BEST Inc.

BEST offers professional rework, repair and prototype builds of PCBs. Our experienced instructors teach professional soldering classes as we are an IPC certified training center.

Repair/Rework, Soldering, IPC Standards Certification Center, Service Provider, Training Provider

Your BEST Source for PCB rework/repair, solder training, and soldering tools!

Our Contract BGA Rework/Repair Division provides expert bga rework services and bga repair, ECO modifications and rework to your PCBs. Our state of the art equipment and IPC certified operators insure the bga rework done on your PCBs will be done correctly and reliably. 100% guaranteed. Because our core competency is BGA rework & PCB repair, our operators' output per person far exceeds that of in-house operators. Compare your fully burdened overhead rate of rework/repair to our per board price - you'll be surprised! We offer turns as quick as 24 hours on BGA rework and reballing of BGAs.

BEST is an IPC Master Certification Center offering Instructor and Operator soldering courses for IPC-A-610, J-STD-001, IPC 7711/7721 as well as customized classes to meet specific standards or criteria. BEST now offers the first web based, fully interactive IPCA-610 Certification online! BEST is also the only IPC Certification Center in the world with a Mobile Training Center - a fully operational, mobile solder training lab that brings the classroom right to your door!

Pre-order your copy of the IPC A-610D Acceptability of Electronic Assemblies Standard, due to be released in February, 2005. Order yours today from BEST!

BEST, Inc specializes in offering products that streamline the process of hand soldering, rework and repair, which also includes lead free soldering products. Our training kits, dummy components and IPC materials are excellent resources for skill building and retention. Our Rework/Repair Exchange offers product reviews and technical articles on the latest rework/repair equipment, as well as a forum to buy and sell used or refurbished equipment.

BEST Inc. Postings

62 products »

StencilQuik™ BGA Rework Stencils

Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process?  Are you ...

Solder Paste Stencils

StencilQuik™ BGA Rework Stencils

StencilMate™ Leadless Device Rework Stencils

Simplify and Speed Up QFN and LGA device rework. StencilMate™ leadless device rework stencils make the process of reworking leadless devices such as QFNs and LGAs simple and fast. These adhesive-backed poyimide s...

Solder Paste Stencils

StencilMate™ Leadless Device Rework Stencils

StikNPeel™ PCB Rework Stencil

Sometimes there are products that come along and you think to yourself-Wow! The StikNPeel™ rework stencil is one of those products. It simplifies the rework of site locations by placing a highly flexible, removable, adhesive...

Solder Paste Stencils

StikNPeel™ PCB Rework Stencil

Component Printing Metal Stencil

Based on its long work on BGA rework and repair process and its in-house capability to produce metal stencils BEST can provide for you a timely, cost-effective solution for printing on to components for MOST rework systems. Our templates...

Solder Paste Stencils

Component Printing Metal Stencil

APR Component Printing Metal Stencil

Based on its long work on BGA rework and repair process and its in-house capability to produce metal stencils BEST can provide for you a timely, cost-effective solution for printing on to components for MOST rework systems. Our templates...

Solder Paste Stencils

APR Component Printing Metal Stencil

PCB Rework Stencils

BEST custom manufactures a vareity of stencils including miniature rework stencils. These stencils are designed to rework specific component locations. These component stencils feature flaps on their sides in order to prevent solder paste form lea...

Solder Paste Stencils

PCB Rework Stencils

Framed SMT Stencil

BEST designs and faricates a variety of different-sized metal stencils in a variety of differnt types of frames. The metal stencils are either formed Aluminum or cast steel. The most common sizes are 29 x 29" or 20 x 20" frames. We have ...

Solder Paste Stencils

Framed SMT Stencil

SRT Component Printing Metal Stencils

Based on its long work on BGA rework and repair process and its in-house capability to produce metal stencils BEST can provide for you a timely, cost-effective solution for printing on to components for MOST rework systems. Our templates for prin...

Solder Paste Stencils

SRT Component Printing Metal Stencils

Prototype SMT Stencil

BEST provides prototype SMT stencls within 24 hours from checkplot approval. We can configure these in "frameless" configurations , with flaps, without flaps (foil only) or in an SMT prototype kit configuration. The SMT prototype stencil...

Solder Paste Stencils

Prototype SMT Stencil

SMT Framed Metal Stencils

SMT Framed Stencils are laser cut solder paste stencils designed to work on SMT printing machines. These laser cut stencils are permanently glued into a frame. These framed stencils are are designed for highly repeatable continuou...

Solder Paste Stencils

SMT Framed Metal Stencils

See all products from BEST Inc. »

80 training courses »

70 more training courses from BEST Inc. »

19 technical articles »

Multiple Methods for Applying Paste Flux or Solder Paste for BGA Rework

Mar 30, 2017 | Bob Wettermann, BEST Inc. MIT

There are multiple methods, each with its associated benefits for given applications, for printing either solder paste or paste flux for BGA rework. Each of these methods is best-suited for a given situation, board layout and skill level of operators performing the BGA rework. This discussion will layout the various methods and present the specific circumstances for which the specific technique is most wellsuited. In addition, the pluses and minuses for each of the approaches will be discussed in detail....

BGA Rework Process

Feb 01, 2017 | Bob Wettermann

BGA Rework Course encompasses the skills necessary to perform rework of electronic printed circuit boards to include PBGA and CBGA technologies. There should be 'one-stop' solution, that offers a wide range of ball grid array rework and repair services....

PCB Laser Depanelizing Using a UV Laser

Oct 06, 2016 | Bob Wettermann

One of the methods gaining in popularity for singulating rigid/flex, rigid and flex circuit boards post assembly is through the use of laser routing. This method has the advantage of speed, positional accuracy, no tooling wear and lastly no induced mechanical stresses on components during the singulating process....

