Electronics Manufacturing Technical Articles
Papers and articles related to SMT, PCB & EMS industry.
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1230 SMT / PCB Assembly Related Technical Articles
FTG is a leading North American manufacturer of high technology printed circuit boards and precision illuminated display systems.
Toronto, Ontario, Canada
Manufacturer of Assembled PCBs, Contract Manufacturer, Service Provider
PWB Interconnect Solutions Inc.
PWB Interconnect Systems Inc. is a Canadian company established in 1996. We design and manufacture test equipment and provide services to test the reliability of bare Printed Wiring/Circuit Boards (PWBs/PCBs). These products ...
Nepean, Ontario, Canada
Osaka University, or Handai, is a public research university located in Osaka Prefecture, Japan. It was one of Imperial Universities in Japan, one of the Designated National University and selected as a Top Type university ...
Osaka, Japan
National Cheng Kung University
National Cheng Kung University is a public research university located in Tainan, Taiwan. NCKU is one of the best comprehensive universities in Taiwan and a leader in promoting industry-academia cooperation. ...
Tainan City, Taiwan
Intel designs and builds the essential technologies that serve as the foundation for the world's computing devices.
Santa Clara, California, USA
Solder pastes, solder preforms, solder spheres, soldering fluxes, electrically-conductive adhesives. All alloys: tin-lead, lead-free, indium alloys, and more.
Utica, New York, USA
Solder pastes, solder preforms, solder spheres, soldering fluxes, electrically-conductive adhesives. All alloys: tin-lead, lead-free, indium alloys, and more.
Utica, New York, USA
With numerous facilities in the United States, we are one of the electronics industry's leading manufacturers of lead-free solder products, superior quality stencils, and precision cut parts.
Greeley, Colorado, USA
The University of Southampton is a research university in Southampton, England. The university's origins date back to the founding of the Hartley Institution in 1862. In 1902, the Institution developed into the Hartley University
Highfield, Southampton, United Kingdom
The ASM SMT Solutions segment is made up of SMT Printing Solutions (DEK) and SMT Placement Solutions (SIPLACE). Under the DEK brand, it sells best-in-class printing solutions for the electronics and solar industries.
Suwanee, Georgia, USA
Isola a global material sciences company focused on designing, developing, manufacturing and marketing copper-clad laminates and dielectric prepregs used to fabricate advanced multilayer PCBs.
Chandler, Arizona, USA
As a next-generation university, Concordia sets its sights further and more broadly than others. We align the quality of learning opportunities to larger trends and substantial challenges facing society. We pursue technology ...
Montreal, Quebec, Canada
Founded in 1419, it is the third-oldest university in Germany. It is the oldest and largest university in continental northern Europe and the Baltic Sea area, and 8th oldest in Central Europe.[3]
Rostock, Germany
A Non-destructive Approach to Identify Intermittent Failure Locations on Printed Circuit Cards (PCC) that have been Temperature Cycle Tested
Dec 07, 2020 | ACI Technologies, Inc.
Temperature cycling testing is a method of accelerated life testing done to PCCs that are exposed to normal operation temperature variations over its lifetime. During the testing, intermittent "open" failures can first occur at the hot and cold extremes of the test, exposing weaknesses in the design and assembly. A poor/weak solder joint fatigues, a via trace or barrel cracks, loose connections or a component fails all causing an intermittent open. When not at extreme temperatures, the PCC assembly relaxes, the "open" closes creating electrical connectivity. If you are monitoring the PCC under test in-situ you will know that an intermittent failure has occurred, and the test could be stopped for inspection. If in-situ monitoring was not implemented, you would not know if there were intermittent failures or not. The PCC gets powered up and works fine at room temperature....
Publisher: ACI Technologies, Inc. 
ACI, an authorized IPC Training Center operating the National Electronics Manufacturing Center of Excellence providing analytical testing, manufacturing and repair services to the electronics industry.
