Shenmao Technology Inc. Products

SMT Products and Services offered by Shenmao Technology Inc.


Shenmao Technology Inc.

SHENMAO Technology, Inc. supplier of Pb/Pb-free Solder Pastes, Solder Wire, Solder Bar, Flux, BGA Sphere, Bumping Paste/Flux, PCB Plating Anode, PV Ribbon Electronics Assembly Materials, for over 44 years from 10 world locations. »»

Shenmao Technology Inc. website
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18 listed by Shenmao Technology Inc.

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Formosa Lead Free Solder Paste

Lead Free Solder Paste have received sub-license from Fuji Electronic Company. We provide halide-containing and halide-free fluxes for Lead Free Solder Alloys, so our customers can be able to reach the lead free era comfortably. Features: Pb< 1000ppm, Cd...

Formosa Lead Free Solder Paste

Solder Materials

Formosa Halogen Free Solder Paste

Lead-Free Solder Paste have received sub-license from Fuji Electronic Company. We provide halide-free fluxes for Lead-Free solder alloys, and conform to the RoHS law, so our customers can be able to reach the lead free era comfortably. Features: Pb< 1000...

Formosa Halogen Free Solder Paste

Solder Materials

Formosa Low Temperature Solder Paste

Shenmao Technology has developed Low Temperature Solder Paste for SMT devices. The Low Temperature Solder Paste has been qualified by third party organization. Low Temperature Solder Paste: Sn42Bi58 Melting point: 138℃ ...

Formosa Low Temperature Solder Paste

Solder Materials

Formosa Package on Package Solder Paste

For high density and advanced package technology, We provide new Solder Paste for PoP applications. Package on Package Solder Paste has better wettability, solderability and low void than others. Package on Package (PoP) Solder Paste

Formosa Package on Package Solder Paste

Solder Materials

Formosa Water Soluble Solder Paste

Shenmao Technology offers a full line of Water Soluble Fluxes and Water Soluble Solder Paste for SMT and IC packaging applications. We provide halide-containing and halide-free fluxes for Tin/Lead as well as Lead-Free solder alloys. Our formulations, with wild process window, have been proven to be ...

Formosa Water Soluble Solder Paste

Solder Materials

Formosa Bumping Solder Paste

Bumping Solder Paste aims to decrease current issue of too much voids in the IC Packaging Manufactures. Our applications engineers of SMMI focus on developing the lower Void, <100000ppm, of formula. It’s approved by our customers that can decrease void happened and optimizes the performa...

Formosa Bumping Solder Paste

Solder Materials

Formosa Tin Lead Solder Paste

Tin Lead Solder Pastes are made from high purity metal (Tin, Lead); high quality is guaranteed. Our strict production and quality control, strong technical and development team results in reasonable price and to meet each customer's specific needs. Features ...

Formosa Tin Lead Solder Paste

Solder Materials

Water Soluble and No-Clean Fluxes

We offer a full line of Water Soluble Fluxes and No-Clean Flux for SMT, IC packaging and PCB Wave solder applications.  We provide halide-containing and halide-free fluxes for Lead-Free solder alloys. Besides, our Lead-Free Liquid Fluxes have been approved by many large OEM&rs...

Water Soluble and No-Clean Fluxes

Solder Materials

SM-150G/SM-155P Epoxy Adhesives

SM-150G and SM-155P are single component epoxy adhesive, specifically designed for the bonding of surface mount devices to PCB in the lead-free process. SM-150G is suitable for glue dot process and SM-155P is suitable for the printing machine process. SM-150G and...

SM-150G/SM-155P Epoxy Adhesives

Solder Materials

SM-150G / SM-155P Single Component Epoxy Adhesive

SM-150G and SM-155P are single component epoxy adhesive, specifically designed for the bonding of surface mount devices to PCB in the lead-free process. SM-150G is suitable for glue dot process and SM-155P is suitable for the printing machine process. SM-150G and...

SM-150G / SM-155P Single Component Epoxy Adhesive

Solder Materials

BGA Spheres

BGA Solder Sphere is made from pure metals, to produce exact alloy compositions. We developed and produced under a strict research and quality control policy. Our Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip applications are made by the UMT ( Ultra Micron Technology) to ensu...

BGA Spheres

Solder Materials

Solder Preform

Solder Preforms offers accurate solder deposition for various soldering processes. Reel packaging provides opportunity of automation for efficient application. Custom Material may be formulated to unique material and dimensional requirements. Specifications : ...

Solder Preform

Solder Materials

Solder Ribbon

High Quality Solder Ribbon manufactured by SHENMAO is available in many standard Alloys and Sizes. It has the lowest flow temperature, best wetting and best flow characteristics. Formulated to your unique Alloy and dimensional requirements. Specifications:

Solder Ribbon

Solder Materials

PV Ribbon

During our more than 30 years serving in solder materials with solid R&D and total solution capabilities, Solarjoin delivers the best quality of PV Ribbon and Flux to meet your high reliability requirements. BASE METAL OPTIONS of PV Ribbon: <...

PV Ribbon

Solder Materials

Halogen Free Solder Wire

We offer Lead Free Solder Wire and Halogen Free Solder Wire; OEM service is available.   Alloy / FLUX F4 F10 Sn/Cu

Halogen Free Solder Wire

Solder Materials

Lead Free Solder Wire

Lead Free Solder Wire can be made according to customers' need.   Alloy / FLUX R F5 F7 F11 <...

Lead Free Solder Wire

Solder Materials

Cored Solder Wire

Cored Solder Wire is specially designed with low residue, chlorine content less than 0.1%, flux content 2.0%+0.5 for Hand/Automatic soldering applications assembly. Soldering Wire is available in many alloy composition, Sn60 and Sn63 are the most regular used by users and available type...

Cored Solder Wire

Solder Materials

Solder Bar

Solder Bar is made solely from high purity metal, produces a low proportion of dross and its suitable for dip and wave soldering. The quality meets JIS-Z-3282. Solder Bar is available specification in A grade, S grade, Anti-oxide bar, Silver added bar, Pure Tin bar and other Lead Free Solder Bar.

Solder Bar

Solder Materials

HeatShield Gel- thermal PCB shield during reflow

FPC* - Fluid Pressure Control - Dispensing Pump