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Reliability of BGA Solder Joints after Re-Balling Process

SMTnet Express October 4, 2012, Subscribers: 25550, Members: Companies: 9004, Users: 33746

Reliability of BGA Solder Joints after Re-Balling Process

First published in the 2012 IPC APEX EXPO technical conference proceedings.

by: M.H. Biglaria, A. Nazariana, R. Denteneera, M. Biglari, Jra, A.A. Kodentsov; Mat-Tech, Eindhoven University of Technology

Due to the obsolescence of SnPb BGA components, electronics manufacturers that use SnPb solder paste either have to use lead-free BGAs and adjust the reflow process or re-ball these components with SnPb balls. The reliability of Lead-Free and Lead-Containing solder joints for BGA's has been investigated after re-balling using optimal microscopy. The goal was to compare the quality of the connections for both options. For the lead-free BGA, voids produced by the release of volatile species in flux during soldering were present. Large voids have been observed at the interface component/solder...

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