Philadelphia, Pennsylvania, USA
Design, IPC Standards Certification Center, Consultant, Service Provider, Training Provider
SMT007-MIRTEC Intelligent Factory Automation Article-November 2020
Dec 02, 2020 | Brian D'Amico
Industry 4.0 is a topic of much discussion within the electronics manufacturing industry. Manufacturers and vendors are trying to come to terms with what that means. In the most simplistic of terms, Industry 4.0 is a trend toward automation and data exchange within the manufacturing process. This basically requires connectivity and communication from machine to machine within the manufacturing line. The challenge is to collect data from each of the systems within the line and make that data available to the rest of the machines. Without test and inspection, there is no Industry 4.0. The whole purpose of test and inspection is to collect actionable data that may be used to reduce defects and maximize efficiency within the manufacturing line. The goal is to minimize scrap and get a really good handle on those process parameters that need to be put in place to manufacture products the right way the first time. For maximum efficiency, three inspection systems are required within the production line. These are solder paste inspection (SPI) post-solder deposition, automated optical inspection (AOI) post-placement, and AOI post-reflow. This requires a substantial investment; however, the combination of all three inspection machines is really the only true way to provide feedback for each stage of the manufacturing process....
Publisher: MIRTEC Corp
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MIRTEC has earned a solid reputation as one of the most Progressive and Dynamic Suppliers of Automated SMT Inspection Equipment to the Electronics Manufacturing Industry.
Oxford, Connecticut, USA
Isola a global material sciences company focused on designing, developing, manufacturing and marketing copper-clad laminates and dielectric prepregs used to fabricate advanced multilayer PCBs.
Chandler, Arizona, USA
Global manufacturer of XPM Reflow Ovens, ZEVA Selective Soldering and Delta Wave Soldering Equipment.
Camdenton, Missouri, USA
Manufacturer of Assembly Equipment, Soldering, Selective Soldering
Solder pastes, solder preforms, solder spheres, soldering fluxes, electrically-conductive adhesives. All alloys: tin-lead, lead-free, indium alloys, and more.
Utica, New York, USA
Engineering Physics Center of MSU
We're engaged in the development and sale of complex electronics, automation of experimental installations in laser physics, creation of automatic testing systems and diagnostics of printed circuit boards and electronic components
Moscow, Russia
Engineering Physics Center of MSU
We're engaged in the development and sale of complex electronics, automation of experimental installations in laser physics, creation of automatic testing systems and diagnostics of printed circuit boards and electronic components
Moscow, Russia
One of the world's leading suppliers of integrated production systems, chemistry, equipment, know-how and service for electroplating, semiconductor and printed circuit board manufacturing.
Berlin, Germany
Manufacturer of Assembly Material, Manufacturer of Components, Components / Substrates
Henkel is a manufacturer of materials for PCB and component assembly. The materials include Loctite adhesives, Multicore soldering products, Hysol encaps and underfills, and Power Devices thermal phase change pads.
Irvine, California, USA
Life. Energy. Environment. This triad of engineering priorities is perhaps unmatched in its potential for improving the quality of life for all inhabitants of planet Earth. And at the heart of all three is chemical engineering.
Stanford, California, USA
Ball Grid Array (BGA) Voiding Affecting Functionality
Nov 09, 2020 | ACI Technologies, Inc.
A customer contacted ACI Technologies regarding a high failure rate of their assemblies. They provided assemblies to be X-rayed and inspected for the purpose of identifying any process related issues such as (but not limited to) solder and assembly workmanship and evidence of damage due to moisture related problems during reflow (a.k.a. "popcorning"). Moisture damage usually appears as physical damage to the component. The first indication of moisture damage would be externally observable changes to the package in the form of bulging or fractures to the outer surface of the component, an example of which is shown in Figure 1. Internally observable indicators of moisture damage typically include fractures to the die inside the package and lifted or fractured wire bonds. These conditions would be apparent during transmissive X-ray inspection. Another symptom of moisture related damage would be inconsistent solder joint sizes that result from package deformation during the liquidus phase of the reflow process. None of these indicators of moisture related damage were present on the customer samples....
Publisher: ACI Technologies, Inc.
