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First product designed and developed specifically to protect adjacent IC components from excessive heat during printed circuit board rework or repair. Compatible with both Tin-Lead and Lead-Free solder rework. Visit Used Equipment Mart... Post Your Equipment Listing Free...
BGA solder bridge - I have this BGA short issue, I took x-ray image, the solder ball having big void. We suspect the pad on BGA was oxidie. Reject percentage quite low, only 5 out of 6000... »» Depanneling Problems - We have a problems with soldering in the PCB in the Solder Wave process. Our pcbs are failures in the solder (voids) in the throughole components... »» Mirtec Visit the Forum... Have a Question? Ask for Free...
7th International Conference and Exhibition on Device Packaging Trade Show/Exhibition, Conference | Sun, March 06 | Sponsored by: IMAPS The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields... »» Burn-in & Test Socket Workshop 2011 Conference | Sun, March 06 | Sponsored by: BiTS Workshop,LLC BiTS is the world's premier workshop dedicated to providing a forum for the latest information about burn-in and test socketing, and related fields... »» Trade Show/Exhibition, Conference | Sun, April 10, 2011 - Thu, April 14 | Sponsored by: IPC Join thousands of colleagues from more than 50 countries at our industry's premier event � featuring advanced and emerging technologies in printed board design and manufacturing, electronics assembly and test... »» Visit the Event Calendar... Add Your Event Now...
SMTA Next Event: South East Asia Technical Conference on Electronics Assembly Technologies - May 19 IPC Next Event: Online Webinar: Market Update for the Electronic Chemicals Industry - March 8
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