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SMTnet Express, March 14, 2024, Subscribers: 25,392, Companies: 12,034, Users: 28,759

█  Electronics Manufacturing Technical Articles

Head in Pillow X-ray Inspection at Flextronics

Manufacturing technology faces challenges with new packages/process when confronting the need for high yields. Identifying product defects associated with the manufacturing process is a critical part of electronics manufacturing. In this project, we focus on how to use AXI to identify BGA Head-in-Pillow (HIP), which is challenging for AXI testing. Our goal is to help us understand the capabilities of current AXI machines.

Credit: Flex (Flextronics International)

A PROCEDURE TO DETERMINE HEAD-IN-PILLOW DEFECT AND ANALYSIS OF CONTRIBUTING FACTORS

Head-in-Pillow (HIP) defects are a growing concern in the electronics industry. These defects are usually believed to be the result of several factors, individually or in combination. Some of the major contributing factors include: surface quality of the BGA spheres, activity of the paste flux, improper placement / misalignment of the components, a non-optimal reflow profile, and warpage of the components. To understand the role of each of these factors in producing head-in-pillow defects and to find ways to mitigate them, we have developed two in-house tests.

Credit: Cookson Electronics

Head-on-Pillow Defect Detection - X-ray Inspection Limitations

Both the number and the variants of Ball Grid Array packages (BGAs) are tending to increase on network Printed Board Assemblies (PBAs)with sizes ranging from a few mm die size Wafer Level Packages (WLPs) with low ball count up to large multi-die System-in-Package (SiP) BGAs with 60-70 mm side lengths and thousands of I/Os.

Credit: Ericsson AB

Advanced Second Level Assembly Analysis Techniques - Troubleshooting Head-In-Pillow, Opens, and Shorts with Dual Full-Field 3D Surface Warpage Data Sets/

SMT assembly planning and failure analysis of surface mount assembly defects often include component warpage evaluation. Coplanarity values of Integrated Circuit packages have traditionally been used to establish pass/fail limits. As surface mount components become smaller, with denser interconnect arrays, and processes such package-on-package assembly become prevalent, advanced methods using dual surface full-field data become critical for effective Assembly Planning, Quality Assurance, and Failure Analysis. A more complete approach than just measuring the coplanarity of the package is needed. Analyzing the gap between two surfaces that are constantly changing during the reflow thermal cycle is required, to effectively address the challenges of modern SMT assembly.

Credit: Akrometrix

Hidden Head-In-Pillow soldering failures

One of the upcoming reliability issues which is related to the lead-free solder introduction, are the head-in-pillow solderability problems, mainly for BGA packages. These problems are due to excessive package warpage at reflow temperature. Both convex and concave warpage at reflow temperature can lead to the head-in-pillow problem where the solder paste and solder ball are in mechanical contact but not forming one uniform joint. With the thermo-Moire profile measurements, this paper explains for two flex BGA packages the head-in-pillow. Both local and global height differences higher than 100 um have been measured at solder reflow temperature. This can be sufficient to have no contact between the molten solder ball and solder paste. Finally, the impact of package drying is measured

Credit: IMEC

RESULTS of Searches for related keywords - "pillow" (87)

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█  Printed Circuit Board Assembly & PCB Design Forum

Flux on the body of SMT components -- Hello all, I have a flux over components that affects AOI results in reading the symbols on top of it. What would you recommend to minimize this effect?

Defect Rate WRT Customer Deliveries -- My company is a small CM that is going through AS9100 certification. We've been working to nail down some metrics on our defect rate for SMT and THT assembly. I've seen numbers like 100 - 500 PPM defect rates. On a recent job, if I count each component as one potential source of a defect, then we had a defect rate of around 100 PPM. The issue I've run into, is that all metric information I've found online bases the PPM rate on defects found by an end of line AOI. This seems flawed to me for a few reasons: 1. This assumes that a AOI is 100% accurate, which as we all know, is not true. 2. If a board is not functionally tested, the only real way to know if there is an assembly defect, is when the end customer/client actually uses/tests the board. Which if you base your defects only on your AOI, this rate is not captured. Ultimately, if we are building boards for a client, with no functional test fixture provided, it is, of course, not possible to deliver ....

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█  SMT, PCB Manufacturing Companies - Industry Directory

NEWEST SUBSCRIBERS

Kaptune Media India Private Limited - At TrackOlap, we specialize in creating customized digital solutions. Our skilled team ensures innovative and timely deliveries that precisely match your software needs. With a dedication to excellence and continuous support.

Fibermint - Fibermint is a company focusing on optical fiber communication solutions, committed to providing customers with high-quality customized optical fiber products.