ACI, an authorized IPC Training Center operating the National Electronics Manufacturing Center of Excellence providing analytical testing, manufacturing and repair services to the electronics industry.
Philadelphia, Pennsylvania, USA
Design, IPC Standards Certification Center, Consultant, Service Provider, Training Provider
A leading supplier of precision cleaning chemistries to the worldwide electronics, metal finishing, medical, semiconductor, and optical industries.
Nashville, Tennessee, USA
Higher Defluxing Temperature and Low Standoff Component Cleaning - A Connection?
Nov 04, 2020 | Jigar Patel and Umut Tosun
OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remain on the substrate surface, potential failure mechanisms, including dendritic growth by electrochemical migration reaction and leakage current, may result. These failures have been well documented. If a decision to clean substrates is made, there are numerous cleaning process options available. For defluxing applications, the most common systems are spray-in-air, employing either batch or inline cleaning equipment and an engineered aqueous based cleaning agent. Regardless of the type of cleaning process adopted, effective cleaning of post solder residue requires chemical, thermal and mechanical energies. The chemical energy is derived from the engineered cleaning agent; the thermal energy from the increased temperature of the cleaning agent, and the mechanical energy from the pump system employed within the cleaning equipment. The pump system, which includes spray pressure, spray bar configuration and nozzle selection, is optimized for the specific process to create an efficient cleaning system. As board density has increased and component standoff heights have decreased, cleaning processes are steadily challenged. Over time, cleaning agent formulations have advanced to match new solder paste developments, spray system configurations have improved, and wash temperatures (thermal energy) have been limited to a maximum of 160ºF. In most cases, this is due to thermal limitations of the materials used to build the polymer-based cleaning equipment. Building equipment out of stainless steel is an option, but one that may be cost prohibitive. Given the maximum allowable wash temperature, difficult cleaning applications are met by increasing the wash exposure time; including reducing the conveyor speed of inline cleaners or extending wash time in batch cleaners. Although this yields effective cleaning results, process productivity may be compromised. However, high temperature resistant polymer materials, capable of withstanding a 180°F wash temperature, are now available and can be used in cleaning equipment builds. For this study, the authors explored the potential for increasing cleaning process efficiency as a result of an increase in thermal energy due to the use of higher wash temperature. The cleaning equipment selected was an inline cleaner built with high temperature resistant polymer material. For the analysis, standard substrates were used. These were populated with numerous low standoff chip cap components and soldered with both no-clean tin-lead and lead-free solder pastes. Two aqueous based cleaning agents were selected, and multiple wash temperatures and wash exposure times were evaluated. Cleanliness assessments were made through visual analysis of under-component inspection, as well as localized extraction and Ion Chromatography in accordance with current IPC standards....
Publisher: ZESTRON Americas
The globally leading provider of high precision cleaning products, services and training solutions in the electronics and semiconductor manufacturing industries.
Manassas, Virginia, USA
We provide custom software for industry. We develop engineering projects as well. Our electronic, control and mechanical engineers are at your service. Based in Barcelona.
Terrassa, Spain
Sanmina-SCI is a tier 1 provider of EMS and PWB along with vertically integrated capabilities from design through qualification.
San Jose, California, USA
With numerous facilities in the United States, we are one of the electronics industry's leading manufacturers of lead-free solder products, superior quality stencils, and precision cut parts.
Greeley, Colorado, USA
MiTAC International Corporation
MiTAC Holdings Group has been developing into a multinational organization of JDM / ODM / OEM / OPM (Original Product Manufacture), design and R&D, manufacturing, testing, assembling, marketing, and servicing in around four decade
Taoyuan City, Taiwan
AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
Mission: First choice for advanced applications Mission: We set the highest quality standards in our industry. We industrialize leading-edge technology. We care about people. We reduce our ecological footprint. We create value.
Leoben, Austria
Development of Character, Search for the Truth, and Service to Society Founded in 1954 to fulfill the dearest wish of empowering and bringing prosperity to the nation, Inha University stands for the Ideals of building students'
Incheon, South Korea
Epoxy Technology, Inc., founded in 1966, is a pioneer in the development and manufacture of Specialty Epoxy, UV & UV Hybrid adhesives to meet key performance standards needed in high-tech applications.
