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SMTnet Express Newsletter
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Wafer-Level Packaged MEMS Switch With TSV
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by: Nicolas Lietaer, Thor Bakke, Anand Summanwar; SINTEF, Per Dalsjø, Jakob Gakkestad;
Norwegian Defence Research Establishment (FFI), Frank Niklaus; KTH - Royal Institute of Technology
A miniaturized wafer-level packaged MEMS acceleration switch with through silicon vias (TSVs) was fabricated, based on technologies suitable for harsh environment applications. The high aspect ratio TSVs were fabricated through the silicon-on-insulator (SOI) substrate prior to the fabrication of the MEMS structures... read article »



Screen Thickness -
Is there a different thickness of screens we should be using for smaller components...
Tin/Lead HASL Plating in a Lead Free Process -
Anyone doing consigned work in the EMS industry has had this issue...
Choices for SN100C for Reflow -
I'm testing SN100C, and with our 5 zone oven I seem to be able to fix one issue...

IPC APEX EXPO 2012
Conference, Trade Show/Exhibition | February 28 - March 1 | San Diego, CA, USA | Sponsored by: IPC 
The premier electronics industry conference and exhibition...
Pan Pacific Microelectronics Symposium
Conference | Kauai, HI, USA | February 14-16 | Sponsored by: SMTA 
International technical interchange and a premier forum for networking among microelectronics professionals...
Electronics West 2011
Conference, Trade Show/Exhibition | February 14 | Anaheim, CA, USA | Sponsored by: UBM Canon
Three Days. Hundreds of Suppliers. Countless Opportunities to Improve Your Business...

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West Coast USA, USA | Aegis Software
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Costa Mesa, CA, USA
SMT Technician
Imus Cavite, PH, Philippines
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Fredericksburg, VA, USA
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Next Event: Webinar: Troubleshooting SMT-BGA-BTC Yield Problems in a Tin-Lead & Lead Free World - February 7
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SMTnet Express February 2, 2012
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