SMT Ecosia Co., Ltd. - Trading of Used Electronics and Semiconductor Machines and Equipment

ADD YOUR COMPANY...



█  SMT, PCB Electronics Assembly Manufacturing Industry News

Nordson Electronics Solutions to demonstrate plasma treatment and automated fluid dispensing systems for electronics manufacturing at SEMICON China 2024

Connect with our experts and see plasma and dispensing equipment for microelectronics manufacturing in booth 3645...

Nordson Electronics Solutions

picture of Nordson Electronic Systems banner

MIRTEC to Showcase State-of-the-Art 3D AOI Solutions at APEX 2024

MIRTEC will showcase its complete line of 3D AOI and SPI Inspection Systems at Booth #2100 during the 2024 IPC APEX EXPO scheduled to take place April 9-11, 2024, at the Anaheim Convention Center. "MIRTEC will feature a total of seven systems specifically designed to address the full spectrum of inspection requirements associated with the Electronics Manufacturing Industry including two new state-of-the-art 3D AOI Solutions," stated Brian D'Amico, President of MIRTEC's North American Sales and Service Division....

3M Electrical Solutions Division

picture of Murray Percival logo

FTG Circuits Earns IPC-1791 Trusted Electronic Designer, Fabricator and Assembler QML Requalification

IPC's Validation Services program has awarded an IPC-1791, Trusted Electronics Fabricator Qualified Manufacturer Listing (QML) requalification to FTG Circuits' Haverhill, Mass. location....

Association Connecting Electronics Industries (IPC)

Picture of IPC logo

ADD YOUR NEWS...



█  SMT / PCB Products & Services

NEW SMT / PCB EQUIPMENT & SERVICES - For Sale

PCB INSPECTION

ISVI - CoaXPress Industrial Camera

ISVI

PCB SOFTWARE

ProntoGERBER CONNECTION Software

Unisoft

PCB ASSEMBLY

Imagineering - We are circuit board assembly & fabrication experts

Imagineering

PCB REFLOW OVEN

Heler dual lane Reflow Oven

Heller

PCB DISPENSING

DS Series Dispensers for Large Boards

GPD Global

Inspection

I.C.T AOI Solution

Dongguan I.C.T

SELECTIVE SOLDERING

Pillarhouse Jade Handex

Pillarhouse USA

VIEW MORE NEW PRODUCTS...



Lewis & Clark - Sell us used equipment



█  SMT / PCB Assembly Equipment Auctions

AUCTION | NexGen Power Systems - Closure of Low-Volume Semiconductor & Metrology Fab

AUCTIONEER | The Branford Group

TYPE | Online Auction

DESCRIPTION | Closure of Low-Volume Semiconductor & Metrology Fab | Multi-Million Dollar Facility Investment

FEATURING | Front-End & Back-End Semi | Metrology | Lab | Wet Process | Aixtron | Veeco | Sigma | CamTek | Keysight | KLA

SCHEDULE | Mon, Mar 11 to Wed, Mar 13, 2024

OPENS | Monday, March 11, 2024 8:00 AM (EST)

CLOSES | Wednesday, March 13, 2024 11:00 AM (EST)

LOCATION | 50 Collamer Crossing Pkwy, East Syracuse, NY 13057

FEATURING |

Front-End Semiconductor: Aixtron Type AIX G5 HT TM MOVPE Planetary Reactor (2022) Veeco WaferStorm 3300 Model M3303-7 Wet Etching System (2021) Sigma SPTS/KLS fxP Physical Vapor Deposition System (PVD) Camtek Eagle T-i Advanced Automated Optical Inspection (AOI) System (2021) ECM Technologies Group Jipelec Jetfirst 300C Rapid Thermal Processing (RTP) Furnace (2022) Tencor Instruments KLA Surfscan 5500 (2020 Refurbished) ESI E3511 Asher (2020)

Back-End Semiconductor: Disco DGP8761 Fully Automatic Grinder/Polisher (2020) - 650 Wafers Processed! - SOLD Eaton Nova/Axcelis 8250HT Implant System Bristol 137 Optical Non-Contact Wafer Thickness Measurer (2) USI Ultron UH114-8 Tape Hugle Semicorp HS-1810 Die Matrix Expander (2022) SEC 3150 Wafer/Film Frame Tape Applicator (2020)

Metrology | Test: Keysight 4771A Series PCM Parametric Test System (2) 2017 Tokyo Seimitsu Acctetech UF200R Auto Wafer Probers Micromanipulator Prober with Keithley 4200A Parameter Analyzer Rudolph Research/AutoEL III SS292 Elipsometer Focused Test FTI-1000 Tester ProFilm 3D Microscope

