Surface Mount Technology Industry Directory

Surface Mount Technology companies


YINCAE Advanced Materials, LLC.

Yincae Advanced Materials, LLC is a developer, manufacturer, and supplier of high performance coatings, adhesives, electronic and optoelectronic materials.

Manufacturer of Assembly Material, Components/Substrates, Contract Manufacturer

The Global Leader in Solder Joint Encapsulants, Nanofilms, and Underfils.

The YINCAE brand is a name recognized worldwide as an industry leader in the development of advanced mirco-electronic grade materials used in the computer microchip and optoelectronics industries.

YINCAE products are designed to facilitate smarter and faster production for customers at lower costs without sacrificing quality. We are committed to meeting the demands of rapidly advancing industries while supporting green initiatives.

YINCAE Advanced Materials, LLC. Postings
19 products »
BP 256 Ball Attach Adhesive

BP 256 ball attach adhesives have been designed to enhance solder joint reliability and eliminate cleaning process for ball bumping process of CSP, BGA, Flip chip and PoP (package on package) and so on, particularly for lead free application. Duri...

Materials

BP 256 Ball Attach Adhesive
SMT 158D High Thermal Conductive Underfill

SMT 158D high thermal conductive underfill is a capillary flow underfill, low temperature cure, fast flowing, easy reworking liquid epoxy which can be used as a underfill for flip chip, chip scale package, ball grid array devices, package on packa...

Materials

SMT 158D High Thermal Conductive Underfill
SMT 256EP Solder Joint Encapsulant Paste

SMT256EP solderable adhesive is self-leveling and self-soldering adhesives, which has been designed for high temperature Pb-free application. By comparison with conductive adhesives (Ag), SMT256EP solderable adhesive has higher stable electrical a...

Materials

SMT 256EP Solder Joint Encapsulant Paste
SMT 266 Solder Joint Encapsulant

SMT266 offers all the features and advantages of our SMT256 series, in a convenient jetting adhesive form (and can also be brushed on during rework).  SMT 266 series spray adhesives have been designed to enhance solder joint reliabi...

Materials

SMT 266 Solder Joint Encapsulant
SMT 256B Solder Joint Encapsulant

SMT 256B series dip adhesives have been designed to enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA, Flip chip and PoP (package on package), particularly for lead free application. SMT 256B is a kind of polymer ad...

Materials

SMT 256B Solder Joint Encapsulant
WL 66O Optical Lens Adhesive

WL 66O is one part 100% solid, dual cure UV bonding adhesives, which has been designed for wafer-level lens or optical lens attachment. It can be cured by UV in a few seconds to achieve fast fixing purpose, then further cured by thermal cure to ac...

Materials

WL 66O Optical Lens Adhesive
TM 150 Solderable Conductive Adhesive

TM 150 series solderable conductive adhesives is rapid cure, self-filling, self-leveling and self-soldering adhesives which can be used as die attach adhesives for LED, CSP, QFP, and so on, to replace conductive adhesives (Ag) or solder materials ...

Materials

TM 150 Solderable Conductive Adhesive
LEN 66A Optical Bonding Adhesive

LEN 66A is one part 100% solid, super fast UV curable bonding adhesives, which has been designed for lens attachment, protective cover windows and touch screens. It can also be used for LCD lamination and sealing, polarizer lamination and touch sc...

Materials

LEN 66A Optical Bonding Adhesive
ACP 120 Anti-Oxidation Solderable Coating

ACP 120 series are an anti-oxidation solderable coatings, which have been designed for anti-corrosion and rusting for metal surfaces such as nickel, steel, aluminum and other metals; solderable surfaces on which solder paste, solder preform or sol...

Materials

ACP 120 Anti-Oxidation Solderable Coating
DA 90 Die Attach Adhesive

DA 90 is a silver filled, high thermal conductive, solvent-free and fast curing thermosetting die attach adhesives. DA 90 has excellent adhesion to the substrate and bare die. It can be used for small and large die attach. It can be applied using ...

Materials

DA 90 Die Attach Adhesive
SMT 88U Underfill Series

World's First Super Fast Low Temperature Underfill. SMT88U is an adhesive, which combines the advantages of fast cure in UV adhesives, and the better reliability of capillary underfill. It can be underfilled at room temperature wit...

Materials

SMT 88U Underfill Series
SMT 158 Capillary Underfill

Yincae’s SMT 158 Capillary Underfill is a combination of capillary flow and no-flow underfills, rapid curing, fast flowing and easy reworking liquid epoxy that can be used as an underfill for chip scale packages, ball grid array devices, PoP...

Materials

SMT 158 Capillary Underfill
SMT 156 Solderable Adhesives

Our SMT156 solderable conductive adhesives are rapid cure, self-leveling and self-soldering adhesives, which can be used as assembly adhesives to replace solder paste for SMT product lines. SMT156 eliminates all bare die packaging processes from d...

Materials

SMT 156 Solderable Adhesives
DA 150 Die Attach Adhesive

Our DA150 series are solvent-free and fast cure thermosetting electrical and thermal conductive die attach adhesives. DA150 has excellent adhesion to the substrate and bare die. It can be used for small and large die attach. Both dispense and prin...

Materials

DA 150 Die Attach Adhesive
SMT 160 Flip Chip Underfill

SMT160 underfill is a combination of capillary flow and no-flow underfill. It is a rapid curing, super-fast flowing, easy reworking liquid epoxy, which can be used as an underfill for chip scale package, ball grid array devices, package on package...

Materials

SMT 160 Flip Chip Underfill
SMT 256 Solder Joint Encapsulant

World's First Solder Joint Encapsulant Perfect solution for customers looking to eliminate underfilling processes. The SMT 256 Individual Solder Joint Encapsulation Adhesive is the world’s first combined flux gel/...

Materials

SMT 256  Solder Joint Encapsulant
TGP 110 Thermal Conductive Adhesives

Our TGP110 thermal conductive adhesives is a series of reactive thermal grease with very thin BLT that eliminates micro-bubbles at the rough interface when applied. In service time, it can be cured to form thermal gel or thermal pad but with the p...

Materials

TGP 110 Thermal Conductive Adhesives
TM 230 Solderable Conductive Adhesives

TM230 solderable conductive adhesives are rapid cure, self-filling, self-leveling and self-soldering adhesives which can be used as die attach adhesives for LED, CSP, QFP, among others, to replace conductive adhesives (Ag) or solder materials such...

Materials

TM 230 Solderable Conductive Adhesives
UVC Conformal Coating Materials

UVC88P is a highly fluorescing, one part, 100% solid, dual cure acrylated polyurethane rigid conformal coating. It provides excellent chemical resistance, surface hardness, flexibility, and moisture resistance. UVC88P features excellent adhesion t...

Coating Materials

UVC Conformal Coating Materials
13 technical articles »
A High Thermal Conductive Solderable Adhesive

Nov 17, 2016 | Dr. Mary Liu and Dr Wusheng Yin

With increasing LED development and production, thermal issues are becoming more and more important for LED devices, particularly true for high power LED and also for other high power devices. In order to dissipate the heat from the device efficiently, Au80Sn20 alloy is being used in the industry now. However there are a few drawbacks for Au80Sn20 process: (1) higher soldering temperature, usually higher than 320°C; (2) low process yield; (3) too expensive. In order to overcome the shortcomings of Au80Sn20 process, YINCAE Advanced Materials, LLC has invented a new solderable adhesive – TM 230. Solderable adhesives are epoxy based silver adhesives. During the die attach reflow process, the solder material on silver can solder silver together, and die with pad together. After soldering, epoxy can encapsulate the soldered interface, so that the thermal conductivity can be as high as 58 W/mk. In comparison to Au80Sn20 reflow process, the solderable adhesive has the following advantages: (1) low process temperature – reflow peak temperature of 230°C; (2) high process yield – mass reflow process instead of thermal compression bonding process; (3) low cost ownership. In this paper we are going to present the die attach process of solderable adhesive and the reliability test. After 1000 h lighting of LED, it has been found that there is almost no decay in the light intensity by using solderable adhesive – TM 230. ...

Room Temperature Fast Flow Reworkable Underfill For LGA

Oct 03, 2016 | Dr. Mary Liu and Dr. Wusheng Yin

With the miniaturization of electronic device, Land Grid Array (LGA) or QFN has been widely used in consumer electronic products. However there is only 20-30 microns gap left between LGA and the substrate, it is very difficult for capillary underfill to flow into the large LGA component at room temperature. Insufficient underfilling will lead to the loss of quality control and the poor reliability issue. In order to resolve these issues, a room temperature fast flow reworkable underfill has been successfully developed with excellent flowability. The underfill can flow into 20 microns gap and complete the flow of 15mm distance for about 30 seconds at room temperature. The curing behavior, storage, thermal cycling performance and reworkability will be discussed in details in this paper....

