Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.


  • Europlacer SMT Pick & Place Machines
  • Reflow Ovens
  • Precision, fluid dispensing systems for low volume, high mix, R&D, and high volume 24x7 production
  • Electronics manufacturing training materials - IPC, solder
  • PCB Rework Tools
846 SMT / PCB Technical Articles

Global Frequency Converters Market Report 2016-2023

May 30, 2017 | DecisionDatabases

DecisionDatabases.com offers Frequency Converters Market Research Report provide trends and future prospects for each application in terms of market size, share, trend, growth and forecast period 2016-2023. The report on global frequency converters market evaluates the growth trends of the industry through historical study and estimates future prospects based on comprehensive research. The report extensively provides the market share, growth, trends and forecasts for the period 2016-2023. The market size in terms of revenue (USD MN) is calculated for the study period along with the details of the factors affecting the market growth (drivers and restraints).

The Elevating price of electricity and Changing trends in infrastructure are the major factors pushing the market uphill. But Electricity Standards might restraint the growth in the coming years.

Download Free Sample Copy Of this Report : http://www.decisiondatabases.com/contact/download-sample-17054

The comprehensive value chain analysis of the market will assist in attaining better product differentiation, along with detailed understanding of the core competency of each activity involved. The market attractiveness analysis provided in the report aptly measures the potential value of the market providing business strategists with the latest growth opportunities.

The report also covers the complete competitive landscape of the worldwide market with company profiles of key players such as ABB Ltd., Aelco, Aplab Ltd., Avionic Instruments LLC, Danfoss A/S, General Electric Company, Georator Corporation, KGS Electronics, Magnus Power NR Electric, Piller GmbH, Power System & Control, Siemens AG and Sinepower. Geographically, the Frequency Converters market has been segmented into regions such as North America, Europe, Asia Pacific, Latin America, Middle East & Africa. The study details country-level aspects based on each segment and gives estimates in terms of market size.

...

Glue Applied Label Market Report 2016-2023

May 30, 2017 | DecisionDatabases

Research Report on Glue Applied Label Market upto 2023 added by DecisionDatabases.com studies the current industry developments analysis and upcoming market size, share, demand, trend, growth and forecast. The report on global glue applied label market evaluates the growth trends of the industry through historical study and estimates future prospects based on comprehensive research. The report extensively provides the market share, growth, trends and forecasts for the period 2016-2023. The market size in terms of volume (square meters) and revenue (USD MN) is calculated for the study period along with the details of the factors affecting the market growth (drivers and restraints).

The major market drivers are Wide adoption of small-sized PET bottles and Increasing demand for esthetically-appealing products. The market growth might be restricted due High capital investment under the study period.

Download Free Sample Copy Of this Report : http://www.decisiondatabases.com/contact/download-sample-17041

The comprehensive value chain analysis of the market will assist in attaining better product differentiation, along with detailed understanding of the core competency of each activity involved. The market attractiveness analysis provided in the report aptly measures the potential value of the market providing business strategists with the latest growth opportunities.

The report also covers the complete competitive landscape of the worldwide market with company profiles of key players such as Americk Packaging, CCL Industries Corp., Constantia Flexibles, Darley Limited, Films Americas LLC, Fort Dearborn Company, Huhtamäki Oyj, Inland packaging, Multi-Color Corp., Tapp Label Company, Töpfer Kulmbach GmbH, WestRock Company and WS Packaging. Geographically, the Glue Applied Label market has been segmented into regions such as North America, Europe, Asia Pacific And Rest of the World. The study details country-level aspects based on each segment and gives estimates in terms of market size.

The report classifies the market into different segments based on end-user. These segments are studied in detail incorporating the market estimates and forecasts at regional and country level. The segment analysis is useful in understanding the growth areas and probable opportunities of the market.

...

Vacuum Pouches Market growth drivers & Challenges by 2024

May 30, 2017 | Global Market Insights, Inc.

A new report covers Vacuum Pouches Market outlook, growth drivers providing historical facts, current status and future development trends information along with data on leading players and regions. Vacuum Pouches Market finds application in several end-user industries such as food & beverage, consumer goods, industrial goods and pharmaceuticals. The product is generally used to preserve and protect fresh food and minimize the risk of its spoilage. https://www.gminsights.com/industry-analysis/vacuum-pouches-market...

Vacuum Pouches Market growth drivers & Challenges by 2024

May 30, 2017 | Global Market Insights, Inc.

A new report covers Vacuum Pouches Market outlook, growth drivers providing historical facts, current status and future development trends information along with data on leading players and regions. Vacuum Pouches Market finds application in several end-user industries such as food & beverage, consumer goods, industrial goods and pharmaceuticals. The product is generally used to preserve and protect fresh food and minimize the risk of its spoilage. https://www.gminsights.com/industry-analysis/vacuum-pouches-market...

Agricultural Robots Market Report and Forecast Upto 2023

May 30, 2017 | DecisionDatabases

DecisionDatabases.com offers Agricultural Robots Market Research Report provide trends and future prospects for each application in terms of market size, share, trend, growth and forecast period 2016-2023. The report on global Agricultural Robots market evaluates the growth trends of the industry through historical study and estimates future prospects based on comprehensive research. The report extensively provides the market share, growth, trends and forecasts for the period 2016-2023. The market size in terms of revenue (USD MN) is calculated for the study period along with the details of the factors affecting the market growth (drivers and restraints).

The Increasing demand for food and Technological advancement are the major factors pushing the market uphill. But Need of high capital investment might restraint the growth in the coming years.

Download Free Sample Copy Of this Report : http://www.decisiondatabases.com/contact/download-sample-17037

The comprehensive value chain analysis of the market will assist in attaining better product differentiation, along with detailed understanding of the core competency of each activity involved. The market attractiveness analysis provided in the report aptly measures the potential value of the market providing business strategists with the latest growth opportunities.