Billerica, Massachusetts, USA
Henkel is a manufacturer of materials for PCB and component assembly. The materials include Loctite adhesives, Multicore soldering products, Hysol encaps and underfills, and Power Devices thermal phase change pads.
Irvine, California, USA
FinCRM holds expertise in providing Customer Relationship Management (CRM) software and Full Stack Office Management solutions.
Pune, India
Continued strength Our faculty, students and staff have redoubled their collaborative efforts to strengthen, grow and broaden the programs in the School of Electrical, Computer and Energy Engineering. The school's continued streng
Tempe, Arizona, USA
Life. Energy. Environment. This triad of engineering priorities is perhaps unmatched in its potential for improving the quality of life for all inhabitants of planet Earth. And at the heart of all three is chemical engineering.
Stanford, California, USA
DEM develops and markets highly sophisticated materials used in the electronic materials segment of the global electronics value chain.
Marlborough, Massachusetts, USA
Research, development, manufacturing and marketing of sophisticated chemical products developed by applying fine chemicals and nano-technologies in cutting-edge fields such as home information appliances, IT, semiconductors, batte
Tokyo, Japan
Production and distribution of metal jointing materials for electronics (solder, flux, brazing alloys, etc) Sales of nonferrous metal Export-import business
Osaka, Japan
Flex Ltd. is an American Singaporean-domiciled multinational electronics contract manufacturer. It is the third-largest global electronics manufacturing services, original design manufacturer company by revenue, behind only ...
Milpitas, California, USA
Seamark ZM PCB BGA X-ray Inspection system Equipment -14 years experience in SMT field, Our experience will provide good solutions. X-Ray Inspection, BGA reworks tation,Full auto X ray SMD component machine
Shenzhen, China, China
Institute for Factory Automation and Production Systems (FAPS)
At the Technical Faculty (TF) of the Friedrich-Alexander-Universität Erlangen-Nürnberg (FAU) more than 20 engineering and computer science courses are offered. The TF has an excellent reputation in science and business.
Nuremberg, Germany
Xi'an Jiaotong University is a C9 League university with strengths in engineering, technology, management, and life sciences located in Xi'an, Shaanxi, China. It is a Chinese Ministry of Education Class A Double First Class Univ.
Xi'an, Shaanxi, China
The Faculty of Engineering and the Built Environment (FEBE) is one of the seven faculties in the University of Johannesburg. It offers both Engineering Technology and Engineering Science undergraduate and postgraduate programmes..
Johannesburg, South Africa
Averatek Corporation is a high tech company based in Santa Clara, CA that provides custom design services and patterned circuit board materials manufactured through the use of an innovative, proprietary process.
Santa Clara, California, USA
One of the world's leading suppliers of integrated production systems, chemistry, equipment, know-how and service for electroplating, semiconductor and printed circuit board manufacturing.
Berlin, Germany
Manufacturer of Assembly Material, Manufacturer of Components, Components / Substrates
Reworking ALD Coatings
Sep 02, 2020 | ACI Technologies, Inc.
Atomic layer deposition (ALD) is a process of creating coatings on a molecular layer by layer basis. Using an iterated sequence of self-saturating deposition cycles that are self-terminating, a single layer can be deposited at a time, allowing for highly uniform films with complete conformality. The composition of the film typically used for coating printed wiring boards (PWBs) is a high alumina (Al2O3) sequential deposition of alumina and titania capped with a corrosion protective titanium aluminate layer, most notably ALD-Cap from Sundew Technologies, LLC. Rework is a process of restoring an electronics assembly to full functionality to prolong equipment life and reduce the amount of scrap. The process typically involves:...
Publisher: ACI Technologies, Inc.
ACI, an authorized IPC Training Center operating the National Electronics Manufacturing Center of Excellence providing analytical testing, manufacturing and repair services to the electronics industry.
Philadelphia, Pennsylvania, USA
Design, IPC Standards Certification Center, Consultant, Service Provider, Training Provider
