Design and Manufacturing with SMT-BGA-BTC

This course is a comprehensive technical overview of SMT and covers all the details of SMT Design for Manufacturing, test and repair of SMT and BGA and Fine Pitch components.

The objective of this course is to identify the technical issues in Through hole, SMT, tin-lead, Lead Free BGA and fine pitch technology design and manufacturing that must be resolved for an effective implementation of mixed assembly electronics products.

Who Should Attend

Manufacturing, process, design, test, quality personnel and their managers who are involved in designing or producing tin-lead/Lead Free SMT and mixed-technology assemblies and want to reduce product cost and improve process yield should attend this course.