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SMTnet Express, July 20, 2017, Subscribers: 30,612, Companies: 10,637, Users: 23,528

Technical Library

Reactivity Of No-Clean Flux Residues Trapped Under Bottom Terminated Components

Bruno Tolla, Ph.D., Jennifer Allen, Kyle Loomis - Kester Corporation, Mike Bixenman, DBA - KYZEN Corporation

As electronic devices increase functionality in smaller form factors, there will be limitations, obstacles and challenges to overcome. Advances in component technology can create issues that may have time delayed effects. One such effect is device failure due to soldering residues trapped under bottom terminated components. If the residues trapped under the component termination are active and can be mobilized with moisture, there is the potential for ion mobilization causing current leakage.

Forum search results for related keywords: bottom terminated components, QFN, no-clean paste, flux outgassing, cleaning.


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