Manufacturing technology faces challenges with new packages/process when confronting the need for high yields. Identifying product defects associated with the manufacturing process is a critical part of electronics manufacturing. In this project, we focus on how to use AXI to identify BGA Head-in-Pillow (HIP), which is challenging for AXI testing. Our goal is to help us understand the capabilities of current AXI machines.
Head-in-Pillow (HIP) defects are a growing concern in the electronics industry. These defects are usually believed to be the result of several factors, individually or in combination. Some of the major contributing factors include: surface quality of the BGA spheres, activity of the paste flux, improper placement / misalignment of the components, a non-optimal reflow profile, and warpage of the components. To understand the role of each of these factors in producing head-in-pillow defects and to find ways to mitigate them, we have developed two in-house tests.
Both the number and the variants of Ball Grid Array packages (BGAs) are tending to increase on network Printed Board
Assemblies (PBAs)with sizes ranging from a few mm die size Wafer Level Packages (WLPs) with low ball count up to large
multi-die System-in-Package (SiP) BGAs with 60-70 mm side lengths and thousands of I/Os.
SMT assembly planning and failure analysis of surface mount assembly defects often include component warpage evaluation. Coplanarity values of Integrated Circuit packages have traditionally been used to establish pass/fail limits. As surface mount components become smaller, with denser interconnect arrays, and processes such package-on-package assembly become prevalent, advanced methods using dual surface full-field data become critical for effective Assembly Planning, Quality Assurance, and Failure Analysis. A more complete approach than just measuring the coplanarity of the package is needed. Analyzing the gap between two surfaces that are constantly changing during the reflow thermal cycle is required, to effectively address the challenges of modern SMT assembly.
One of the upcoming reliability issues which is related to the lead-free solder introduction, are the head-in-pillow solderability problems, mainly for BGA packages. These problems are due to excessive package warpage at reflow temperature. Both convex and concave warpage at reflow temperature can lead to the head-in-pillow problem where the solder paste and solder ball are in mechanical contact but not forming one uniform joint. With the thermo-Moire profile measurements, this paper explains for two flex BGA packages the head-in-pillow. Both local and global height differences higher than 100 um have been measured at solder reflow temperature. This can be sufficient to have no contact between the molten solder ball and solder paste. Finally, the impact of package drying is measured
Flux on the body of SMT components -- Hello all,
I have a flux over components that affects AOI results in reading the symbols on top of it. What would you recommend to minimize this effect?
Defect Rate WRT Customer Deliveries -- My company is a small CM that is going through AS9100 certification. We've been working to nail down some metrics on our defect rate for SMT and THT assembly. I've seen numbers like 100 - 500 PPM defect rates. On a recent job, if I count each component as one potential source of a defect, then we had a defect rate of around 100 PPM.
The issue I've run into, is that all metric information I've found online bases the PPM rate on defects found by an end of line AOI. This seems flawed to me for a few reasons:
1. This assumes that a AOI is 100% accurate, which as we all know, is not true.
2. If a board is not functionally tested, the only real way to know if there is an assembly defect, is when the end customer/client actually uses/tests the board. Which if you base your defects only on your AOI, this rate is not captured.
Ultimately, if we are building boards for a client, with no functional test fixture provided, it is, of course, not possible to deliver ....
Kaptune Media India Private Limited - At TrackOlap, we specialize in creating customized digital solutions. Our skilled team ensures innovative and timely deliveries that precisely match your software needs. With a dedication to excellence and continuous support.
Fibermint - Fibermint is a company focusing on optical fiber communication solutions, committed to providing customers with high-quality customized optical fiber products.
SMT Ecosia Co., Ltd. - Trading of Used Electronics and Semiconductor Machines and Equipment
MIRTEC will showcase its complete line of 3D AOI and SPI Inspection Systems at Booth #2100 during the 2024 IPC APEX EXPO scheduled to take place April 9-11, 2024, at the Anaheim Convention Center. "MIRTEC will feature a total of seven systems specifically designed to address the full spectrum of inspection requirements associated with the Electronics Manufacturing Industry including two new state-of-the-art 3D AOI Solutions," stated Brian D'Amico, President of MIRTEC's North American Sales and Service Division....
Metrology | Test:
Keysight 4771A Series PCM Parametric Test System
(2) 2017 Tokyo Seimitsu Acctetech UF200R Auto Wafer Probers
Micromanipulator Prober with Keithley 4200A Parameter Analyzer
Rudolph Research/AutoEL III SS292 Elipsometer
Focused Test FTI-1000 Tester
ProFilm 3D Microscope
Lab:
Denton Desk V Vacuum System
Allied High Tech Products TechPrep Polishing System
Lindberg BlueM MO1440P3A-1 Mechanical Oven
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2022 Inline SMT Magazine Unloader
[2] 2022 Inline SMT Conveyors
[3] Juki KE2070E SMT Pick & Place
Juki KE2080E SMT Pick & Place
[2] Purex Filtration Systems
South-Tek Systems Nitrogen Generator
Various Juki Feeders
[2] 2022 Nordson / Yestech BX Benchtop AOI
2019 SCS PC V Coating System
2020 Vi Technology 5K 3D AOI
MVP Supra E AOI
Mydata Agilis M8 Magazines
& more ...
SMTA is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies.
IPC is a US-based trade association dedicated to the competitive excellence and financial success of its nearly 2,600 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly.