3D ICs With TSVs - Design Challenges And Requirements
Published: |
December 9, 2010 |
Author: |
Cadence |
Abstract: |
As demands accelerate for increasing density, higher bandwidths, and lower power, many IC design teams are looking up – to 3D ICs with through-silicon vias (TSVs). 3D ICs promise “more than Moore” integration by packing a great deal of functionality int... |
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