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SMTnet Express, October 24, 2019, Subscribers: 32,268, Companies: 10,908, Users: 25,250

Technical Library

Investigation of PCB Failure after SMT Manufacturing Process

Credits: ACI Technologies, Inc.

An ACI Technologies customer inquired regarding PCB failures that were becoming increasingly prevalent after the SMT manufacturing process. The failures were detected by electrical testing, but were undetermined as to the location and specific devices causing the failures. The failures were suspected to be caused predominately in the BGA devices located on specific sites on this 16 layer construction. Information that was provided on the nature of the failures (i.e., opens or shorts) included high resistance shorts that were occurring in those specified areas. The surface finish was a eutectic HASL (hot air solder leveling) and the solder paste used was a water soluble Sn/Pb(tin/lead).

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