Electronics Manufacturing Technical Articles

Jun 13, 2013

Wei Yao, Cemal Basaran

Electromigration (EM) is a mass transportation mechanism driven by electron wind force, thermal gradient, chemical potential and stress gradient. According to Moore’s law, number of transistors on integrated circuits (ICs) doubles approximately every 2 years. Moore’s law holds true since its introduction in 1970s. This insatiable demand for smaller ICs size, larger integration and higher Input/Output (IO) count of microelectronics has made ball grid array (BGA) the most promising connection type in electronic packaging industry. This trend, however, renders EM reliability of solders joints a major bottleneck to hinder further development of electronics industry......

Jun 13, 2013

grandtop haron

pcb,pcb assembly,pcb boards,pcb design,pc boards,printed circuit board PCBA GT-005 Shenzhen grandtop electrical co., ltd was established in 2005, takes over an area of 4000 square meters,is a manufacture specialized in SMT and DIP processing. It is well-equipped in both production and inspection. Our products are widely used in industrial equipments,communication apparatus,automobile electronics,computers, medical devices and network devices Our production lines as below SMT LINES 4 DIP LINES 3 WELDING REPAIRING LINES 2 ASSEMBLY LINES 2 TESTING LINES 2 PACKING LINES 2 OUR QUALITY GOAL-- customer orientation, quality first, strive for perfection, insist on improving! ...

Jun 05, 2013

Ed Briggs and Ronald C. Lasky, Ph.D., PE.

The combination of higher lead-free process temperatures, smaller print deposits, and temperature restraints on electrical components has created difficult challenges in optimizing the reflow process. Not only are the electronic components and the PWB at risk, but the ability to achieve a robust solder joint becomes difficult, especially if the PCB is thermally massive. In addition, the constant miniaturization of electronic components, hence smaller solder paste deposits, may require the use of smaller particle-sized powders (...) This paper is a summary of best practices in optimizing the reflow process to meet these challenges of higher reflow temperatures, smaller print deposits, decreased powder particle size, and their affect on the reflow process....

Jun 05, 2013

Rob Boyd, Crimping Product Manager

Quality standards are getting tougher each year. In these difficult times, wire harness manufacturers are looking to expand business in their existing markets and are looking for new markets. The following article will compare and contrast the current quality standards that are most commonly used today. It will review proper measurement techniques, discuss some trends in crimp quality, and address methods to improve efficiency in quality data collection....

May 30, 2013

Michael Haller, Volker Rößiger, Simone Dill

This paper covers the following topics: The Measurement Application, Measurement Requirements, Measurement Problems, Measurement Results, Reference Samples, Conclusions ...

May 23, 2013

Daniel Gamota

Printed Electronics is considered by many international technologists to be a platform for manufacturing innovation. Its rich portfolio of advanced multi-functional nano-designed materials, scalable ambient processes, and high volume manufacturing technologies lends itself to offer an opportunity for sustained manufacturing innovation. The success of introducing a new manufacturing technology is strongly dependent on the ability to achieve high final product yields at current or reduced cost. In the past, standards have been the critical vehicles to enable manufacturing success... First published in the 2012 IPC APEX EXPO technical conference proceedings....

May 16, 2013

John Davignon, iNEMI Chair

In response to a growing concern within the Electronic Industry to the transition to Halogen-Free laminates (HFR-Free) within the Client Market space (Desktop and Notebook computers) iNEMI initiated a HFR-Free Leadership Workgroup to evaluate the readiness of the Industry to make this transition. The HFR-Free Leadership WG concluded that the electronic industry is ready for the transition and that the key electrical and thermo-mechanical properties of the new HFR-Free laminates can meet the required criteria. The HFR-Free Leadership WG verified that the laminate suppliers can meet the capacity demands for these new HFR-Free laminates and developed a "Test Suite Methodology" (TSM) that can facilitate the comparison and choice of the right laminate to replace brominated FR4 in the Client space... First published in the 2012 IPC APEX EXPO technical conference proceedings....

May 10, 2013

Paul Groome

In today’s manufacturing environments, optimizing manufacturing costs and, especially Test and Inspection costs are high on most company’s agendas. Resources are tight and many employees have multiple roles to fulfill across the whole manufacturing line so, time is limited. Test suppliers need to provide a suite of tools to ensure the highest level of quality for customer shipments. ...

May 09, 2013

Bo Song, Michael H. Azarian and Michael G. Pecht

Atmospheric dust consists of solids suspended in air. Dust is well known for its complex nature. It normally includes inorganic mineral materials, water soluble salts, organic materials, and a small amount of water. The impact of dust on the reliability of printed circuit board assemblies (PCBAs) is ever-growing, driven by the miniaturization of technology and the increasing un-controlled operating conditions with more dust exposure in telecom and information industries... First published in the 2012 IPC APEX EXPO technical conference proceedings....

May 02, 2013

Don Banfield

Summary of some new and existing technologies for printed electronics outside of traditional membrane switch manufacturing. Discussion of requirements for understanding the technology of these applications in order to capitalize on them... First published in the 2012 IPC APEX EXPO technical conference proceedings....