The report also covers the complete competitive landscape of the worldwide market with company profiles of key players such as AGCO Corporation, AgEagle Aerial Systems, Inc., Agribotix LLC, Blue River Technology, Inc., BouMatic Robotics BV, Harvest Automation, Inc., Naio Technology, PrecisionHawk, Inc., SenseFly SA and Vision Robotics Corporation. Geographically, the Agricultural Robots market has been segmented into regions such as North America, Europe, Asia Pacific, Latin America, Middle East & Africa. The study details country-level aspects based on each segment and gives estimates in terms of market size.

...

Endoscopic Vessel Harvesting Systems Market Report 2016-2023

May 30, 2017 | DecisionDatabases

The Endoscopic Vessel Harvesting Systems Market Research Report provides value chain analysis on the revenue for the forecast period 2016-2023 and estimates for each application in terms of market size, share, trend and growth. The report on global endoscopic vessel harvesting systems market evaluates the growth trends of the industry through historical study and estimates future prospects based on comprehensive research. The report extensively provides the market share, growth, trends and forecasts for the period 2016-2023. The market size in terms of revenue (USD MN) is calculated for the study period along with the details of the factors affecting the market growth (drivers and restraints).

The major market drivers are Increasing government's investments and Advancement in technology and innovation in the cardiovascular medical devices. The market growth might be restricted due High adoption rate of EVH systems in CABG surgeries under the study period.

Download Free Sample Copy Of this Report : http://www.decisiondatabases.com/contact/download-sample-17039

The comprehensive value chain analysis of the market will assist in attaining better product differentiation, along with detailed understanding of the core competency of each activity involved. The market attractiveness analysis provided in the report aptly measures the potential value of the market providing business strategists with the latest growth opportunities.

The report also covers the complete competitive landscape of the worldwide market with company profiles of key players such as CARDIO MEDICAL GmbH, LivaNova plc. (Sorin and Cyberonics), MAQUET Holding B.V. & Co. KG, Med Europe S.r.l. (Elite Life Care), Saphena Medical, Inc. and Terumo Cardiovascular Group. Geographically, the Endoscopic Vessel Harvesting Systems market has been segmented into regions such as North America, Europe, Asia Pacific, Latin America, Middle East & Africa. The study details country-level aspects based on each segment and gives estimates in terms of market size.

The report classifies the market into different segments based on product. These segments are studied in detail incorporating the market estimates and forecasts at regional and country level. The segment analysis is useful in understanding the growth areas and probable opportunities of the market.

...

Food Robotics Market Report 2016-2023

May 30, 2017 | DecisionDatabases

Research Report on Food Robotics Market upto 2023 added by DecisionDatabases.com studies the current industry developments analysis and upcoming market size, share, demand, trend, growth and forecast. The report on global food robotics market evaluates the growth trends of the industry through historical study and estimates future prospects based on comprehensive research. The report extensively provides the market share, growth, trends and forecasts for the period 2016-2023. The market size in terms of revenue (USD MN) is calculated for the study period along with the details of the factors affecting the market growth (drivers and restraints).

The Rising demand for packaged food and Increasing number of food safety regulations are the major factors pushing the market uphill. But Lack of trained professionals might restraint the growth in the coming years.

Download Free Sample Copy Of this Report : http://www.decisiondatabases.com/contact/download-sample-17038

The comprehensive value chain analysis of the market will assist in attaining better product differentiation, along with detailed understanding of the core competency of each activity involved. The market attractiveness analysis provided in the report aptly measures the potential value of the market providing business strategists with the latest growth opportunities.

The report also covers the complete competitive landscape of the worldwide market with company profiles of key players such as ABB Group, Bastian Solutions Inc., Fanuc Corporation, Kawasaki Heavy Industries Ltd., Kuka AG, Mayekawa MFG. Co., Ltd., Mitsubishi Electric Corporation, Rockwell Automation Incorporated, Seiko Epson Corporation, Staubli International AG, Universal Robotics A/S and Yaskawa Electric Corporation. Geographically, the Food Robotics market has been segmented into regions such as North America, Europe, Asia Pacific And Rest of the World. The study details country-level aspects based on each segment and gives estimates in terms of market size.

...

Global Automotive Ambient Lighting Market Report 2016-2023

May 30, 2017 | DecisionDatabases

Research Report on Automotive Ambient Lighting Market upto 2023 added by DecisionDatabases.com studies the current industry developments analysis and upcoming market size, share, demand, trend, growth and forecast. The report on global automotive ambient lighting market evaluates the growth trends of the industry through historical study and estimates future prospects based on comprehensive research. The report extensively provides the market share, growth, trends and forecasts for the period 2016-2023. The market size in terms of revenue (USD MN) is calculated for the study period along with the details of the factors affecting the market growth (drivers and restraints).

The major market drivers are Demand for driving. The market growth might be restricted due Distraction to drivers under the study period.

Download Free Sample Copy Of this Report : http://www.decisiondatabases.com/contact/download-sample-17055

The comprehensive value chain analysis of the market will assist in attaining better product differentiation, along with detailed understanding of the core competency of each activity involved. The market attractiveness analysis provided in the report aptly measures the potential value of the market providing business strategists with the latest growth opportunities.

The report also covers the complete competitive landscape of the worldwide market with company profiles of key players such as Hella, Hueck, Ichikoh Industries, Koito Manufacturing, Magneti MareLli, Stanley Electric, Valeo and ZIZALA Lichtsysteme. Geographically, the Automotive Ambient Lighting market has been segmented into regions such as North America, Europe, Asia Pacific, Latin America, Middle East & Africa. The study details country-level aspects based on each segment and gives estimates in terms of market size.

...

Calcium Phosphate industry analysis research and trends report for 2017-2024

May 30, 2017 | Global Market insights, INC

The Calcium Phosphate Market trends are analyzed from recent past with an eye on coming years in this report that also offers projections for Calcium Phosphate industry targeted at helping in business decisions....

Calcium Phosphate industry analysis research and trends report for 2017-2024

May 30, 2017 | Global Market Insights, INC

The latest Calcium Phosphate Market analysis and research report talks about major applications of Zinc Oxide growth of these segments as well as offers insights into companies active in this industry and their information...

Strapping Market Report | Industry Growth, Trends and Forecasts, 2016 to 2023

May 30, 2017 | DecisionDatabases

Research Report on Strapping Market upto 2023 added by DecisionDatabases.com studies the current industry developments analysis and upcoming market size, share, demand, trend, growth and forecast. The report on global strapping market evaluates the growth trends of the industry through historical study and estimates future prospects based on comprehensive research. The report extensively provides the market share, growth, trends and forecasts for the period 2016-2023. The market size in terms of revenue (USD MN) is calculated for the study period along with the details of the factors affecting the market growth (drivers and restraints).

The major market drivers are Robust demand from shipping and packaging industry. The market growth might be restricted due Unstable cost of raw material under the study period 2016-2023.

Download Free Sample Copy Of this Report : http://www.decisiondatabases.com/contact/download-sample-17053

The comprehensive value chain analysis of the market will assist in attaining better product differentiation, along with detailed understanding of the core competency of each activity involved. The market attractiveness analysis provided in the report aptly measures the potential value of the market providing business strategists with the latest growth opportunities.

The report also covers the complete competitive landscape of the worldwide market with company profiles of key players such as Anshan Falan Company Limited, Baosteel Co., Ltd., Bhushan Steel Ltd., Cordstrap, EAM-Mosca Corporation, Fromm Group, Hangzhou Youngsun Intelligent Equipment Co., Ltd., M. J. Maillis Group, Polychem Corporation, Scientex Berhad, Signode Packaging Systems and Others.
The report classifies the market into different segments based on product type and application. These segments are studied in detail incorporating the market estimates and forecasts at regional and country level. The segment analysis is useful in understanding the growth areas and probable opportunities of the market.

Geographically, the Strapping market has been segmented into regions such as North America, Europe, Asia Pacific, Latin America, Middle East & Africa. The study details country-level aspects based on each segment and gives estimates in terms of market size.

...

The Hydrazine Hydrate Market growth outlook with industry review and forecasts

May 30, 2017 | global market insights

This Hydrazine Hydrate Market report is an exhaustive research on companies active in Fatty Acids sector, its applications, products, end-users, trends and predictions on how the market will grow in coming years....

Acetophenone Market report for 2017-2024 – companies, applications, products and more

May 30, 2017 | Global Market Insights, INC

This Acetophenone Market report is an exhaustive research on companies active in XYZ sector, its applications, products, end-users, trends and predictions on how the market will grow in coming years....

Smart Vending Machines Market Report - Industry Growth, Trends and Forecast Upto 2023

May 30, 2017 | DecisionDatabases

DecisionDatabases.com offers Smart Vending Machines Market Research Report provide trends and future prospects for each application in terms of market size, share, trend, growth and forecast period 2016-2023. The report on global smart vending machines market evaluates the growth trends of the industry through historical study and estimates future prospects based on comprehensive research. The report extensively provides the market share, growth, trends and forecasts for the period 2016-2023. The market size in terms of volume (Thousand Units) and revenue (USD MN) is calculated for the study period along with the details of the factors affecting the market growth (drivers and restraints).

The Developing preference of cashless payments and Rising demand of energy efficient vending machines are the major factors pushing the market uphill. But Stringent government regulations might restraint the growth in the coming years.

Get Free Report Sample @ http://www.decisiondatabases.com/contact/download-sample-17052

Geographically, the Smart Vending Machines market has been segmented into regions such as North America, Europe, Asia Pacific, Latin America, Middle East & Africa. The study details country-level aspects based on each segment and gives estimates in terms of market size.

Purchase Complete Global Smart Vending Machines Market Research Report At: http://www.decisiondatabases.com/contact/buy-now-17052

About Us:

...

Global Market review of Marine Propulsion Engine - Forecasts to 2024

May 30, 2017 | Global Market Insights

Get More Information @ http://bit.ly/2dk76gE Rising emphasis on increasing diesel engine capacity to drive new generation tankers with large cargo holding capability will propel global marine propulsion engine market share. ...

Steel Cords Market growth drivers & Challenges by 2024

May 30, 2017 | Global Market Insights, Inc.

Drivers of Steel Cords Market growth including regional trends, factors driving multiple segments of Steel Cords industry and companies vying for a pie of the market share and size are discussed at length in this new report by Global Market Insights, Inc. Global Market Insights has full Price report titled “Steel Cords Market Size, Industry Analysis Report, Regional Outlook (U.S., Canada, Germany, UK, France, Italy, Russia, China, India, Japan, Malaysia, Thailand, Indonesia, Australia, Brazil, Saudi Arabia, UAE, South Africa), Application Development Potential, Price Trends, Competitive Market Share & Forecast, 2016 – 2024”....

APAC to significantly drive Construction Chemicals Market growth over 2016-2024

May 30, 2017 | global market insights

Asia Pacific construction chemicals market size, worth USD 14 billion in 2015, is forecast to grow at a rate of 9% over the coming seven years. ...

Marine Diesel Engines Market drivers of growth analyzed in a new research report by 2024

May 30, 2017 | Global Market Insights

Get more information @ http://bit.ly/2cPwY1H U.S. marine diesel engines market share is predicted to witness gain over 4% owing to increasing investments toward shipbuilding across the region. ...

Model for Improvement of Fluxing Process on Selective Soldering Machines

May 25, 2017 | Goran Tasevski, Elena Papazoska

Purpose of this research is to identify the factors that directly influence the effectiveness of the fluxing process in selective soldering machines, using the design of experiment methodology with associated factors and levels used in the experiment. Final findings gives directions for set up of the optimal fluxing parameters that will enable appropriate flux appliance and to gain reduction of soldering quality issues which foundations are from this process....

Publisher: Visteon Electronics

Visteon Electronics

Visteon designs, engineers and manufactures vehicle cockpit electronics products and connected car solutions that deliver a rich, connected experience for drivers and passengers.

