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Vi TECHNOLOGY®, our inspection expertize is at your service
Vi TECHNOLOGY offers a range of products built around two main product categories that have in common Innovative Technology, Reliability and Flexibility.
Vi TECHNOLOGY has developed a wide range of in-line AOI systems that can be placed at any location throughout the line. Powered with Vectoral Imaging, these systems are the most accurate in the market and can inspect up to 400,000 components per hour.
Over the last few years, Vi TECHNOLOGY has developed advanced application software solutions in order to help its customers improve the productivity of their facilities and the quality of their products.
Vi TECHNOLOGY Postings
PI Series is a new generation 3D Solder Paste Inspection system that overcomes the limitations of traditional SPIs and satisfy all your inspection needs. The PI Series allows to easily implement Solder Paste Inspection in ...
The 2K Series is an inspection and process control solution enabling a 100% defect detection including presence, absence, polarity, placement accuracy, OCV as well as lifted lead inspection and sensitive solder joints & bridge...
The large board solution The 5K Series offers flexibility for wider board applications and benefits from all the latest Vi TECHNOLOGY® innovations, including Selective 3D AOI technology
Dual lane system with a multi-segment board capability The 7K Dual Lane Series offers large-board capabilities up to 21’’ x 11’’ for each of the two lanes. The multi-segment dual-lane conveyors ...
Heavy Board Solution The 9K Heavy Board AOI is an inspection and process control solution dedicated to heavy PCBAs up to 15 kg and 21” x 24”. The 9K HB AOI has been designed with best-in-class har...
Feb 23, 2012 | Jean-Marc Peallat, Russ Warncke, Russell Claybrook, Marc Brun
Installed for the first time 20 years ago, Automated Optical Inspection (AOI) more recently has become an essential part of our SMT environment. Today, most process engineers are turning to machines as an inspection strategy for addressing quality and pro...
Jul 15, 2009 | Cathy Combet, Ming-Ming Chang, Product Managers, Vi TECHNOLOGY, France.
The increasing demand for smaller & smaller portable electrical devices is leading to the increasing usage of extremely small components in the SMT assembly lines. With the introduction of 01005 packages in mass production, all the different stages of the line are facing new challenges: from board design, through component placement to reflow process. Each stage introduces some specific types of defect which are considered impossible to repair due to the small size of the package. AOI has become an essential tool to enable good yield in the assembly of 01005....
May 30, 2007 | Jean-Jack Boumendil, Pascal Preti.
Transition to lead-free is accelerating and when considering constraints related to lead-free and conventional solder pastes, one concern is rising: flexibility. It would be dangerous to commit to lead-free only while the technology is not yet stabilized. Manufacturers need to consider all of the issues related to lead-free and need to find flexible equipment which are able to adapt to both conventional and lead-free constraints....
Apr 16, 2018 | Vi TECHNOLOGY today announced that its products will be showcased at NEPCON China, scheduled to take place April 24-26, 2018 at the Shanghai World EXPO Exhibition & Convention Center.
Mar 01, 2018 | Vi TECHNOLOGY today announced that Tarak Charfi will present, “Preservation of the quality seal ‘Made in Germany’ through optimized processes in smart factories,” during the 6th annual InnovationsFORUM Germany on Wednesday, March 7, 2018 at the Kongresshall in Böblingen, Germany.
Feb 01, 2018 | Vi TECHNOLOGY today announced plans to exhibit at ENOVA France, scheduled to take place Feb. 7-8, 2018 at the Centre des congrès de Lyon, Cité internationale in Lyon, France. The company will showcase the PI 3D SPI system and Sigma Line module in Booth B28 with its agent eXelsius.
Jan 28, 2018 | Vi TECHNOLOGY will exhibit in Booth #3707 at the 2018 IPC APEX EXPO, scheduled to take place Feb. 27 - March 1, 2018 at the San Diego Convention Center, CA. The Vi TECHNOLOGY team is preparing for a busy show, with plans to showcase the 5K3D AOI system, 3D SPI system and new software module Sigma Line.
Oct 17, 2017 | Vi TECHNOLOGY will exhibit in Hall A2, Stand 421 at productronica 2017, scheduled to take place Nov. 14 – 17, 2017 at the Messe München in Germany. The Vi TECHNOLOGY team is preparing for a busy show, with plans to bring two 5K3D AOI systems and two PI 3D SPI systems as well as the new software module Sigma Line. productronica is the world’s leading trade fair for electronics development and production, and Vi TECHNOLOGY is bringing the latest innovations from its leading product line to offer live demos.
Sep 05, 2017 | Vi TECHNOLOGY will exhibit at ENOVA Paris, scheduled to take place Sept. 19-21, 2017 at the Paris Expo Porte de Versailles. Vi TECHNOLOGY will display its 5K3D AOI system coupled with the PI Series 3D SPI with its agent eXelsius in Hall 4, Booth 18.
Aug 23, 2017 | Vi TECHNOLOGY will exhibit in Booth # 1224 at SMTA International, scheduled to take place September 19-20, 2017 at the Donald Stephens Convention Center in Rosemont, IL. Vi TECHNOLOGY will display its 5K3D AOI coupled with the PI Series 3D SPI and SIGMA Link to create a complete inspection solution for smart factories.
Jul 18, 2017 | Vi TECHNOLOGY will exhibit at NEPCON South China, scheduled to take place August 29-31, 2017 at the Shenzhen Convention & Exhibition Center. The company will exhibit with three of its manufacturers’ representatives – WKK (Stand 1J65), AmericanTec (Stand 1G65) and First Tech (Stand 1H65). Vi TECHNOLOGY will display its 5K3D AOI and 8K 3D AOI systems coupled with the PI Series 3D SPI.
Jul 09, 2017 | Vi TECHNOLOGY today announced two new partnerships. The company has appointed Hinkofer as its manufacturers’ representative in Germany and G-Force Reps Ltd. as its representative in the South Central USA.
Jun 07, 2017 | Vi TECHNOLOGY today announced plans to participate in the InnovationsFORUM – Mexico, scheduled to take place June 14, 2017 at the Universidad Panamericana in Guadalajara. VP of Global Sales for Vi TECHNOLOGY Jean-Marc Peallat will present “Inspection, big data and zero defect line” during the event.