SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Advanced Thermal Solutions, Inc


High Performance Cooling Solutions for 1U Applications

Oct 26, 2004

Norwood, MA, September 21, 2004 Advanced Thermal Solutions, Inc. (ATS) has introduced a line of low profile heat sinks designed for passive cooling of Intel Xeon�� processors in narrow 1U servers. New blackDIAMOND�� heat sinks are made from solid aluminum and are void of the interfacial thermal resistances in bonded heat sinks. The aluminum is anodized, and the heat sinks are available with choices of thin heat fin pattern designs to optimize heat dissipation in enclosures with varying levels of available airflow. These heat sinks can permanently replace heavier, copper-based fan-sinks that are more expensive and have limited work lives.

blackDIAMOND heat sinks are 30 mm high by 64 mm wide by 89 mm long for precision mounting on Xeon processors and other CPUs used in 1U packages, including the Intel P4, and the AMD Opteron�� and Athlon�� 64. The sinks range from 144 to 162 grams in weight, making them much lighter than typical 1U heat sinks of either passive or integrated fan design.

blackDIAMOND heat sinks provide thermal resistance as low as 0.28 C/W with air velocity of 800 ft/min. They are available with or without thermal interface materials and are attached with standard mounting clips. More information on blackDIAMOND heat sinks is available from the Advanced Thermal Solutions website, http://www.qats.com, or by calling 781-769-2800.

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