Van Buren Charter Township, Michigan, USA

Other

The First Reed Switch Auto Insertion Machine in the World hits the Market

May 21, 2017 | Denise Anderson-Rivas

Reed Switches, or Herkons, are extremely useful for many electronic applications. Reed Switches work by means of magnetism in reed relays and for electrical circuit control. In the presence of a magnetic field the reed will either open or close, depending on it's original positioning and purpose. They are extremely useful as they are hermetically sealed and can operate in almost any environment.

Reed Switch insertion into PCBs have historically been conducted by means of manual labor, by hand. As Auto Insertion mechanisms have advanced, there are new technologies on the market that can accommodate these highly useful switches via automated machines. Through Hole Technologies (THT) have advanced to now offer mechanized equipment to automate an assembly line that requires Reed Switch insertion. The first ever Reed Switch Machine is now available on the market for production assembly and auto insertion uses. This will make electronic products requiring Reed Switches easier to produce, faster, and more affordable for an entire manufacturing production. ...

Publisher: Shenzhen Southern Machinery Sales and Service Co., Ltd

Shenzhen Southern Machinery Sales and Service Co., Ltd

to provide you with guidance from the AI PCB design(DFM),AI process(NPI) to import equipment installation and auto insertion technology(THT) training, machine trouble shooting/upgrade/overhaul.

Shenzhen, China

Manufacturer of Assembly Equipment, Manufacturer of Assembled PCBs, Design, Equipment Dealer / Broker, Service Provider

How to Use the Right Flux for the Selective Soldering Application

May 17, 2017 | Bruno Tolla Ph.D, Denis Jean, Xiang Wei Ph.D

The selective soldering application requires a combination of performance attributes that traditional liquid fluxes designed for wave soldering applications cannot fulfill. First, the flux deposition on the board needs to be carefully controlled. Proper fine tuning of the flux physicochemical characteristics combined with a process optimization are mandatory to strike the right balance between solderability and reliability. However, localization of the flux residue through the drop jet process is not enough to guarantee the expected performance level. The flux needs to be designed to minimize the impact of unavoidable spreading and splashing events.

From this perspective a fundamental understanding of the relationships between formulation and reliability is critical. In this application, thermal history of the flux residues (from room temperature to solder liquidus) is a key performance driver. Finally, it is necessary to conduct statistically designed experiments on industrial selective soldering machines in order to map the relationships between flux characteristics and selective process friendliness....

Publisher: Kester

Kester

A leading global supplier of assembly materials to the electronic assembly, component and microelectronic marketplaces.

Itasca, Illinois, USA

Manufacturer of Assembly Material, Soldering

Privacy Threats through Ultrasonic Side Channels on Mobile Devices

May 11, 2017 | Daniel Arp, Erwin Quiring, Christian Wressnegger and Konrad Rieck

Device tracking is a serious threat to the privacy of users, as it enables spying on their habits and activities. A recent practice embeds ultrasonic beacons in audio and tracks them using the microphone of mobile devices.

In this paper, we explore the capabilities, the current prevalence and technical limitations of this new tracking technique based on three commercial tracking solutions. To this end, we develop detection approaches for ultrasonic beacons and Android applications capable of processing these....

Publisher: Technical University Braunschweig

Technical University Braunschweig

The TU Braunschweig is the oldest institute of technology in Germany. It was founded in 1745 as Collegium Carolinum and is a member of TU9, an incorporated society of the most renowned and largest Ger

Brunswick, Germany

School

Development of a Consistent and Reliable Thermal Conductivity Measurement Method, Adapted to Typical Composite Materials Used in the PCB Industry

May 04, 2017 | François Lechleiter; Cimulec, Yves Jannot; Université de Lorraine

Most of today's printed circuit board base materials are anisotropic and it is not possible to use a simple method to measure thermal conductivity along the different axis, especially when a good accuracy is expected. Few base material suppliers' datasheet show X, Y and Z thermal conductivities. In most cases, a single value is given, moreover determined with a generic methodology, and not necessarily adapted to the reality of glass-reinforced composites with a strong anisotropy.

After reminding of the fundamentals in thermal science, this paper gives an overview of the state-of the art in terms of thermal conductivity measurement on PCB base materials, and some typical values. It finally proposes an innovative method called transient fin method, and associated test sample, to perform reliable and consistent in plane thermal conductivity measurement on anisotropic PCB base materials....

Publisher: CIMULEC

CIMULEC

Manufacturer of printed circuit boards for adapted technological and innovative solutions

Ennery, France

Manufacturer of Assembled PCBs

Industry 4.0 in USA: Risk

Apr 28, 2017 | Don Fitchett

A major drawback to Industry 4.0 that few write about is maintenance of an industry 4.0 plant. The maintenance aspect is a much greater and immediate drawback than even the commonly known major concern of security, and the lesser concern of system integration standards. Maintenance of 4.0 systems has, and will continue to result in related huge increases in process downtime. The barriers to overcoming the maintenance/downtime drawbacks of a 4.0 system are almost insurmountable. Has the Smart Manufacturing Leadership Coalition (SMLC) addressed the maintenance paradox? “... model also demands the ability to calculate and manage risk and uncertainty within very different operating structures. ..” Continue reading in pdf or for even more see and share http://bin95.com/Industry40inUSA.htm ...

1 comments.

Publisher: Business Industrial Network

Business Industrial Network

Offers training software and videos. Also on site training and seminars that qualify for CEUs to maintenance, engineering and management professionals.

St. Louis, Missouri, USA

Consultant, Publication or Online Resource, Service Provider, Software Manufacturer, Training Provider

Material Effects of Laser Energy When Processing Circuit Board Substrates during Depaneling

Apr 27, 2017 | Ahne Oosterhof, Eastwood Consulting

Using modern laser systems for the depanelization of circuit boards can create some challenges for the production engineer when it is compared to traditional mechanical singulation methods. Understanding the effects of the laser energy to the substrate material properly is essential in order to take advantage of the technology without creating unintended side effects.

