentration, and mechanical energy. Although an efficient and effective cleaning process can be developed, oftentimes, the required operating parameters present a new set of challenges with regard to material compatibility.
Since their introduction, the newly developed pH neutral formulations have proven to be capable not only of removing these difficult post reflow residues from complex board geometries, but do so without affecting material compatibility of sensitive components. Additionally, they perform at low concentration levels. This study reviews the performance of pH neutral cleaning agents as compared to alkaline cleaning agent alternatives and includes field data demonstrating their effectiveness with regard to material compatibility and cleaning performance....
Jun 28, 2011 | ZESTRON
ZESTRON America’s spring edition of ZESTRON News goes back to basics providing the latest information on the topics of cleaning in the electronics manufacturing industry....
Dec 22, 2009 | Dr. Harald Wack, Umut Tosun, M.S.Chem.Eng., Dr. Joachim Becht, Dr. Helmut Schweigart
While most cleaning applications in the North American market rely on cleaning with DI-water only, for removing OA fluxes in first place, recent market studies show that water has reached its limitations in cleaning performance while favoring usage of aqueous processes. The term aqueous implies the use of aqueous-based chemistries with active ingredients and are usually diluted with DI-water. The nature of these active ingredients in the aqueous chemistries varies between manufacturer and his R&D knowledge. ...
Sep 18, 2009 | Harald Wack, Ph.D., Umut Tosun, Naveen Ravindran, Sylvain Chamousset, Joachim Becht, Ph.D.; ZESTRON, Steve Stach, Austin American Technology Corp.
In recent years, various studies have been issued on cleaning under low standoff components; most however, with incomplete information. It is essential to revisit and describe the latest challenges in the market, identifying obvious gaps in available information. Such information is crucial for potential and existing users to fully address the cleanliness levels under their respective components. With the emergence of lead-free soldering and even smaller components, new challenges have arisen including cleaning in gaps of less than 1-mil....
Jul 01, 2009 | Steve Stach, Austin American Technology Harald Wack, Ph.D., Umut Tosun, Naveen Ravindran, ZESTRON America, John M. Radman, Daniel D. Phillips, Trace Laboratories East
During the last 5 years, the processes to remove flux residues especially for lead-free and challenging geometries have demonstrated new cleaning obstacles which have to be overcome.i A new methodology has been recently developed to further increase the propensity for successful cleaning.ii At the core of this method is the thermal identification of the residue matrix. Thermal energy changes the physical state, i.e. transitions between liquid, solid and gas phases. By taking advantage of such specific information during phase transitions, the cleaning process can be tailored to such settings, which in turn increases the cleaning success significantly....
Jan 06, 2009 | Steve Stach, Austin America; Harald Wack, Ph.D., Naveen Ravindran, Zestron America; Joachim Becht, Zestron Europe
To prevent malfunctions in high-power electronics, flux residues must be removed from flip chip components prior to subsequent processes. As a result, integrating a suitable cleaning application into the manufacturing process of flip chip components is often required. Solvent based applications have re-emerged, and with that, an overall process solution is necessary....
Feb 20, 2018 | ZESTRON will have a live demo of VIGON® RC 303, our reflow oven cleaning agent, with our newly developed Pressure Sprayer at IPC APEX 2018.
Feb 14, 2018 | ZESTRON is pleased to announce that Umut Tosun will instruct a professional development course at IPC APEX 2018. “Electronic Assembly Reliability – Meeting the Challenges of Today’s Design” is scheduled during the PD25 session on Thursday, March 1st from 9:00 AM to 12:00 PM.
Feb 12, 2018 | ZESTRON is pleased to announce that Ravi Parthasarathy, M.S.Ch.E., Senior Application Engineer, ZESTRON Americas, will present “Jet Printed Solder Paste and Cleaning Challenges” at the IPC APEX 2018 in San Diego, CA.
Jan 31, 2018 | ZESTRON Academy is pleased to announce the 2018 Cleaning Webinar Series schedule. ZESTRON Academy continues to educate production line operators, manufacturing and quality control managers as well as process engineers by providing detailed industry knowledge and troubleshooting techniques.
Jan 28, 2018 | ZESTRON is pleased to announce that it will feature HYDRON® Technology, their latest innovative cleaning technology at IPC APEX 2018.
Jan 10, 2018 | ZESTRON is pleased to announce that Ravi Parthasarathy, M.S.Ch.E., Senior Application Engineer, ZESTRON Americas, will present “Design for Reliability: Overcoming Present Day Challenges for Class III Assemblies” at the SMTA Space Coast Expo and Tech Forum.
Nov 16, 2017 | ZESTRON will feature our latest cleaning technology, HYDRON® Technology, at the SMTA Silicon Valley Expo and Tech Forum on November 29th.
Nov 10, 2017 | ZESTRON is pleased to feature our oven cleaning maintenance product, VIGON® RC 303, at the SMTA New England Expo on November 16th. Additionally, we will raffle a sample of VIGON® RC 303 cleaning agent complete with our newly developed pressure sprayer during the expo.
Oct 25, 2017 | ZESTRON is pleased to announce it will host the November SMTA Capital Chapter Meeting. Ravi Parthasarathy, M.S.Ch.E., Senior Application Engineer, ZESTRON Americas, will present “Cleaning Before Conformal Coating” and “pH Neutral Cleaning Agents – Market Expectation & Field Performance.” Cleaning Before Conformal Coating - Do you conformally coat your electronic assemblies? If so, cleaning prior to conformal coating is a must to ensure the long-term reliability of your products. This presentation provides an overview of potential failure mechanisms resulting from coating over residues.
Oct 17, 2017 | The SMTA Capital Chapter is pleased to announce that Ravi Parthasarathy, ZESTRON Americas, will present at the third chapter meeting of 2017 on November 7th, scheduled from 5:30 pm to 8:00 pm. Mr. Parthasarathy will present “Cleaning Before Conformal Coating” and “pH Neutral Cleaning Agents - Market Expectation and Field Performance”.