The Effects of Silver Content and Solidification Profile on the Anand Constitutive Model for SAC Lead Free Solders
Published: |
June 14, 2023 |
Author: |
Munshi M. Basit, Mohammad Motalab, Jordan C. Roberts, Jeffrey C. Suhling, Pradeep Lall |
Abstract: |
In the electronic packaging industry, it is important to be able to make accurate predictions of board level solder joint reliability during thermal cycling exposures. The Anand viscoelastic constitutive model is often used to represent the material behavior of the solder in finite element simulations. This model is defined using nine material parameters, and the reliability prediction results are often highly sensitive to the Anand parameters. In this work, an investigation on the Anand constitutive model and its application to SAC solders of various Ag contents (i.e. SACN05, with N = 1, 2, 3, 4) has been performed. For each alloy, both water quenched (WQ) and reflowed (RF) solidification profiles were utilized to establish two unique specimen microstructures, and the same reflow profile was used for all four of the SAC alloys so that the results could be compared and the effects of Ag content could be studied systematically.... |
You must be a registered user to talk back to us. |
Company Information:
More articles from Auburn University »
- Sep 26, 2023 - Analysis of the Mechanical Behavior, Microstructure, and Reliability of Mixed Formulation Solder Joints
- Oct 31, 2022 - Effect Of Vacuum Reflow On Solder Joint Voiding In Bumped Components
- Oct 31, 2022 - Surfaces of mixed formulation solder alloys at melting
- Oct 11, 2022 - ASSESSMENT OF ACCRUED THERMO-MECHANICAL DAMAGE IN LEADFREE PARTS DURING FIELD-EXPOSURE TO MULTIPLE ENVIRONMENTS
- Feb 16, 2017 - Component Level Reliability For High Temperature Power Computing With SAC305 And Alternative High Reliability Solders
- See all SMT / PCB technical articles from Auburn University »
More SMT / PCB assembly technical articles »
- Mar 19, 2024 - What is Underfill | GPD Global
- Mar 19, 2024 - Made in Japan: Solder Paste Jet Dispensing Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 26, 2024 - Precision Control in Electronic Assembly: Selective Wave Soldering Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 02, 2024 - Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Dec 27, 2023 - Revolutionizing Tech: SMT Auto IC Programming Machine Mastery | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Browse Technical Library »
The Effects of Silver Content and Solidification Profile on the Anand Constitutive Model for SAC Lead Free Solders article has been viewed 306 times