This paper presents an in-depth analysis of the various laser system operating parameters that were performed to determine the resulting substrate material temperature changes. A theoretical model was developed and compared to actual measurements. The investigation includes how the temperature increase resulting from laser energy during depaneling affects the properties of the PCB substrate, which varies from no measurable change to a lowering of the surface resistance of the cut wall depending on the cutting parameters....

Publisher: LPKF Laser & Electronics

LPKF Laser & Electronics

With its broad product range LPKF is one of the world market leaders in the "in-house rapid PCB prototyping" and "StencilLaser" services

Tualatin, Oregon, USA

Manufacturer of Assembly Equipment, Drilling/Routing

A Guide to Successful Printed Circuit Board Documentation

Apr 24, 2017 | Tuan Tran

The process of taking a design from schematic to actual working prototype is a complex one, however, and proper documentation is the best way to simplify it....

Publisher: Power Design Services

Power Design Services

Power Design Service's quick turn and hands-on customer service provides best-in-class printed circuit board, PCB, flex circuit and prototype design, fabrication, and assembly for your business.

San Jose, California, USA

Contract Manufacturer

IST AG - Focus on Flow Sensors

Apr 20, 2017 | Innovative Sensor Technology

IST AG thin film mass flow sensors offer solutions for a wide variety of flow applications. The thin film and membrane technologies incorporate highly accurate temperature sensors and heaters as core elements of the sensors. IST AGs flow sensors are applicable in gas (liquids upon request), have an operating temperature range of -30 °C to +450 °C, and can measure low rate and direction from 0.0001 m/s (microflowSens) to 100 m/s (respectively from 1 mL/min to 10 L/min). In addition to measuring flow rates, our sensors can detect the presence of a liquid, biofilm or bubbles as well as indicate liquid level. Development channels guarantee the best possible adaptation of our sensors, whether in terms of dynamic range, response time, directional detection or ambient conditions. ...

Publisher: Innovative Sensor Technology USA Division

Innovative Sensor Technology USA Division

Innovative Sensor Technology is a manufacturer of thin-film platinum and nickel RTD temperature sensors, capacitive humidity sensors, mass flow sensors, conductivity and biosensors.

Las Vegas, Nevada, USA

Manufacturer of Components

High Throw Electroless Copper - Enabling new Opportunities for IC Substrates and HDI Manufacturing

Apr 20, 2017 | Tobias Sponholz, Lars-Eric Pribyl, Frank Brüning, Robin Taylor

The one constant in electronics manufacturing is change. Moore's Law, which successfully predicted a rate of change at which transistor counts doubled on Integrated Circuits (ICs) at lower cost for decades, is ceding to be an appropriate prediction tool. Increasing technical and economic requirements, deriving from the semiconductor environment, are cascaded down to the printed circuit and in particular to the IC substrate manufacturers. This is both a challenge and an opportunity for IC Substrate manufacturers, when dealing with the demands of the packaging market. (...)

This paper introduces two new electroless copper baths developed for IC substrates manufacturing based on Semi Additive Process (SAP) technology (hereafter referred to as E'less Copper IC) and HDI production (hereafter referred to as E'less Copper HDI) and optimized for high throw into BMVs. An introduction to reliable throwing power measurement methods based on scanning electron microscope (SEM) is given, followed by a compilation and discussion of key performance criteria for each application, namely throwing power, copper adhesion on the substrate, dry film adhesion and reliability....

Publisher: Atotech

Atotech

One of the world's leading suppliers of integrated production systems, chemistry, equipment, know-how and service for electroplating, semiconductor and printed circuit board manufacturing.

Berlin, Germany

Manufacturer of Assembly Material, Manufacturer of Components, Components/Substrates

Six Reasons to Invest in Product Prototypes Early and Often

Apr 15, 2017 | Tuan Tran

Few things are more exciting to manufacturers than new product ideas. New designs, engineering challenges and the ability to deliver a new user experience are all rewarding hallmarks of innovation. However, the road that separates conceptualization and commercialization is riddled with tight turns and obstacles. Fast, efficient prototyping is one of the best ways to prepare yourself for the journey....

Publisher: Power Design Services

Power Design Services

Power Design Service's quick turn and hands-on customer service provides best-in-class printed circuit board, PCB, flex circuit and prototype design, fabrication, and assembly for your business.

San Jose, California, USA

Contract Manufacturer

WHERE RFID TAGS ARE USED

Apr 14, 2017 | catherine

RFID tags and labels have been used around in our life with rising trend, no matter where you go, RFID may used there. But someone still have such questions, where RFID tags are used? what are RFID tags used for? why use RFID tags? And where can I buy RFID tags? If you have such questions, congratulation! You come to the right place!...

A Study to Determine the Impact of Solder Powder Mesh Size and Stencil Technology Advancement on Deposition Volume when Printing Solder Paste

Apr 13, 2017 | Karl Seelig, Tim O'Neill

The drive to reduced size and increased functionality is a constant in the world of electronic devices. In order to achieve these goals, the industry has responded with ever-smaller devices and the equipment capable of handling these devices. The evolution of BGA packages and leadless devices is pushing existing technologies to the limit of current assembly techniques and materials.

As smaller components make their way into the mainstream PCB assembly market, PCB assemblers are reaching the limits of Type 3 solder paste, which is currently in use by most manufacturers.

The goal of this study is to determine the impact on solder volume deposition between Type 3, Type 4 and Type 5 SAC305 alloy powder in combination with stainless steel laser cut, electroformed and the emerging laser cut nano-coated stencils. Leadless QFN and μBGA components will be the focus of the test utilizing optimized aperture designs....

Publisher: AIM Solder

AIM Solder

AIM is a leading global manufacturer of tin-lead and lead-free solder assembly materials for the electronics industry.

Montreal, Quebec, Canada

Manufacturer of Assembly Material, Soldering

Kaphesion VSI Parylenes solution to Polyimide Adhesion

Apr 13, 2017 | Soraya Terrab

Parylene has been used for decades as a barrier layer to protect critical devices and components. The parylene deposition process typically requires an adhesion promotion step to make sure the parylene adheres well to the base substrate. Typical adhesion methods don't work well on Kapton and Polyamide, until VSI Parylene came up with a solution....

