First published in the 2012 IPC APEX EXPO technical conference proceedings.
by: Markus Leitgeb, Christopher Michael Ryder; AT&S
Considering technological advances in multi-depth cavities in the PCB manufacturing industry, various subtopics have materialized regarding the processing and application of such features in device manufacturing.
The success of solder paste printing is a prerequisite for further assembly and reliability of the entire electronic construct. In this paper we intend to examine the overall manufacturability and subsequently analyze the reliability of multi-depth cavity PCBAs, presupposing the presence of solderable features within these cavities.
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