A Low Cost Manufacturing Solution - Low Temperature Super-Fast Cure and Flow Reworkable Underfill

Jan 12, 2016 | Dr. Mary Liu and Dr. Wusheng Yin

In order to meet the increasing demand of device miniaturization, high speed, more memory, more function, low cost, and more flexibility in device design and manufacturing chain, underfilling has increasingly become an essential process for the good reliability of electronic devices. Filled capillary underfill has been selected for used in package-level where there is large thermal stress caused by CTE mismatch issue, but the underfill is usually not reworkable. Unfilled capillary underfill has been used for board-level application such as BGA/CSP, POP, WL-CSP where there is need for mechanical shock resistance, the underfill is usually reworkable....

A Room Temperature Stable and Jetable Solder Joint Encapsulant Adhesive - Capillary Underfill Replacement

Jan 12, 2016 | Dr. Mary Liu and Dr. Wusheng Yin

With the increasing demand of device miniaturization, high speed, more memory, more function, low cost, and more flexibility in device design and manufacturing chain, YINCAE has published a white paper on a first individual solder joint encapsulant which can eliminate underfilling process with at least five times solder joint increase and provide more flexibility for fine pitch and high density application. In order to meet the demand of manufacturing of high speed and low cost, YINCAE has invented a room temperature stable and jettable solder joint encapsulant adhesive – SMT 266. The invention of SMT 266 has allowed our customers to have more flexibility in their high-speed production line such as worry free on the work life of adhesive and workable jetting process....

A Low Temperature Solder Joint Encapsulant for Sn/Bi Applications

Jan 12, 2016 | Dr. Mary Liu and Dr. Wusheng Yin

The electronic industry is currently very interested in low temperature soldering processes such as using Sn/Bi alloy to improve process yield, eliminate the head-in-pillow effect, and enhance rework yield. However, Sn/Bi alloy is not strong enough to replace lead-free (SAC) and eutectic Sn/Pb alloys in most applications. In order to improve the strength of Sn/Bi solder joints, enhance mechanical performance, and improve reliability properties such as thermal cycling performance of soldered electronic devices, YINCAE has developed a low temperature solder joint encapsulant for Sn/Bi soldering applications. This low temperature solder joint encapsulant can be dipped, dispensed, or printed. After reflow with Sn/Bi solder paste or alloy, solder joint encapsulant encapsulates the solder joint. As a result, the strength of solder joints is enhanced by several times, and thermal cycling performance is significantly improved. All details will be discussed in this paper....

Solderable Anisotropic Conductive Adhesives for 3D Package Applications

Jan 12, 2016 | Dr. Mary Liu and Dr. Wusheng Yin

3D packaging has recently become very attractive because it can provide more flexibility in device design and supply chain, reduce the gap between silicon die and organic substrate, help miniaturize devices and meet the demand of high speed, provide more memory, more function and low cost. With the advancement of 3D packaging, the bump height is now down from 80μ to 10μ. When the bump diameter is 20-40μ and height 10μ, the process and reliability are obvious issues. It is well known that underfill can enhance the reliability for regular flip chip, however underfill won’t help assembly process. In order to resolve some difficulties that 3D packaging faces, YINCAE Advanced Materials, LLC has developed solderable anisotropic conductive adhesives for 3D package applications. In this paper we will discuss the assembly process and reliability in detail....

An Innovative Reliability Solution to Interconnect of Flexible/Rigid Substrates

Jan 12, 2016 | Dr. Mary Liu and Dr. Wusheng Yin

With the pitch size of interconnect getting finer and finer, the bonding strength between flexible and rigid (e.g. PCB, ceramic) substrates becomes a serious issue because it is not strong enough to meet the customer’s requirement. Capillary underfill has been used to enhance the bonding strength between flexible and rigid substrates, but the enhancement is very limited, particularly for high temperature application. The bonding strength of underfilled flexible/rigid interconnect is dramatically decreased after being used at 180◦C, and the interconnects are weakened by the internal stress caused by the expansion of underfill at high temperatures. In order to resolve reliability issues of the interconnect between flexible/rigid substrates, solder joint encapsulant was implemented into the thermal compression bonding process, which was used to manufacture the interconnect between flexible/rigid substrates. Compared to the traditional process, the strength of the interconnect was doubled and the reliability was significantly improved in high temperature application....

Solder Joint Encapsulant Adhesive - LGA High Reliability And Low Cost Assembly Solution

Jan 12, 2016 | Dr. Mary Liu and Dr. Wusheng Yin

More and more Land Grid Array (LGA) components are being used in electronic devices such as smartphones, tablets and computers. In order to enhance LGA mechanical strength and reliability, capillary flow underfill is used to improve reliability. However, due to the small gap, it is difficult for capillary underfill to flow into the LGA at SMT level. Due to cost considerations, there are usually no pre-heating underfill or cleaning flux residue processes at the SMT assembly line. YINCAE solder joint encapsulant SMT256 has been successfully used with solder paste for LGA assembly. Solder joint encapsulant is used in in-line LGA soldering process with enhanced reliability. It eliminates the underfilling process and provides excellent reworkability. The shear st rength of solder joint is stronger than that of underfilled components. The thermal cycling performance using solder joint encapsulant is much better than that using underfill. Bottom IC of POP has been studied for further understanding of LGA assembly process parameters. All details such as assembly process, drop test and thermal cycling test will be discussed in this paper....

