Surface Mount Technology companies
Vi TECHNOLOGY is a worldwide global supplier of a wide range of innovative Automated Inspection AOI, 3D-SPI equipment and software solutions that provide real time data collection and correlation across the SMT line.
Vi TECHNOLOGY offers a range of products built around two main product categories that have in common Innovative Technology, Reliability and Flexibility.
Vi TECHNOLOGY has developed a wide range of in-line AOI systems that can be placed at any location throughout the line. Powered with Vectoral Imaging, these systems are the most accurate in the market and can inspect up to 400,000 components per hour.
Over the last few years, Vi TECHNOLOGY has developed advanced application software solutions in order to help its customers improve the productivity of their facilities and the quality of their products.
With its revolutionnary warp measurement, this system provides unmatched accuracy for 100% 3D Solder Paste Inspection. Vi TECHNOLOGY ®'s 3D-SPI is the world's first 3D Solder paste inspection
A compact, high speed and affordable AOI solution The 2K Series is an inspection and process control solution enabling a 100% defect detection including presence, absence, polarity, placement accuracy, OCV as well ...
The large board solution The 5K Series offers flexibility for wider board applications and benefits from all the latest Vi TECHNOLOGY® innovations, including Selective 3D AOI technology...
Dual lane system with a multi-segment board capability The 7K Dual Lane Series offers large-board capabilities up to 21’’ x 11’’ for each of the two lanes. The multi-segment...
Heavy Board Solution The 9K Heavy Board AOI is an inspection and process control solution dedicated to heavy PCBAs up to 15 kg and 21” x 24”. The 9K HB AOI has been designed ...
Feb 23, 2012 | Jean-Marc Peallat, Russ Warncke, Russell Claybrook, Marc Brun
Installed for the first time 20 years ago, Automated Optical Inspection (AOI) more recently has become an essential part of our SMT environment. Today, most process engineers are turning to machines as an inspection strategy for addressing quality and pro...
Jul 15, 2009 | Cathy Combet, Ming-Ming Chang, Product Managers, Vi TECHNOLOGY, France.
The increasing demand for smaller & smaller portable electrical devices is leading to the increasing usage of extremely small components in the SMT assembly lines. With the introduction of 01005 packages in mass production, all the different stages of the line are facing new challenges: from board design, through component placement to reflow process. Each stage introduces some specific types of defect which are considered impossible to repair due to the small size of the package. AOI has become an essential tool to enable good yield in the assembly of 01005....
May 30, 2007 | Jean-Jack Boumendil, Pascal Preti.
Transition to lead-free is accelerating and when considering constraints related to lead-free and conventional solder pastes, one concern is rising: flexibility. It would be dangerous to commit to lead-free only while the technology is not yet stabilized. Manufacturers need to consider all of the issues related to lead-free and need to find flexible equipment which are able to adapt to both conventional and lead-free constraints....
Apr 23, 2015 | Vi TECHNOLOGY is pleased to announce the establishment of Vi TECHNOLOGY GmbH, a wholly-owned subsidiary in Germany.
Apr 22, 2015 | Vi TECHNOLOGY announces that it has been awarded a 2015 EM Asia Innovation Award in the category of Test & Measurement / Inspection Systems – SPI for its Sigma Review Software. The award was presented to the company during an April 22, 2015 ceremony at the Shanghai World Expo Exhibition & Convention Center during NEPCON China.
Apr 21, 2015 | Vi TECHNOLOGY is pleased to announce that it was awarded a 2015 SMT China Vision Award in the category of Software – Process Control for its Sigma Review Software. The award was presented to the company during an April 21, 2015 ceremony at the Shanghai World Expo Exhibition & Convention Center during NEPCON China.
Apr 07, 2015 | Vi TECHNOLOGY will exhibit in Booth 7A-331 at SMT Hybrid Packaging, scheduled to take place May 5-7, 2015 at the Messe in Nuremberg, Germany.
Mar 18, 2015 | Vi TECHNOLOGY will exhibit in Booth #416 at National Electronics Week, scheduled to take place April 21-22, 2015 at the NEC in Birmingham. Company representatives will demonstrate complete SMT inspection solutions, including the PI series (SPI), K series (AOI) and Sigma Link software suite.
Mar 17, 2015 | Vi TECHNOLOGY will exhibit at NEPCON China 2015, scheduled to take place April 21-23, 2015 at the Shanghai World EXPO Exhibition & Convention Center. WKK will exhibit the PI Series (SPI) in Stand B-1E10 and First Technology will exhibit the K Series (AOI) in Stand C1-1E05.
Feb 25, 2015 | Vi TECHNOLOGY announces that it has been awarded a 2015 NPI Award in the category of Software – Process Control for its Sigma Review Software. The award was presented to the company during a Tuesday, Feb. 24, 2015 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO.
Feb 04, 2015 | Vi TECHNOLOGY will participate in the PCB manufacturing processes workshop, scheduled to take place April 21-23, 2015 at the Kintner Equipment Corp. facility in Endicott, New York. ACE Production Technologies, Inc. has partnered with Kintner Equipment Corp. to conduct the free workshop.
Feb 01, 2015 | Vi TECHNOLOGY announces that it has appointed a new Business Development Manager for Eastern Europe. Krisztián Kern will provide full sales support for Vi TECHNOLOGY’s customers in his respective territory.
Jan 22, 2015 | Vi TECHNOLOGY will exhibit in Booth #2523 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California.
903 North Bowser Suite 202
Richardson, Texas, 75081