Operation of a Vacuum Reflow Oven with Void Reduction Data
Published: |
April 21, 2021 |
Author: |
Fred Dimock |
Abstract: |
Voids affect the thermal characteristics and mechanical properties of a solder joint, thereby affecting the reliability of the solder interconnect. The automotive sector in particular is requiring the mitigation of solder voids in various electronic control modules to the minimum possible level. Earlier research efforts performed to decrease voids involved varying the reflow profile, paste deposit, paste alloy composition, stencil aperture, and thickness.... |
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