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SMTnet Express May 9, 2013, Subscribers: 26129, Members: Companies: 13373, Users: 34687

Impact of Dust on Printed Circuit Assembly Reliability

Optical image of dust particles between electrodes

by: Bo Song, Michael H. Azarian, Michael G. Pecht; CALCE

Atmospheric dust consists of solids suspended in air. Dust is well known for its complex nature. It normally includes inorganic mineral materials, water soluble salts, organic materials, and a small amount of water. The impact of dust on the reliability of printed circuit board assemblies (PCBAs) is ever-growing, driven by the miniaturization of technology and the increasing un-controlled operating conditions with more dust exposure in telecom and information industries.

First published in the 2012 IPC APEX EXPO technical conference proceedings.

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ICSR (International Conference on Soldering and Reliability)
May 14

Printed Electronics Asia 2013
July 9 - 10

Jobs:

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Industry Associations Events

SMTA - Surface Mount Technology Association is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies. Membership Info | SMTA Certification | Bookstore

Next Event: Webinar: Design for Reliability (DfR) - May 16

IPC - Association Connecting Electronics Industries is a US-based trade association dedicated to the competitive excellence and financial success of its nearly 2,600 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly. Membership Info | Training & Certification Programs | Standards & Publications - Online Store

Next Event: IPC/FED Conference on Embedded Components - June 4 - 5

Technical Editor - Davef (submit your technical articles)

Newsletter Editor - Anna Girouard

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