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Dr. Wusheng Yin, to Speak at IMAPS New England Symposium & Expo 2015

Mar 20, 2015

(Albany, NY) March 20, 2015. Dr. Wusheng Yin, President of YINCAE Advanced Materials LLC, will be presenting in the Technical Sessions on “The Future of Solder Joint Encapsulation” at the upcoming IMAPS New England Symposium & Expo 2015. The conference will be held on May 5th at the Holiday Inn Conference Center in Boxborough, Massachusetts.

The topic of the session focuses on the issues the electronics industry is currently facing, with increased package on package, and system on package miniaturization. Dr. Yin will address these issues with an innovative, high reliability solution. See an excerpt of the presentation below:

“Solder joint encapsulant adhesives have been successfully used for many years by major electronics manufacturers to enhance the strength of solder joints. These products have proven to strengthen solder joints 5-10x over traditional methods, and have greatly improved thermal cycling during the soldering process as well as the drop performance in the finished products. The use of solder joint encapsulant adhesives can eliminate the need for underfill materials and the underfill process altogether, thus simplifying rework, which results in a lower cost of ownership. Solder joint strength, however, continues to be a problematic issue with increased package on package and system on package miniaturization.”

We are looking forward to seeing you at this symposium, and will be available to talk about our products and answer any questions that you may have. We have exclusive products unique in the industry. There is a lot that can be taken away from not only Dr. Yin’s presentation, but from IMAPS New England Symposium & Expo 2015 as a whole. We hope to see you there! If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us by clicking the following link: YINCAE Website.

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YINCAE Advanced Materials, LLC is a leading manufacturer and supplier of high-performance coatings, adhesives and encapsulants used in in the computer microchip and optoelectronics industries. Our manufacturing operations and headquarters are located in Albany, NY USA, with technical sales and support available through a worldwide sales and service organization.


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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC

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