SE300™ Ultra - 3-D Solder Paste Inspection (SPI) System

Building on CyberOptics' reputation for practical, high-value inspection systems, this machine raised the bar for post-print inspection and process control. As CyberOptics’ first in-line 100% 3-D solder paste inspection system, the SE 300 Ultra provides accurate and repeatable results.

SE 300™ SPI System Key Features:

• High-resolution 3-D sensing technology to inspect the most demanding assemblies with even subtle printing errors
• High-speed/high-resolution inspection modes to optimize system performance
• 3D height, true volume and area measurements for those PCBs with CSPs, 0201s or other small pad sizes where measuring solder volume is key for identifying solder joint reliability
• Registration measurement and bridge detection to help you fine-tune printer set up and monitor process drift