Publisher: VSI Parylene

VSI Parylene

VSI Parylene provides precision parylene conformal coating services to protect your critical components and devices. We have a Proven Process to go from first inquiry to final process.

Broomfield, Colorado, USA

Contract Manufacturer

Luceda Photonics Delivers a Silicon Photonics IC Solution in Tanner L-Edit.

Apr 06, 2017 | Wim Bogaerts, Pieter Dumon, Martin Fiers; Luceda Photonics, Jeff Miller; Mentor Graphics

Silicon photonics is an IC technology where data is transferred using light that is routed on the chip using optical waveguides (Figure 1). Silicon photonics is best known as a method to solve problems with high input/output bandwidth applications. For example, because of ever-growing bandwidth requirements in datacenters, the optical transmit and receive heads are being placed closer and closer to the board and the IC. But, designers also apply this technology to biosensors, medical diagnostics, and environmental monitoring. Regardless of the application, photonic ICs always need integration to electronic circuits and this results in unique challenges....

Publisher: Mentor Graphics

Mentor Graphics

A leader in software solutions for electroncs design, Mentor Graphics is the only EDA company with a total end-to-end solution for design though manufacturing.

Wilsonville, Oregon, USA

Design, Software Manufacturer

Multiple Methods for Applying Paste Flux or Solder Paste for BGA Rework

Mar 30, 2017 | Bob Wettermann, BEST Inc. MIT

There are multiple methods, each with its associated benefits for given applications, for printing either solder paste or paste flux for BGA rework. Each of these methods is best-suited for a given situation, board layout and skill level of operators performing the BGA rework. This discussion will layout the various methods and present the specific circumstances for which the specific technique is most wellsuited. In addition, the pluses and minuses for each of the approaches will be discussed in detail....

Publisher: BEST Inc.

BEST Inc.

BEST offers professional rework, repair and prototype builds of PCBs. Our experienced instructors teach professional soldering classes as we are an IPC certified training center.

Rolling Meadows, Illinois, USA

Repair/Rework, Soldering, IPC Standards Certification Center, Service Provider, Training Provider

Water Soluble Solder Paste, Wet Behind the Ears or Wave of the Future

Mar 22, 2017 | Tony Lentz

Water soluble lead-free solder paste is widely used in today’s SMT processes, but the industry is slowly moving away from water soluble solder pastes in favor of no-clean solder pastes. This shift in usage of solder paste is driven by an effort to eliminate the water wash process. Some components cannot tolerate water wash and elimination of water washing streamlines the SMT process. Despite this shift, certain applications lend themselves to the use of water soluble solder paste.

This paper details the research and development of a new water soluble lead-free solder paste which improves on the performance characteristics of existing technologies....

Publisher: FCT ASSEMBLY, INC.

FCT ASSEMBLY, INC.

With numerous facilities in the United States, we are one of the electronics industry's leading manufacturers of lead-free solder products, superior quality stencils, and precision cut parts.

Greeley, Colorado, USA

Manufacturer of Assembly Material, Soldering

Best Practices for RoHS Compliance in support of CE Marking

Mar 15, 2017 | Randy Flinders

In 2012, The European Directive on Reduction of Hazardous Substances was recast. The new version of the directive now requires products to be adequately validated as RoHS compliant in order to be eligible for CE marking and access to the EU market (...)

This paper starts by reviewing the evolution of the RoHS directive and how it has evolved. It then moves on to cover the requirements and scope of the directive, as well as which standards are used to demonstrate compliance, and how those standards must be referenced in internal company quality processes....

Publisher: GreenSoft Technology, Inc.

GreenSoft Technology, Inc.

GreenSoft Technology is a leading provider of environmental compliance content management tools, software and services for the global electronics industry for RoHS-2, REACH, Conflict Minerals and other regulations.

Pasadena, California, USA

Environmental Resources, Service Provider, Software Manufacturer

Screen-Printing Fabrication and Characterization of Stretchable Electronics

Mar 09, 2017 | Jari Suikkola, Toni Björninen, Mahmoud Mosallaei, Timo Kankkunen, Pekka Iso-Ketola, Leena Ukkonen, Jukka Vanhala & Matti Mäntysalo

This article focuses on the fabrication and characterization of stretchable interconnects for wearable electronics applications. Interconnects were screen-printed with a stretchable silver-polymer composite ink on 50-μm thick thermoplastic polyurethane. The initial sheet resistances of the manufactured interconnects were an average of 36.2 mΩ/◽, and half the manufactured samples withstood single strains of up to 74%. The strain proportionality of resistance is discussed, and a regression model is introduced. Cycling strain increased resistance. However, the resistances here were almost fully reversible, and this recovery was time-dependent. Normalized resistances to 10%, 15%, and 20% cyclic strains stabilized at 1.3, 1.4, and 1.7. We also tested the validity of our model for radio-frequency applications through characterization of a stretchable radio-frequency identification tag....

Publisher: Tampere University of Technology

Tampere University of Technology

TUT is Finland's second-largest university in engineering sciences located next to the Technology Centre Hermia, including a large Nokia research facility.

Tampere, Finland

School

Nanoelectromechanical Switches for Low-Power Digital Computing

Mar 02, 2017 | Alexis Peschot, Chuang Qian, Tsu-Jae King Liu

The need for more energy-efficient solid-state switches beyond complementary metal-oxide-semiconductor (CMOS) transistors has become a major concern as the power consumption of electronic integrated circuits (ICs) steadily increases with technology scaling. Nano-Electro-Mechanical (NEM) relays control current flow by nanometer-scale motion to make or break physical contact between electrodes, and offer advantages over transistors for low-power digital logic applications: virtually zero leakage current for negligible static power consumption; the ability to operate with very small voltage signals for low dynamic power consumption; and robustness against harsh environments such as extreme temperatures. Therefore, NEM logic switches (relays) have been investigated by several research groups during the past decade. Circuit simulations calibrated to experimental data indicate that scaled relay technology can overcome the energy-efficiency limit of CMOS technology.

This paper reviews recent progress toward this goal, providing an overview of the different relay designs and experimental results achieved by various research groups, as well as of relay-based IC design principles. Remaining challenges for realizing the promise of nano-mechanical computing, and ongoing efforts to address these, are discussed....

Publisher: EECS at University of California

EECS at University of California

The Department of Electrical Engineering and Computer Sciences (EECS) at UC Berkeley offers one of the strongest research and instructional programs in this field anywhere in the world.

Berkeley, California, USA

School

The Evolution of Surface Finishes in Mobile Phone Applications

Feb 28, 2017 | Claus Würtz Nielsen Nokia Mobile Phones R&D

During the last 5 years mobile phones and other portable consumer electronics have been extremely popular and spread all over the world in different climate zones in very high volumes. At the same time the mobile phone terminal for many people has become a necessity that is brought with them in any activity they practice. These changes in user behavior have heavily changed the impact on handheld terminals from moisture, sweat, corrosive atmospheres and mechanical drop. As a result of this the requirement to solder joint reliability, corrosion stability and wear resistance are heavily increasing to keep a high reliability of the terminal.

Immersion Ni/Au has been the overall dominant surface finish on Printed Wiring Boards (PWB's) for the last 10 years, but a paradigm shift to avoid use of this thin and porous surface finish is ongoing nowadays because it can’t address these challenges in a satisfactory way.

In today's handheld terminals, Organic Solder Preservative (OSP) has replaced Immersion Ni/Au on solder pads. Carbon surface finish for Key- and spring contact-pads, combined with the right concept design can make use of Immersion Ni/Au unnecessary in the near future. The result will be higher reliability with less expensive and simpler processes.

This paper will discuss the various considerations for choice of surface finish and results from the feasibility studies performed....

Publisher: Nokia Corporation

Nokia Corporation

Founded in 1865, NOKIA is a Finnish multinational communications and information technology company.

Espoo, Finland

Other

Best Practices for Collecting Product Material and Compliance Data

Feb 23, 2017 | PTC

Managing the environmental performance of products is an increasingly complicated challenge for manufacturers today. These companies face a complex tangle of requirements and mandates from regulators, consumers and customers to manage the toxicity, recycleability and overall environmental impact of their products. Not only have governments, business-to-business customers and consumers demonstrated a clear preference for better environmentally performing and "greener" brands, but investors are now pressuring manufacturers, as well. For example, the Dow Jones Sustainability Index identifies and tracks leading sustainability-driven companies around the world.

This paper focuses on the challenges companies face and the best practices they can employ when collecting substance, material and compliance data from their suppliers and supply chain....

Publisher: PTC

PTC

PTC is a global technology provider of the leading IoT and AR platform and field-proven solutions transform how companies create, operate, and service products.

Needham, Massachusetts, USA

Other

Component Level Reliability For High Temperature Power Computing With SAC305 And Alternative High Reliability Solders

Feb 16, 2017 | Thomas Sanders, Sivasubramanian Thirugnanasambandam and John Evans, Ph.D., Michael Bozack, Ph.D., Jeff Suhling, Ph.D. - Auburn University, Wayne Johnson, Ph.D. - Tennessee Tech University

This experiment considers the reliability of a variety of different electronic components and evaluates them on 0.200” power computing printed circuit boards with OSP. Single-sided assemblies were built separately for the Top-side and Bottom-side of the boards. This data is for boards on the FR4-06 substrate.

This paper was originally published by SMTA in the Proceedings of SMTA International....

Publisher: Auburn University

Auburn University

Auburn University is a comprehensive land-grant institution with primary missions including instruction, research, and extension/outreach.

Auburn, Alabama, USA

School

Can Age and Storage Conditions Affect the SIR Performance of a No-Clean Solder Paste Flux Residue?

Feb 09, 2017 | Eric Bastow

The SMT assembly world, especially within the commercial electronics realm, is dominated by no-clean solder paste technology. A solder paste flux residue that does not require removal is very attractive in a competitive world where every penny of assembly cost counts. One important aspect of the reliability of assembled devices is the nature of the no-clean solder paste flux residue. Most people in this field understand the importance of having a process that renders the solder paste flux residue as benign and inert as possible, thereby ensuring electrical reliability.

But, of all the factors that play into the electrical reliability of the solder paste flux residue, is there any impact made by the age of the solder paste and how it was stored? This paper uses J-STD-004B SIR (Surface Insulation Resistance) testing to examine this question....

Publisher: Indium Corporation

Indium Corporation

Solder pastes, solder preforms, solder spheres, soldering fluxes, electrically-conductive adhesives. All alloys: tin-lead, lead-free, indium alloys, and more.

Utica, New York, USA

Manufacturer of Assembly Material, Soldering

BGA Rework Process

Feb 01, 2017 | Bob Wettermann

BGA Rework Course encompasses the skills necessary to perform rework of electronic printed circuit boards to include PBGA and CBGA technologies. There should be 'one-stop' solution, that offers a wide range of ball grid array rework and repair services....

Publisher: BEST Inc.

BEST Inc.

BEST offers professional rework, repair and prototype builds of PCBs. Our experienced instructors teach professional soldering classes as we are an IPC certified training center.

Rolling Meadows, Illinois, USA

Repair/Rework, Soldering, IPC Standards Certification Center, Service Provider, Training Provider

HOW MULTI-WAVELENGTH LED LIGHT IMPROVE CURING QUALITY

Jan 31, 2017 | DPL Industri A/S Denmark

Compared with general Mercury Lamp, normal LED can only provide a very narrow band. See the left side figure, which compare the output of a multi-wavelength( 365nm-410nm) LED lamp with traditional mercury lamp. At the same wavelength 365nm,LED lamp can output much more energy than traditional mercury lamp, means LED lamp can provide more high energy output in UV-A range. DPL eAsycure LED curing system use the latest LED technology on LED chip combination to reach high Joule Energy (DOSIS Energy), so it can easily cure UV ink in UVA range instead of single wavelength LED ink. According to our client’s ink performance, DPL LED Curing system can setup different output energy at different wavelength. If you have any question,please contact with our service team at dpl@dpl.dk or visit our website: www.dpl.dk...

