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SIL Package, 8-Pin μSIP
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aj 
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6/13/2026
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4 posts
1410 views
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Hi all,
We are seeing solder beading on the sides of his part after reflow.
Stencil , placement all checks out fine.
We have SPI , stencil is 130um but results read 160-180um but we are told this is standard results.
welcome any comments to try prevent the
solder seeping out of the sides... or is it possible?
LMZ10501 part number
thanks
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