The Future of Solder Joint Encapsulant

Jan 08, 2016 | Dr. Mary Liu and Dr. Wusheng Yin

Solder joint encapsulant adhesives have been successfully used to enhance the strength of solder joints and improve thermal cycling as well as drop performance in finished products. The use of solder joint encapsulant adhesives can eliminate the need for underfill materials and the underfill process altogether, thus simplifying rework, which results in a lower cost of ownership.

Solder joint encapsulant adhesives include: low temperature and high temperature solder joint encapsulant adhesives, and their derivatives. Each solder joint encapsulant adhesive has: unfilled and filled solder joint encapsulant adhesives, and solder joint encapsulant paste. Each solder joint encapsulant product has been designed for different applications. In this paper, we are going to discuss the details and future of solder joint encapsulant adhesives. ...

Solder Joint Encapsulant Adhesive Pop TMV High Reliability And Low Cost Assembly Solution

Jun 02, 2014 | Dr. Mary Liu and Dr. Wusheng Yin

With the advancement of the electronic industry, package on package (POP) has become increasingly popular IC package for electronic devices, particularly POP TMV (Through Mold Vials) in mobile devices due to its benefits of miniaturization, design flexibility and cost efficiency. However, there are some issues that have been reported such as SIR drop due to small gap between top and bottom components, difficulty underfilling and rework due to stacked IC components and process yield issues. Some suppliers have reported using some methods such as dipping epoxy paste or epoxy flux to address these issues, but so far no customer has reported using these methods or materials in their mass production. In order to address these issues for POP TMV assembly, YINCAE has successfully developed and commercialized the first individual solder joint encapsulant adhesive for mass production for years....

3 more technical article(s) from YINCAE Advanced Materials, LLC. »

2 jobs »
Sales Coordinator

Category:

Sales/Marketing

Location:

San Jose, California, USA

Date Posted:

Apr 26, 2017

Sales Coordinator

Category:

Sales/Marketing

Location:

Albany, New York, USA

Date Posted:

Apr 26, 2017

23 news releases »
PRESS RELEASE: New Product Announcement

Jan 24, 2017 | BP 256 is YINCAE’s new ball attach adhesive product

Press Conference at IPC APEX EXPO 2017

Jan 18, 2017 | San Diego Convention Center San Diego, California YINCAE Booth #823

IPC APEX EXPO is 1 month away

Jan 13, 2017 | Press Release

Press Release

Dec 07, 2016 | IPC APEX EXPO 2017 VISIT YINCAE Booth # 823 Located in the NORTH HALL

SMTA INTERNATIONAL JUST A MONTH AWAY! VISIT YINCAE BOOTH #129 September 27th & 28th

Aug 24, 2016 | SMTA international is just a month away!

SEMICON WEST 2016 is 2 Weeks Away, Visit YINCAE Booth 6448

Jun 22, 2016 | Visit YINCAE Booth 6448

YINCAE at ECTC in Las Vegas in 2 weeks!!

May 18, 2016 | ECTC is 2 weeks away! The tradeshow will take place at The Cosmopolitan hotel in Las Vegas, NV, June 1st and 2nd. YINCAE hopes you will stop by our Booth 506 to learn more about YINCAE and the innovative products we have to offer.

ECTC is 1 Month Away Visit YINCAE Booth 506

Apr 27, 2016 | ECTC is only 1 month away! The tradeshow will take place at The Cosmopolitan hotel in Las Vegas, NV from May 31st to June 3rd. YINCAE hopes that you will stop by our Booth 506 to learn more about YINCAE and the innovative products we have to offer.

YINCAE Advanced Materials at IMAPS NE Booth # 101

Apr 25, 2016 | IMAPS New England is 1 week away! VISIT YINCAE Booth # 101 Join Dr. Yin’s Presentation May 3rd, 1PM

13 more news releases from YINCAE Advanced Materials, LLC. »

Contact information

YINCAE Advanced Materials, LLC.

19 Walker way
Albany, New York, 12205
USA

  • Phone 5184522880

Visit YINCAE Advanced Materials, LLC. website

Fluid Dispense Pump Integration

Selective Conformal Coating System - GPD SimpleCoat