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SMTnet Express, October 30, 2014, Subscribers: 23456, Members: Companies: 14075, Users: 37030

Technical Library

Solder Joint Reliability Under Realistic Service Conditions.

P. Borgesen, S. Hamasha, M. Obaidat, V. Raghavan, X. Dai; Binghamton University, M. Meilunas, M. Anselm; Universal Instruments Corporation.

The ultimate life of a microelectronics component is often limited by failure of a solder joint due to crack growth through the laminate under a contact pad (cratering), through the intermetallic bond to the pad, or through the solder itself. Whatever the failure mode proper assessments or even relative comparisons of life in service are not possible based on accelerated testing with fixed amplitudes, or random vibration testing, alone. Effects of thermal cycling enhanced precipitate coarsening on the deformation properties can be accounted for by microstructurally adaptive constitutive relations, but separate effects on the rate of recrystallization lead to a break-down in common damage accumulation laws such as Miner's rule. Isothermal cycling of individual solder joints revealed additional effects of amplitude variations on the deformation properties that cannot currently be accounted for directly.

We propose a practical modification to Miner's rule for solder failure to circumvent this problem. Testing of individual solder pads, eliminating effects of the solder properties, still showed variations in cycling amplitude to systematically reduce subsequent acceleration factors for solder pad cratering. General trends, anticipated consequences and remaining research needs are discussed.

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Forum search results for related keywords: cratering, solder failure, intermetallic bond.

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Events Calendar

International Wafer-Level Packaging Conference

San Jose, CA, USA | November 11 - 13 | SMTA - Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!...

Printed Electronics USA 2014

Santa Clara, CA, USA | November 19 - 20 | IDTechEx, Inc. - The eleventh annual IDTechEx event focuses on the commercialization of the technology...

Southeast Design-2-Part Show

Raleigh, NC, USA | November 19 - 20 | Design-2-Part Shows - The largest design and contract manufacturing show in the Southeast....

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MECHANICAL ENGINEER with 7.5 yrs experiance in SMT, Industrial Engineering & Manufacturing.

FARIDABAD, HARYANA, India

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Rolling Meadows, IL, USA

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Next Event: SMTA Webtorial: SMT and Through Hole Defect Analysis and Process Troubleshooting - November 4 - 11

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IPC - Association Connecting Electronics Industries is a US-based trade association dedicated to the competitive excellence and financial success of its nearly 2,600 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly.

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