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SMTnet Express, July 24, 2014, Subscribers: 22981, Members: Companies: 13953, Users: 36523

Technical Library

Copper Wire Bond Failure Mechanisms.

Randy Schueller, Ph.D.; DfR Solutions

Wire bonding a die to a package has traditionally been performed using either aluminum or gold wire. Gold wire provides the ability to use a ball and stitch process. This technique provides more control over loop height and bond placement. The drawback has been the increasing cost of the gold wire. Lower cost Al wire has been used for wedge-wedge bonds but these are not as versatile for complex package assembly. The use of copper wire for ball-stitch bonding has been proposed and recently implemented in high volume to solve the cost issues with gold. As one would expect, bonding with copper is not as forgiving as with gold mainly due to oxide growth and hardness differences.

This paper will examine the common failure mechanisms that one might experience when implementing this new technology.

read article »

Forum search results for related keywords: copper, wire bonding, failure mechanisms, failure modes, defects. process control.

SMT / PCB Products

Solder Paste


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Lzero3 Storage and Retrieval Cabinet

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HYDRON� WS 400 - OA defluxing at 3%-5% Concentration (new!)


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X-eye SF160ACT 3D CT Analysis


by: SEC

SMT Nozzles
and Consumables

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in: Pick & Place

MS-11 Series
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EXCEN PRO High Speed
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MAX II High Precision Fluid Dispenser

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Aqueous Cleaners


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Mark5 Series -
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Quantum™ Large-Format Fluid Dispenser (new!)

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Stencil Printer

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by: Speedprint

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SMT / PCB Equipment Auctions

High Quality SMT, PCB Equipment as late as 2010.

July 31 - August 1 | by: X-Line Asset Management

Semiconductor Fabrication Equipment.

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Events Calendar

Solutions for Difficult to Clean Components - Online Webinar

Online | July 24 | ZESTRON Corporation - An overview of various board and component geometries that present cleaning challenges...

West Penn Expo & Tech Forum

Monroeville, PA, USA | August 14 | SMTA - We will discuss material selection, current electronics research, and failure analysis...

NEPCON South China 2014

Shenzhen, China | August 26 - 28 | Reed Exhibitions - One of the most important trade events for South China�s SMT industry...

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Industry Associations Events


SMTA - Surface Mount Technology Association is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies.

Membership Info | SMTA Certification | Bookstore

Next Event: Philadelphia Expo & Tech Forum - August 12


IPC - Association Connecting Electronics Industries is a US-based trade association dedicated to the competitive excellence and financial success of its nearly 2,600 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly.

Membership Info | Training & Certification Programs | Standards & Publications - Online Store

Next Event: IPC Southeast Asia High Reliability Conference - August 20

Technical Editor - Davef (submit your technical articles)

Newsletter Editor - Anna Girouard, 98 Elm Street, Portland, Maine 04101 USA, Tel.207-780-0887.

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ii-Feed tape feeding solution for Europlacer machines

Fluid Pressure Control - a breakthrough in uniform fluid dispensing - GPD Global

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