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684 SMT / PCB Technical Articles. Show: per page.

Technical Library articles

Digital manufacturing for traceability: The way to higher product quality and better warranty management

Published:

Aug 26, 2010

Author:

Siemens PLM Software

Company:

Siemens Electronics Assembly Systems Inc.

Abstract:

Driven by high-profile regulations compliance like the TREAD Act, warranty management has become a hot topic across industries worldwide....

Implementation challenges for PCB tracking using RFID

Published:

Aug 26, 2010

Author:

Murata

Company:

Murata Electronics

Abstract:

Radio frequency identification (RFID) ICs are a popular alternative to barcodes for PCB tracking applications. This article outlines some of the challenges that may be encountered when implementing an RFID system...

AdvancedCMT vs. Pressfit. The advantages of the Compression Mount Technology (CMT) when using AdvancedTCA and MicroTCA connectors.

Published:

Aug 26, 2010

Author:

CODICO GmbH, Yamaichi Electronics

Company:

Yamaichi Electronics

Abstract:

The advantages of the Compression Mount Technology (CMT) when using AdvancedTCA and MicroTCA connectors....

Challenges of Lead-Free Low Silver Content End Termination Pastes for Inductor Applications

Published:

Aug 19, 2010

Author:

Dong Zhang, Meg Tredinnick, Mark Challingsworth

Company:

Heraeus

Abstract:

The silver end termination plays an important role for multilayer chip inductors. A basic requirement is to achieve excellent electrical properties with superior adhesion to the chip. Driven by the increasing price of silver, interest has been shown to ...

Realistic Implementation of Signal Integrity Screening – Guidelines for PCB Designers

Published:

Aug 19, 2010

Author:

Griff Derryberry

Company:

Zuken

Abstract:

This article looks at each of the roles of the engineer and PCB designer, considers the traditional design process, and makes suggestions on how the designer can contribute significantly to improving a design’s overall signal integrity while simultaneousl...

PWB Manufacturing Variability Effects on High Speed SerDes Links: Statistical Insights from Thousands of 4-Port SParameter Measurements

Published:

Aug 05, 2010

Author:

Bart O. McCoy, Robert Techentin, Benjamin Buhrow, Kevin Buchs, Dr. Barry K. Gilbert, Dr. Erik S. Daniel, How Lin

Company:

Endicott Interconnect Technologies

Abstract:

Variability analysis is important in successfully deploying multi-gigabit backplane printed wiring boards (PWBs) with growing numbers of high-speed SerDes links. We discuss the need for large sample sizes to obtain accurate variability estimates of SI me...

01005 Production Goes Industry Wide

Published:

Jul 29, 2010

Author:

Satoshi Kataoka, Eric Klaver

Company:

Assembl�on Netherlands B.V.

Abstract:

The introduction of the 01005 chip components in 2004 was a challenge to the whole electronics equipment assembly industry. The components’ miniature size made them difficult to see, let alone place reliably with high accuracy. Designers were reluctant to...

THT in-line Inspection: Contradiction or greater Efficiency?

Published:

Jul 22, 2010

Author:

Jens Kokott

Company:

GOEPEL electronic

Abstract:

The utilisation of Automated Optical Inspection systems has become an integral part in quality assurance of electronic assemblies. Depending on batch size and product mixture, AOI systems as Inline integration or as a stand-alone solution benefit efficien...

A New Stenciling Method for Reworking SMT Components

Published:

Jul 15, 2010

Author:

Bob Wettermann

Company:

BEST Inc

Abstract:

When reworking more complex SMT components such as finer pitch SMT components, SMTconnectors and even area array devices, the most common method of printing on the printing selectively on the PCB has some serious shortcomings. The most significant problem...

Effect of Soldering Parameters on Reaction Kinetics and Phase Transformations of SAC 305 Solder

Published:

Jul 08, 2010

Author:

T. Ryno, A. Kelley, J. Metzger, D. Medlin, C. Voyles, S. Richards

Company:

Radiance Technologies

Abstract:

As technology becomes increasingly reliant on electronics, understanding the reliability of lead-free solder also becomes increasingly important. This research project focused on phase transformation kinetics with the lead-free solder SAC 305. Today in ...

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684 SMT / PCB Technical Articles. Show: per page.







 
 
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