Wet Process: MTS MicroTech IPA Gradient Dryer (2020) Kinetics 48" Front Access Wet Bench (2020) Sitek Process Solutions FLuorwave HTC 8030 Box Washer

Lab: Denton Desk V Vacuum System Allied High Tech Products TechPrep Polishing System Lindberg BlueM MO1440P3A-1 Mechanical Oven

IMPORTANT BIDDER REGISTRATION INFORMATION | All prospective bidders must be registered and approved no later than 24 hours prior to the bids closing. Upon registering you will receive information via email on how to become an approved bidder. All prospective bidders must post a 25% deposit of approximate planned spending budget or a minimum of $10,000.00 to be approved via wire transfer (no credits cards). Upon the conclusion of the auction all non-successful bidders will be returned their deposit via wire transfer within 48hrs., all deposits received from winning bidders will be applied towards their purchases. No exceptions will be made.

The Branford Group - Online Auction Featuring Surplus Assets From NexGen Power Systems





AUCTION | April 18 - 25 Online Equipment Auction

AUCTIONEER | Baja Bid

TYPE | Online Auction

SCHEDULE | Thu, Apr 18 to Thu, Apr 25, 2024

FEATURING |

  • 2022 Nordson Yestech FX-940 3D Ultra AOI
  • 2022 Juki Cube 460 Selective Solder
  • 2022 Juki G-Titan Screen Printer
  • 2022 BTU Pyramax 100A Reflow Oven

ADDITIONAL Equipment |

2022 Inline SMT Magazine Unloader [2] 2022 Inline SMT Conveyors [3] Juki KE2070E SMT Pick & Place Juki KE2080E SMT Pick & Place [2] Purex Filtration Systems South-Tek Systems Nitrogen Generator Various Juki Feeders [2] 2022 Nordson / Yestech BX Benchtop AOI 2019 SCS PC V Coating System 2020 Vi Technology 5K 3D AOI MVP Supra E AOI Mydata Agilis M8 Magazines & more ...

Baja Bid Auction April 18-25, 2024

SEE MORE AUCTIONS...



█  Electronic Equipment Market

MARKET - Used Electronic Assembly Machines For Sale

PCB AOI

World Equipment Source - YesTech YTV-2050 AOI

World Equipment Source, LLC

Adhesive Dispensers

 Musashi FAD2500

KD Electronics Ltd.

AOI INSPECTION

 Lewis & Clark Viscom S3088  AOI

Lewis & Clark

Soldering - Selective

Juki Cube 460

Baja Bid

PCB PRINTING

 SMTUnion - DEK NEOHORIZON 03iX

SMTUnion

MORE EQUIPMENT & PARTS...

SUBMIT YOUR RFQ ....

MARKET - Used PCB Assembly Equipment Wanted To Buy

PCB TEST

Lewis & Clark Agilent 3070

Lewis & Clark

PCB TEST

KD Electronics Agilent 3070

KD Electronics

Soldering - Wave

Electrovert VectraElite

Baja Bid

P&P / FEEDERS

World Equipment Source Assembleon MG-1R

World Equipment Source, LLC

SEE Buyers' Used Assembly Equipment Wants



█  Electronics Manufacturing & Assembly Events Calendar

EVENTS

Monterrey Expo & Tech Forum | March 14

SMTA

Ultra High Density Interconnect Conference | March 26

SMTA

SPONSORED BY

ADD YOUR EVENT ...



█  Electronics Manufacturing Training Courses & PCB Assembly Training

FIND TRAINING FOR:

IPC Certification

Soldering & Rework

PCB Design

Electronics Assembly

Electronics Inspection

Online Training

SPONSORED BY

BlackFox - Experience the BlackFox Difference

EPTAC - 2024 IPC Certification Training Schedule

TRAINING - PCB Inspection Electronics Manufacturing Training Courses

IPC-A-610 Specialist Interactive PCB Inspection Lab (CIS or CIT Option) Certification Training Course

Multiple dates and locations. Check the link for details

EPTAC Corporation

TRAINING - PCB Rework and Hand Soldering Training Courses

Customizable Basic Hand Soldering

Multiple dates and locations. Check the link for details

Blackfox Training Institute, LLC

EPTAC Hand Soldering Certification Training Course

Multiple dates and locations. Check the link for details

EPTAC Corporation

TRAINING - Online Electronics Manufacturing and Assembly Training Courses

Reflow Soldering 101 Training Course

Surface Mount Technology Association (SMTA)

IPC/WHMA-A-620 Expert (CSE) Certification Training Course

EPTAC Corporation

IPC Certified Electronics Program Manager (CEPM) Training and Certification Program

Association Connecting Electronics Industries (IPC)

Component Placement 101 Training Course

Surface Mount Technology Association (SMTA)

ESD Control for Electronics Assembly

Association Connecting Electronics Industries (IPC)

MORE TRAINING COURSES...



