Effect of Reflow Profile on Intermetallic Compound Formation
Published: |
October 24, 2013 |
Author: |
I. Siti Rabiatull Aisha, A. Ourdjini, M. A. Azmah Hanim, O. Saliza |
Abstract: |
Reflow soldering in a nitrogen atmosphere is a common process consideration in surface mount technology assembly. This is because the use of nitrogen in reflow equipment may benefit the process as well as the quality of the end product, where it can increase the reliability of the solder joint. (...) The present study investigated thoroughly the effect of different reflow soldering atmosphere, which is air and nitrogen on IMC formation and growth... |
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