Testing of electronic assemblies involves three elements: the device under test, test equipment, and fixturing to make the connections between them. The challenge for a test engineer building a sophisticated test system is that instrumentation may need to measure thousands of test points through the mechanical interconnect ...
Quality Control is essential in production processes. In the PCB Assembly process there are several Quality Control steps or options. The most popular tests are the electrical (In-Circuit or ICT) and the function (functional or FCT/FVT) test. ICT test fixtures are standardized and there are several ...
In-circuit test (ICT) has remained one of the most popular and cost-effective test methods for medium and high volume printed circuit board assembly (PCBA) for many years. This is due to its component-level fault diagnosis capability- and its speed.
This paper will outline and define what requirements must be adhered to for the OEM community to truly achieve the IPC class product from the Electrical Test standpoint. This will include the test point optimization matrix, Isolation (shorts) parameters and Continuity (opens) parameters. This paper ...
Calibration Certificates Missing Recal Dates -- I recently went through an AS9100D audit and discovered one of my equipment manufacturer's calibration certificates and stickers do not have a recal/expiration date. I realize ISO17025 stipulates the user is responsible for determining appropriate calibration intervals; however in practice almost all cal certs I've seen contain manufacturer-supplied recal/expiration dates except those from this one supplier. We were able to convince our auditor this was ok by virtue of thorough documentation. However I'm interested in hearing about others' experiences with this question. I'm afraid a different future auditor might have a stricter interpretation of this absence, and view it is a red flag indicating poor supplier control. How have others handled this omission?
Castellated Module Reflow Problems -- We are producing a board that contains an RN4678 bluetooth module, and an STLINK-V3MODS module, both of which are castellated modules. I am constantly having issues with the modules being soldered to the PCB incorrectly. It seems that the RN4678 'bows' sometimes, towards the end with the antenna, and on the STLINK-V3MODS it appears that the solder does not wick up some of the pads occasionally. What could be the causes for these issues? Right now I am solving these issues by hand which is time consuming and annoying, and I cannot find much, if any, information about castellated reflow at all -- Attachments
IPC is now accepting abstracts for IPC E-Textiles 2023, the international conference for the e-textiles industry, to be held live and in-person on Monday, January 23, 2023, in San Diego ...
HJS-7100 is an off-line PCBA cleaning mahcine. It is a compact, energy-saving and environmental protection machine. HJS-7100 is used to wash off flux residual, solder balls, partichles on PCBA, such as: rosin ...
SMTA is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies.
IPC is a US-based trade association dedicated to the competitive excellence and financial success of its nearly 2,600 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly.