Purbest Technology Chengdu Co., Ltd.

Purbest Technology Chengdu Co., Ltd. Products

Fixed Mold Forming Machine PFL-FM [Components]

Instruction: Fixed mold forming machine PFL-FM is suitable for large batch of components such as SOP/QFP molding, can be achieved all kind of flat packaged chip（top lead chip, middle lead chip and bottom ...

Lead cutting machine PCL Plus [Components]

The machine is designed to perform lead cutting before and after forming. It adopts pneumatic molding press and digital display high-precision differential head to provide the best precision. Different cutting length for different ...

Component tinning system-Super Tinning [Components]

Introduction：Super Tinning is for THT and SMT component tinning and re-tinning applications. The system can automatically handle common and exotic components and connectors, including， but not limited to：QFP，flatpack, axial, discrete, BGA，PLCC，CLCC，DIP，SIP，capacitors, resistor ...

Refrigerating and Warming Machine [Other]

Overview Generally, the solder paste requires to be stored in cool storage (3 to 8℃). It should be recovered at room temperature (25 ± 5 ℃) for 4 hours before usage.The flux ...

Pneumatic One-side Forming System PFL-1 [Lead Forming]

Pneumatic forming system adopts P-5000 pneumatic press that can perform down-pressure forming and avoid instability caused by manual press. The system includes an adjustable frame cutter and one side forming mold. It can cut lead ...

Lead Reconditioning System LRS-1 [Lead Forming]

Introduction：LRS-1 can recondition every side of leads to improve coplanarity and stand-off height. The coplanarity precision can achieve 0.05mm Specification： Voltage/Power：220AV/200W Chip size：5mm*5mm – 50mm*50mm Precision：±0.05mm Lead pitch：0.5-2.5mm Package：QFP, ...

Pneumatic Double-side Forming Machine - PFL [Lead Forming]

Introduction：PFL can form various two-side and four-side pack chips into gull-winged shape, meets different requirements of lead forming and cutting. The equipment is cost-effective and suits for multi-varieties and small-batch production, such as research institute ...

Automatic Forming System - APFL [Lead Forming]

Introduction: Automatic forming system (APFL), adopting a precision servo-electric press and an adjustable double-side mold, can form all kinds of flat packages (top lead chip, middle lead chip and bottom lead chip). High-precision forming is ...

Vapor SUI Clean [Cleaning Equipment]

Cleaning Application: Cleaning after die bond Cleaning of 3D package Micro-standoff precisely cleaning SIP and microwave assembly cleaning Cleaning before chip packaging Cleaning before PCBA coating Cleaning electronic assemblies with low stand-off,such as: FC,BGA,CSP,BTC,QFN,MELF; Apply for assemblies of water-free cleaning Factory ...

Hydro-clean LDS-S [Cleaning Equipment]

Cleaning Application Removing all kinds of solder residues Cleaning of micromechanical component Removing contamination from handling and board manufacturing ,FOD Cleaning highly populated electronic assemblies with low standoff, such as ...

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