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SMT / PCB Electronics Manufacturing

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Heller Industries Inc.

 
Heller Industries Inc.
 
Manufacturer of Reflow Soldering Ovens for Automated SMT PCB Assembly. Specializing in: Lead Free Processing and Nitrogen Reflow. Serving Printed Circuit Board, Semiconductor and Wafer Processing Applications.

Heller Industries, the market leader in oven technology, supplies solutions for electronics manufacturers and assemblers worldwide.

Heller uses advanced manufacturing and production systems to supply both standard and special ovens cost-efficiently, with rapid delivery. These capabilities are supported by corporate and fiscal strength, the result of consistency in management policies and engineering expertise over the past 42 years.

Heller Industries uses the most advanced production systems available. Our company-wide ISO 9001 program enhances communication within and among departments � as well as throughout our global network of regional managers, sales representatives, field service engineers and customers.

Heller's cohesive management team ensures valuable continuity; the people you speak with today have a heritage � and a future � with the company. Our entire staff is grounded in engineering principles and trained in oven manufacturing. This shared experience provides support in executing the company's various functions: assembly, design, service or quality assurance.

Since we introduced our first full convection reflow oven in 1987, Heller Industries has brought innovations and refinements to market at an accelerating rate. In the course of responding to forces that impel electronics assemblers to reduce their product development cycles, Heller has amassed considerable expertise in resolving reflow and curing issues. Having pioneered full convection reflow � now the standard of the industry � we have met, and continue to accept, major engineering challenges.


Heller Industries Inc. Catalog
 
Heller 1800EXL Heller 1800EXL The 1800EXL supports high-speed, high-volume throughput� at speeds up to 40 inches (one meter) per minute� while conserving valuable factory floor space. Rapid response times and precise temperature controls assure process uniformity, regardless of component density or board loading, with identical profile performance in either air or nitrogen. For higher heat transfer rates, increased productivity and greater footprint, specify Heller's new Model 1800EXL.
Heller 1700EXL Heller 1700EXL The new Model 1700EXL demonstrates Heller's leadership in the reflow marketplace. We provide the most advanced reflow technology for your surface mount assembly line, while combining a more robust system with unmatched versatility and engineering expertise. For more information, call Heller Today.
Mark III Reflow System Mark III Reflow System

Heller Industries the recognized World Leader in Reflow Soldering Oven Technology announces a true breakthrough in Reflow soldering technology with the new Mark III series. With over 12,000 systems installed worldwide, Heller has been at the leading edge of Forced Hot Air Reflow soldering technology development since 1987.

Heller has pioneered the Lead Free Reflow process by working closely with the Japanese OEM�s and International ODM�s and EMS�s to refine the Lead Free process.

The Mark III system includes features that provide:

  • �Spike Zone� design to minimize liquidous time
  • Ultra fast cooling rates of 3-5 Deg/Sec to form perfect grain structure
  • More heated zones than any other competitor to allow �Profile Sculpting�

For more information please visit our website



Heller Industries Inc. Postings
 
Recent News Items:

Feb 02, 2009 - Henkel Names New Global Sales Director for Semiconductor Materials
Nov 01, 2007 - Heller expands Asian sales organization
Jan 09, 2002 - ECD System to Ship With Heller Ovens

Heller Industries Inc. Offices
 
Heller Industries Inc. Main Office
4 Vreeland Rd.
Florham Park, New Jersey, 07932
United States
Visit the Heller Industries Inc. Website
Email the Heller Industries Inc. company contact
 
 
 






 
 
 
 
 
 

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