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Failure due to board flex cracks persists as the dominant failure mode in multi-layer ceramic capacitors (MLCC). Board flex crack failures are often detected at in-circuit test, at functional test, and in the field. For high capacitance (HiCV) MLCC, the introduction of the flexible termination option (also referred to as soft termination or polymer termination) gives board designers an option to reduce the risk of board flex failure when board flex stress cannot be systematically removed from the board assembly process. (...) This paper is intended to show the impact of temperature cycling, high-temperature life tests, and multiple bend exposures to the MLCC with this flexible termination.
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