1 comments.

what is LED UV curing?

Jan 31, 2017 | DPL Industri A/S Denmark

DPL LED Easycure LED system is base on the latest LED curing technology, which combine with a high effective and smart construction ensure a stable and perfect curing quality for different types of coating, printing, bonding application. DPL LED curing system series is build up with length from 82mm to 2240mm. We also provide customer design service. FEATURE : High UV curing energy output: with our special construction of LED Chips, DPL LED curing system can reach 146w/cm, output energy up to 650mj/cm2 by 100m/min printing speed, Peak energy up to 26w/cm2. Long lifetime: with high effective water chill construction, DPL LED curing system can reach more than 20.000 hours by 100% Radiation. Suitable for LED or mercury UV ink: DPL LED curing system provide high Joule energy (DOSIS ENERGY) with wave length from 365-395nm. “Plus & Play” smart system: DPL LED Curing system is smart system with “plus &play” design, easy to operation and suitable to install in existing machine....

WHY UNIFORMITY IS IMPORT FOR UV CURING PROCESS?

Jan 31, 2017 | DPL Industri A/S Denmark

It’s very important to many application that UV light has a good uniformity output, for example, touch screen UV bonding, electric printing board or cell and so on. Many traditional UV curing lamps have a uniformity up to 65-75%, which bring a bad side curing result on edges. DPL EasycureTM use our special design mirrors which reduces the disturbance of the linearity of the UV light source, resulting in a uniformity, which is better than 85%. For very sensitive screen production with stationary irradiation, DPL Unicure TM with special light trap that would eliminate UV light sources disturbance of the linearity. With this solution, DPL UnicureTM can reach a uniformity better than 90%....

What Type of PCB Substrate Material Is Right for Your PCB?

Jan 24, 2017 | Dora Yang

Basic performance of PCB (Printed Circuit Board) depends on the performance of substrate material. In order to improve the performance of PCB, you have to increase the performance of PCB substrate material first. This article introduces how to chose PCB substrate material for your custom PCB project from multiple perspectives....

3 comments.

Publisher: PCBCart

PCBCart

PCBCart, a highly skilled PCB Fab, Parts Sourcing & Assembly services provider for global companies, fabricates 23k+ different PCB designs each year, and are committed on the quality & performance of every circuit board it printed

Hangzhou, China

Manufacturer of Bare PCBs, Manufacturer of Assembled PCBs, Drilling/Routing, Turnkey, Contract Manufacturer

Environmentally sound: Aqueous cleaning with minimum water consumption

Jan 23, 2017 | Connie Miede

"Water is not a problem of the future, but a key issue of our time for businesses: In the future, urgent water risks will increase in many areas of the world. A growing population, a changing consumer behavior and climate change will have an immediate impact on the availability and quality of water and thus build further pressure on governments, businesses and societies." (Quote from the summary of the 2014 WWF study "The imported risk. Germany's water risk in the age of globalization.")...

Publisher: Kolb Cleaning Technology USA LLC

Kolb Cleaning Technology USA LLC

The international full service manufacturer of systems, detergents, equipment and process design for the cleaning in electronics production.

Longmont, Colorado, USA

Cleaning

Rigid-Flex PCB Right the First Time - Without Paper Dolls

Jan 19, 2017 | Benjamin Jordan

The biggest problem with designing rigid-flex hybrid PCBs is making sure everything will fold in the right way, while maintaining good flex-circuit stability and lifespan. The next big problem to solve is the conveyance of the design to a fabricator who will clearly understand the design intent and therefore produce exactly what the designer/engineer intended.

Rigid-Flex circuit boards require additional cutting and lamination stages, and more exotic materials in manufacturing and therefore the cost of re-spins and failures are very much higher than traditional rigid boards. To reduce the risk and costs associated with rigid-flex design and prototyping, it is desirable to model the flexible parts of the circuit in 3D CAD to ensure correct form and fit. In addition it is necessary to provide absolutely clear documentation for manufacturing to the fabrication and assembly houses....

Publisher: Altium

Altium

Altium provides electronics design solutions that help designers create the next generation of electronic products.

La Jolla, California, USA

Software Manufacturer

Effect of Alloy and Flux System on High Reliability Automotive Applications

Jan 05, 2017 | Mitch Holtzer, Steve Brown - Alpha, Marcus Reichenberger - Technische Hochschule Nürnberg

The July 2006 implementation of ROHS exempted automotive applications from converting to lead free technology. Nine years later, all major OEM and Tier 1 automotive manufacturers have converted or are in the process of converting to lead free circuit assembly processing. Starting with SAC (SnAgCu) alloys as a baseline for lead free soldering, in the last years several specific alloys were developed in order to improve resistance to high temperature creep, vibration survival and the ability to withstand thermal cycling and thermal shock.

The paper compares three different solder alloys and two flux chemistries in terms of void formation and mechanical / thermal fatigue properties. Void content and reliability data of the alloys will be presented and discussed in relation to the acceptance criteria of a Tier 1 /OEM automotive supplier. As a result, a ranking list will be presented considering the combined performance of the alloys. In order to analyze the void formation and mechanical behavior of different solder alloys and flux chemistry combinations, statistical methods are used....

Publisher: Alpha

Alpha

A materials supplier to the electronics industry. Our breadth of products includes Solder Paste, Solder Preforms, Stencils, Liquid Soldering Flux, Soldering Alloys, Cored Wire, Adhesives, Cleaners and Sinter Technologies

Altoona, Pennsylvania, USA

Manufacturer of Assembly Material, Soldering

per page.

Pages: 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17

SMT in-printer dispensing

Used PCB Equipment - AdoptSMT