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SMTnet Express, December 5, 2013, Subscribers: 26400, Members: Companies: 13507, Users: 35490

Impact of FPC Fabrication Process on SMT Reliability

by Susie Krzmarzick, John Dzarnoski, Yangjun Xing; Starkey Hearing Technologies

The functionality of electronic devices continues to increase at an extraordinary rate. Simultaneously consumers are expecting even more and in ever smaller packages. One enabler for shrinking electronics has been the flexible circuit board that allows the circuit board to fit a wide variety of shapes. Flexible printed circuits (FPC) have the capability to be very thin and can have unpackaged components directly attached using surface mount technology (SMT) and flip chip on flex technologies. Bare die can also be thinned and attached very close to the circuit board. However one caveat of high density flexible circuit boards with thin die is that they can be very fragile. The use of back side films and underfill can protect the die making circuits more robust. For underfill to work well it requires good adhesion to the circuit board which can mean that flux residues under the die normally must be removed prior to underfilling.

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IPC APEX EXPO 2014

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