Technical Articles From BTU International
Read technical articles about electronics manufacturing added by BTU International
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5 technical articles added by BTU International
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Operation of a Vacuum Reflow Oven with Void Reduction Data
Apr 21, 2021 | Fred Dimock
Voids affect the thermal characteristics and mechanical properties of a solder joint, thereby affecting the reliability of the solder interconnect. The automotive sector in particular is requiring the mitigation of solder voids in various electronic control modules to the minimum possible level. Earlier research efforts performed to decrease voids involved varying the reflow profile, paste deposit, paste alloy composition, stencil aperture, and thickness....
Thermal Profiles - Why Getting Them Right is Important
Oct 24, 2019 | Fred Dimock
Presentation given by Fred Dimock during a seminar at the American Competitiveness Institute, ACI. •Recipe vs. Profile •Material Properties •Why profiles are shaped like they are. •Obtaining profiles •TC Accuracy •Profilers •Test vehicles •Process Window – Eutectic vs. Lead Free •Heat transfer •Oven Control...
Lead-Free Solder Wafer Bumping
Dec 06, 2007 | Fred Dimock, Kristen Mattson.
Over the past 30 years we have learned that lead has negative affects on the health of humans and seen strong legislation remove it from gasoline and paints. More recently, governments in Europe and Asia have set deadlines to remove lead from consumer electronic devices that use printed circuit boards. Currently, the ban is not being applied to high reliability applications such as military or medical devices, but we all know that will come someday soon. Likewise many believe that lead free solder is coming to wafer bump reflow and are beginning to make the transition....
Making A Case for Continuous Furnaces
Nov 08, 2007 | Fred Dimock
A continuous furnace is ideal for processes requiring high production volumes, process consistency, and precision control. This overview discusses some of the newer temperature and atmosphere capabilities of continuous furnaces and addresses the various components that make up a continuous furnace....
Maximizing Process Control with Controlled Convection Rates
Oct 10, 2007 | Rob DiMatteo, Fred Dimock, Pierre LeMieux.
Process engineers, who are seeking to achieve the most effective and reproducible thermal transfer process, look to today's forced convection ovens for applications such as flipchip, BGA, and lead-free soldering. A forced convection process to maximize thermal uniformity can be best accomplished by employing static pressure generation in what's known as "closed loop convection"....
