Technical Articles From Universiti Teknologi Malaysia
Read technical articles about electronics manufacturing added by Universiti Teknologi Malaysia
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2 technical articles added by Universiti Teknologi Malaysia
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Effect of Reflow Profile on Intermetallic Compound Formation
Oct 24, 2013 | I. Siti Rabiatull Aisha, A. Ourdjini, M. A. Azmah Hanim, O. Saliza
Reflow soldering in a nitrogen atmosphere is a common process consideration in surface mount technology assembly. This is because the use of nitrogen in reflow equipment may benefit the process as well as the quality of the end product, where it can increase the reliability of the solder joint. (...) The present study investigated thoroughly the effect of different reflow soldering atmosphere, which is air and nitrogen on IMC formation and growth...
A Printed Circuit Board Inspection System With Defect Classification Capability
Aug 15, 2013 | I. Ibrahim, S. Bakar, M. Mokji, J. Mukred, Z. Yusof, Z. Ibrahim, K. Khalil, M. Mohamad
An automated visual PCB inspection is an approach used to counter difficulties occurred in human’s manual inspection that can eliminates subjective aspects and then provides fast, quantitative, and dimensional assessments. In this study, referential approach has been implemented on template and defective PCB images to detect numerous defects on bare PCBs before etching process, since etching usually contributes most destructive defects found on PCBs. The PCB inspection system is then improved by incorporating a geometrical image registration, minimum thresholding technique and median filtering in order to solve alignment and uneven illumination problem. Finally, defect classification operation is employed in order to identify the source for six types of defects namely, missing hole, pin hole, underetch, short-circuit, mousebite, and open-circuit....