Adhesive Backed Plastic Stencils vs Mini Metal Stencils

Aug 27, 2015 | Bob Wettermann, MIT

Ever since there has been a widespread usage of surface mount parts, the trend of continued shrinkage of devices with ever finer pitches has continued to challenge PCB assemblers for the rework of same. Todays' pitches are commonly 0.5 to 0.4mm with packages of tiny outline sizes, 5 -10mm square, making the rework of such devices a challenge. In addition to the handling and inspection challenges comes the board density. Spacing to neighboring components continues to be compressed so the rework techniques should not damage neighboring components....

Plastic vs Metal Stencils for Prototype Printing

Sep 11, 2014 | Bob Wettermann.

This article goes through the pluses and minuses of using plastic stencils for DIY prototypes. The release efficiency is measured and "rules of thumb" for using one type vs another is explained....

Reliability of Reworked QFNs

Sep 11, 2014 | CRANE.

In this DOD study the reliability of reworked QFNs is studied with the outcome being that a stay in place stencil does not impact the reliability of a QFN reworked using this technique...

Reballing a QFN Simplifies QFN Rework

Sep 11, 2014 | Bob Wettermann.

There are a variety of methods one can use to rework QFNs. This paper explains one of the ways to get very little center ground voiding while making it easy to place a tiny component with almost no keep out areas....

Performance of Kapton Stencils vs Stainless Steel Stencils for Prototype Printing Volumes Processes

Jul 03, 2013 | Bob Wettermann, Hung Hoang

It has been demonstrated in numerous pieces of work that stencil printing, one of the most complex PCB assembly processes, is one of the largest contributors to defects (Revelino et el). This complexity extends to prototype builds where a small number of boards need to be assembled quickly and reliably. Stencil printing is becoming increasingly challenging as packages shrink in size, increase in lead count and require closer lead spacing (finer pitch). Prototype SMT assembly can be further divided between industrial and commercial work and the DIYer, hobbyist or researcher groups. This second group is highly price sensitive when it comes to the materials used for the board assembly as their funds are sourced from personal or research monies as opposed to company funds. This has led to development of a lower cost SMT printing stencil made from plastic film as opposed to the more traditional stainless steel stencil used by industrial and commercial users.This study compares the performance of these two traditional materials and their respective impact on solder paste printing including efficiency and print quality....

Component Shortages Causing Electronics Manufacturers to "Use All Means Necessary" to Ship Products

Nov 24, 2010 | Bob Wettermann

As the electronics manufacturing and assembly industry in the US recovers to some degree from the economic crisis which began in 2008, the challenge of component shortages has risen to the top as one of the stumbling blocks for contract assemblers and cap...

A New Stenciling Method for Reworking SMT Components

Jul 15, 2010 | Bob Wettermann

When reworking more complex SMT components such as finer pitch SMT components, SMTconnectors and even area array devices, the most common method of printing on the printing selectively on the PCB has some serious shortcomings. The most significant problem...

9 more technical articles from BEST Inc. »

27 news releases »

BEST Inc. Puts Semi-Automated Mass Rework Process Online

Mar 31, 2017 | BEST installs and brings Up mass rework machine capability to reduce costs and increase the turnover of boards requiring lots of parts change outs.

BEST SMT Boot Camp Nov 29-Dec 1, 2016 Featuring Phil Zarrow

Oct 25, 2016 | Learn about SMT assembly from SME Phil Zarrow in Chicago

New Hands On Class for Wire/Cable Assembly

Sep 01, 2016 | A new class has been developed to teach EMS providers and others the basics of wire harness assembly techniques. This class goes along with the popular IPC-A-620 Wire and Cable Harness Assembly Acceptance standards.

BEST Releases 2nd Half Training Schedule for 2016

May 25, 2016 | BEST's 2nd half of 2016 schedule including more dates and classes in Detroit.

Award for New Product Innovation Announced

Apr 20, 2016 | BEST, Inc. was presented Circuit Assembly’s NPI Award for its HeatShield Gel™ high temperature shielding product at the IPC APEX Expo on Feb. 24 in San Diego, Calif.

BEST, Inc. Will Be Conducting 2 Training Sessions at the IPC APEX Expo 2016

Feb 27, 2016 | BEST Inc. instructors will be conducting 2 training sessions this year at the APEX Expo 2016 - Advanced Rework: Hands-on BGA Reballing, Lead-Free Devices, and Fine-Pitch Parts, and the 2nd session - Stencil Printing: Consistent Print Volumes for SMT Rework.

BEST Developes Revolutionary Gel for Masking of Parts

Jan 05, 2016 | Novel method for protecting electronic components from heat.

BEST Installs New Laser System for PCB Depaneling, Hole Drilling, Selective Ablation

Oct 21, 2015 | Product lead time reductions and increased capabilities for EMS providers and board shops

Assembly Challenges of Small Packages - A Tech Symposium Presented by Industry Experts

Sep 01, 2015 | Please join BEST for our 2015 Tech Symposium on the Assembly Challenges of Small Packages. Increase your understanding of the challenges involved in small footprint device assembly.

Tech Symposium on SMT Micro Electronics Assembly and Rework

Aug 05, 2015 | SMT micro electronics assembly and rework symposium has been scheduled for 2015 for October 1, 2015. Learn/Re-learn how to perform a design of experiments, learn rework tips from Paul Wood and "lessons learned" from Chrys Shea.

17 more news releases from BEST Inc. »

reflow oven profiler

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