SMT, PCB Electronics Industry News

High Performance Cooling Solutions for 1U Applications

Oct 26, 2004

Norwood, MA, September 21, 2004 Advanced Thermal Solutions, Inc. (ATS) has introduced a line of low profile heat sinks designed for passive cooling of Intel Xeon�� processors in narrow 1U servers. New blackDIAMOND�� heat sinks are made from solid aluminum and are void of the interfacial thermal resistances in bonded heat sinks. The aluminum is anodized, and the heat sinks are available with choices of thin heat fin pattern designs to optimize heat dissipation in enclosures with varying levels of available airflow. These heat sinks can permanently replace heavier, copper-based fan-sinks that are more expensive and have limited work lives.

blackDIAMOND heat sinks are 30 mm high by 64 mm wide by 89 mm long for precision mounting on Xeon processors and other CPUs used in 1U packages, including the Intel P4, and the AMD Opteron�� and Athlon�� 64. The sinks range from 144 to 162 grams in weight, making them much lighter than typical 1U heat sinks of either passive or integrated fan design.

blackDIAMOND heat sinks provide thermal resistance as low as 0.28 C/W with air velocity of 800 ft/min. They are available with or without thermal interface materials and are attached with standard mounting clips. More information on blackDIAMOND heat sinks is available from the Advanced Thermal Solutions website, http://www.qats.com, or by calling 781-769-2800.

Jul 28, 2011 -

Bench Top Wind Tunnel Demonstrates ATS Innovations in Thermal Management Instrumentation

Apr 19, 2018 -

ULT LLC cooperates with GulfTech

Apr 18, 2018 -

MicroCare Presents its Latest Advancements in Cleaning at SMT Hybrid Packaging

Apr 18, 2018 -

SMTA Europe's Harsh Environments Conference Session 6 to Focus on Automotive Electronics

Apr 18, 2018 -

IPC Hand Soldering Competition Winner Crowned at Global Industrie/Midest 2018 in Paris

Apr 18, 2018 -

Koh Young Presenting on 3D Technologies at SMTA Rocky Mountain Chapter Technical Session

Apr 17, 2018 -

International Conference for Electronics Enabling Technologies (ICEET) Program Finalized

Apr 17, 2018 -

Seika Announces Plans for Optimized Drying Units to be Incorporated into all McDry Cabinets

Apr 17, 2018 -

Libra Industries Sponsors SMTA Ohio Valley Membership Appreciation Golf Outing

Apr 17, 2018 -

Preview for AdoptSMT for SMT 2018, Stand A4-458 We keep your production running -

Apr 17, 2018 -

cost saving SMT laser cut stencil

See electronics manufacturing industry news »

High Performance Cooling Solutions for 1U Applications news release has been viewed 1141 times

TWEEZER-VAC ELITE Vacuum SMD Tweezer Kit

Fluid Dispense Pump Integration