Advanced Thermal Solutions, Inc
A leading engineering and manufacturing company supplying a wide range of heat sinks and laboratory-quality thermal instrumentation, together with thermal design consulting.
Advanced Thermal Solutions, Inc (ATS) is a leading-edge engineering/manufacturing company focused on the thermal management of electronics. Founded in 1989 as a consulting company, ATS has evolved to a complete thermal solutions provider and is world renown for its portfolio of more than 450 high- and ultra performance heat sinks, research-quality test equipment, and leading-edge R&D. In the interval of three years, ATS has established its own manufacturing center in the U.S., developed strategic partnerships with Asian manufacturers and opened ATS-Europe, its sales and engineering office in Holland. As ATS has significantly increased its customer base, its product offerings have also expanded to include Advanced Fan Trays, Liquid Cooling Systems, Advanced Cooling Systems and Next-Generation Thermal Test Instruments.
Manufacturing Capabilities
From its state-of-the-art, US-based rapid prototyping and production facilities to its multiple strategic partners positioned in Europe and Asia, ATS has the capability to meet virtually any metal fabrication requirement with dual sourcing options and ISO certified partners globally. ATS manufacturing in the U.S. boosts the latest machining centers and fin-milling facilities in order to product tight fin-pitch tolerances in a cost-effective manner. In addition, the facilities support a unique RF brazing capability for the purpose of manufacturing ATS’ patent Single-Fin Assembly Technology that yields an unprecedented 67 fins per inch (26 fins per cm) for high-power, high-flow cooling applications.
Advanced Thermal Solutions, Inc Postings
4 products »
BGA Heat Sink (High Aspect Ratio Ext.) High efficiency pin fin design provides low pressure drop characteristics Large surface area increases heat sink performance Fabricated fr...
Slant Fin BGA Heat Sink (High Aspect Ratio Ext.) Features a low profile, slant fin array that offers many of the performance benefits of maxiFLOW™ at a great value Fabricated from extrud...
Straight Fin BGA Heat Sink (High Aspect Ratio Ext.) High aspect ratio, straight fin heat sinks that are ideal for compact PCB environments Fabricated from extruded aluminum, w...
The BWT-104WA is a research quality, open loop, benchtop wind tunnel for thermal characterization of components, circuit boards and cooling devices such as heat sinks, heat exchangers and cold plates. The polynomial shape and internal flow mana...
1 technical article »
Air Flow Measurement in Electronic Systems
Jul 28, 2011 | Advanced Thermal Solutions, inc.
Electronic circuit boards create some of the most complex and highly three dimensional fluid flows in both air and liquid. The combination of open channel (clearance to the next card above the components) and large protrusions (components, e.g., BGAs, PQF...
4 news releases »
Pin and Slant Fin Heat Sinks Offer Economical Electronics Cooling
Mar 09, 2022 | Pin and Slant Fin Heat Sinks Offer Economical Electronics Cooling
New fanSINKSTM Cool Hot Components in Sizes from 27mm to 70mm
Oct 28, 2021 | Advanced Thermal Solutions, Inc. (ATS) now provides fanSINKSTM heat sinks for component sizes ranging from 27mm to 70mm square. The wider size range accommodates hot semiconductor components, including FPGAs, ASICS and other package types used in telecomm, optics, test/measurement, military and other applications.
Bench Top Wind Tunnel Demonstrates ATS Innovations in Thermal Management Instrumentation
Jul 28, 2011 | Advanced Thermal Solutions, Inc, (ATS), continues its innovations in electronics thermal management with the BWT-104 Bench Top Wind Tunnel. The BWT-104 is a research quality, open loop wind tunnel for thermally characterizing components, circuit boards and cooling devices such as heat sinks, heat exchangers and cold plates.
High Performance Cooling Solutions for 1U Applications
Oct 26, 2004 | Passive Cooling of Intel XEON Processors
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