Surface Mount Technology Association (SMTA)

The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.

Association, Non-Profit, Training Provider, Events Organizer

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SMTA International Exhibition 2015 - Electronics Manufacturing

A non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies.

The association is dedicated to the advancement of the electronics industry through member education and interaction. Local chapters are in the U.S., Canada, Mexico, Brazil, India, Israel, Malaysia, Taiwan, and China.

Educational programs, symposia, and seminars are held throughout the year in various locations in the U.S. and Canada. The SMTA produces SMTA International, a major annual conference and exhibition currently held in Rosemont, IL (Late September - Early October).

Surface Mount Technology Association (SMTA) Postings

10 upcoming events »

2 training courses »

571 news releases »

SMTA Capital Expo to Feature Essemtec Fox Pick and Place System

Aug 16, 2017 | The SMTA Capital Chapter is pleased to announce that it will feature a live demo of the Essemtec Fox pick-and-place system at the upcoming expo on Thursday, August 24th.

Shannan O’Shaughnessy, GVD Corporation, to Present at SMTA Capital Chapter’s Expo and Tech Forum on August 24

Aug 14, 2017 | The SMTA Capital Chapter is pleased to announce that Shannan O’Shaughnessy of GVD Corporation, will present “Reliability without Hermeticity: Commercial Vapor Deposited Coatings for High-Frequency RF Micro-Electronics” at the upcoming Capital Expo and Tech Forum at Johns Hopkins University / Applied Physics Lab, Kossiakoff Center, on Thursday, August 24th.

iNEMI’s Bill Bader to Keynote Technical Innovations Symposium at SMTA International

Aug 08, 2017 | SMTA announces that Bill Bader, CEO of iNEMI, will keynote the 2017 Technical Innovations Symposium on Monday, September 18, 2017. The symposium is part of the SMTA International technical conference September 17 - 21, 2017 in Rosemont, Illinois. Bader’s presentation is titled “2017 iNEMI Roadmap Highlights Impacting Board Assembly over the Next 5-10 Years.”

Gerry Partida, Summit Interconnect, to Present at SMTA Capital Chapter’s Expo and Tech Forum on August 24th

Aug 06, 2017 | The SMTA Capital Chapter is pleased to announce that Gerry Partida of Summit Interconnect, will present “Density, Advanced Materials and Cost Drivers Associated with Advanced Circuit Design, Fabrication and Assembly” at the upcoming Capital Expo and Tech Forum at Johns Hopkins University / Applied Physics Lab, Kossiakoff Center, on Thursday, August 24th.

Mike Bixenman, KYZEN Corporation, Wins Best of Presentation Award at the 2017 International Conference on Soldering and Reliability (ICSR)

Aug 01, 2017 | The SMTA is pleased to announce that Mike Bixenman, DBA, KYZEN Corporation was selected to win the “Best of Presentation” Award at the 2017 International Conference on Soldering and Reliability (ICSR) for his presentation “Reliable Microelectronic Assembly Process Design Test Methods – A Non-Standard Approach.” The award is determined through the evaluations of those that attended the presentation.

Phil Zarrow, ITM Consulting, to Present at SMTA Capital Chapter’s Expo and Tech Forum on August 24th

Aug 01, 2017 | The SMTA Capital Chapter is pleased to announce that Phil Zarrow of ITM Consulting, will present “The ‘Deadly Sins’ of SMT Assembly” at the upcoming Capital Expo and Tech Forum at Johns Hopkins University / Applied Physics Lab, Kossiakoff Center, on Thursday, August 24th.

International Wafer-Level Packaging Conference (IWLPC) Keynote Presenters Announced

Jul 27, 2017 | The SMTA and Chip Scale Review are pleased to announce the Keynote Presenters for the 14th annual International Wafer-Level Packaging Conference. The IWLPC will be held October 24-26, 2017 at the DoubleTree by Hilton Hotel in San Jose, California.

SMTA Welcomes New Board Members

Jul 23, 2017 | The SMTA is pleased to announce its election results for the Board of Directors for the term beginning during SMTA International (September 17 - 21, 2017). Bill Capen, DRS Technologies, and Greg Vance, Rockwell Automation, were elected to the Strategic Planning Committee. Debbie Carboni, KYZEN Corporation, was re-elected as VP Expos.

SMTA International Technical Program Expands, Includes Research from HDPUG and AREA Consortium

Jul 23, 2017 | SMTA announces an expanded program for the final day of the SMTA International Conference, September 17 - 21, 2017 in Rosemont, Illinois. In addition to the Lead-Free Symposium, the technical committee expanded the Thursday program to four concurrent tracks. The three additional tracks will focus on Advanced Packaging Technology, Manufacturing Excellence, and Inspection Technologies.

International Wafer-Level Packaging Conference (IWLPC) Program Announced and Registration Now Open

Jul 19, 2017 | The SMTA and Chip Scale Review are pleased to announce the program for the 14th annual International Wafer-Level Packaging Conference. The IWLPC will be held October 24-26, 2017 at the DoubleTree by Hilton Hotel in San Jose, California.

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