█  Electronics Manufacturing & PCB Assembly Career Center

Job Needs & Wants

JOBS

YOUR job openings

Overseas SMT Engineer

All over the world, Alabama, USA

I.C.T ( Dongguan Intercontinental Technology Co., Ltd. )

SMT Engineer, Marketing Representative, Sales Representative, Business Assistant

All over the world, California, USA

I.C.T ( Dongguan Intercontinental Technology Co., Ltd. )

Customs & Finance Officer

Hai Phong, Vietnam

Dongguan RuiHengHuaTai Electronic Co., Ltd

AOI Engineer

Hai Phong, Vietnam

Dongguan RuiHengHuaTai Electronic Co., Ltd

Customs & Finance Officer

Hai Phong, Vietnam

Dongguan RuiHengHuaTai Electronic Co., Ltd

SMT Sales Manager

Penang, Pulau Pinang, Malaysia

Rehm Thermal Systems

Director of Business Development

Tampa, Florida, USA

Spartronics

Senior Quality Engineer

Strongsville, Ohio, USA

Spartronics

Program Manager

Strongsville, Ohio, USA

Spartronics

Sr Program Manager of Product Transfer

Brooksville, Florida, USA

Spartronics

Site General Manager

Williamsport, Pennsylvania, USA

Spartronics<

Installation Service Technician

Centennial, Colorado, USA

Vortex Industries

AOI Engineer

Hai Phong, Vietnam

Dongguan RuiHengHuaTai Electronic Co., Ltd

SMT Electronics Technician

Manchester, New Hampshire, USA

Intelligent Manufacturing Solutions

SMT Process Technician III

Racine, Wisconsin, USA

Cree Lighting

Experienced SAKI AOI programmer

All US, USA

AirDataIOT,LLC

Engineering Project Manager

Strongsville, Ohio, USA

Spartronics

Senior Quality Engineer

Williamsport, Pennsylvania, USA

Spartronics

Senior Systems Engineer

Strongsville, Ohio, USA

Spartronics

Procurement Specialist

Brooksville, Florida, USA

Spartronics

Buyer/Planner

Williamsport, Pennsylvania, USA

Spartronics

Corporate Director of Quality

Williamsport, Pennsylvania, USA

Spartronics

Automotive service Technician

Golden, CO, USA

Engage2excel

Program Manager

Williamsport, Pennsylvania, USA

Spartronics

RESUMES

YOUR resumes

0 Electronics Manufacturing & PCB Assembly Resumes

YOUR next job ... YOUR next employee ...




█  PCB Design & Assembly Industry Associations

SMTA Logo

Surface Mount Technology Association (SMTA)

SMTA is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies.

Membership Info | SMTA Certification | Bookstore | Upcoming Events

IPC Logo

Association Connecting Electronics Industries (IPC)

IPC is a US-based trade association dedicated to the competitive excellence and financial success of its nearly 2,600 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly.

Membership Info | Training & Certification | Online Store | Upcoming Events

Editor - Dave "davef" Fish (submit your technical articles)

SMTnet.com, 98 Elm Street, Portland, Maine 04101 USA, Tel.207-780-0887.

FEATURED SPONSORS

The Branford Group - Online Auction Featuring Surplus Assets From NexGen Power Systems

Baja Bid Auction April 18-25, 2024

Qinyl Electronics - About

Solder Paste Dispensing: Dots, Lines, Complex Shapes, Micro Dispensing 01005

Sell your surplus machinery!!! We buy all types of Fabrication, CNC machines, and More. Contact Tom@ xtechauctions.com for more details.

HELLER - Choose an Oven for Your Reflow Needs

MIRTEC MV 6 OMNI High-Speed / High-Performance 3D AOI MACHINE.

Pillarhouse Jade Handex - Lean shop selective soldering - Get high-speed flexible throughput at minimal cost.

BlackFox - Experience the BlackFox Difference

Unused Equipment? - let Baja Bid turn your EXCESS ASSETS into cash!

X-Tech Auctions ��� Contact Us

EPTAC - 2024 IPC Certification Training Schedule

 I.C.T ��� Total SMT line Provider

Software for PCB Manufacturing - Unisoft

SMTUnion - SMT manufacturing cost reduction strategies

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