Nokia Bell Labs
inspired by the past, energized by the future For nearly 100 years, we've been inventing the future of technology, from the early days of the Bell Telephone System to the latest 5G standards. We constantly improve, innovate and ..
Nokia Bell Labs Technical Articles
The Effect Of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability
[November 07, 2022]
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a ...
The Effect Of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability
[April 06, 2022]
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a ...
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