Effect of Soldering Parameters on Reaction Kinetics and Phase Transformations of SAC 305 Solder
Published: |
July 8, 2010 |
Author: |
T. Ryno, A. Kelley, J. Metzger, and D. Medlin; Department of Materials and Metallurgical Engineering, South Dakota School of Mines and Technology | C. Voyles, S. Richards; Radiance Technologies |
Abstract: |
As technology becomes increasingly reliant on electronics, understanding the reliability of lead-free solder also becomes increasingly important. This research project focused on phase transformation kinetics with the lead-free solder SAC 305. Today in the electronics industry, SAC 305 is the most widely used solder, making it a high priority to understand its long-term stability and performance in a variety of service conditions. Recent evidence has shifted the focus from thermal aging to reflow temperature and time above liquidus values during initial solder melting.... |
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