SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Guidelines for Design and Assembly Process Implementation for Bottom Termination Components Released by IPC

Guidelines for Design and Assembly Process Implementation for Bottom Termination Components Released by IPC

May 03, 2011

Assemblers who have tried to resolve problems that stem from the rapidly growing array of advanced packages are getting some help from IPC with the newly released IPC-7093, Design and Assembly Process Implementation for Bottom Termination Components. This standard describes the critical design, assembly, inspection, repair, and reliability issues associated with bottom termination components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body.

Over the past few years, this class of components, which includes QFN, DFN, SON, LGA, MLP and MLF, has seen dramatic growth. QFNs, LGAs, passives and even power components have shifted their contacts to the bottom of the package, providing significant cost savings for semiconductor suppliers; and with shorter signal traces, improved speed. Together, these factors prompted many users to migrate to bottom-termination packages.

"It's amazing how broad the usage is. It ranges from inexpensive consumer products to high-reliability, military-grade systems," says Vern Solberg, co-chairman of the IPC 5-21h Bottom Termination Components (BTC) Task Group that developed IPC-7093.

IPC-7093 provides direction for a package style that has proven difficult to manage even though its usage is now widespread. "Strict process control is key when using these packages," explains Dieter Bergman, IPC staff liaison to the IPC 5-21h task group and director of technology transfer. "The package base and board have to be very flat, and the amount of solder volume that’s applied has to be properly related to the size of the terminations being attached to the surface."

Attempts by chipmakers to reduce the number of problems haven't been particularly effective. IPC-7093 provides guidelines for those striving to achieve perfection while dealing with real-world issues. The standard details techniques for component placement and solder application as well as processing issues. Reflow solder printing and reflow profile recommendations are also provided. The document also includes a number of photos and illustrations that will help users understand the root causes of problems.

Managers, design and process engineers, operators and technicians who deal with electronic design, assembly, inspection and repair processes will find the information contained in IPC-7093 useful and practical, especially if they are using or considering tin-lead, lead free, adhesives or other forms of interconnection processes for assembly of BTC-type components. Although not a complete recipe, the document identifies many of the characteristics that influence the successful implementation of robust and reliable assembly processes and provides guidance information to component suppliers regarding the issues being faced in the assembly process.

IPC members may request a free single-user download of IPC-7093 by sending an e-mail to MemberTechRequests@ipc.org within 90 days of the document’s publication date. After that date, IPC members may purchase the standard for $52. The nonmember price is $103. For more information or to purchase IPC-7093, visit http://www.ipc.org/7093.


IPC (http://www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,900 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.85 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; and Shanghai, Shenzhen and Beijing, China.

Sep 20, 2017 -

New IPC Studies Show World PCB Market Up in 2016 as North American Market Shrinkage Slows World PCB Production and Annual North American PCB Industry Reports Released

Sep 19, 2017 -

IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2018 in San Diego

Sep 18, 2017 -

Excel Electronics, Inc. Earns IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing

Sep 18, 2017 -

IPC Disappointed by Failure of Negotiated Rulemaking Aimed at Encouraging Recycling of Manufacturing Byproducts

Sep 12, 2017 -

IPC Joins Industry Coalition in Support of U.S. EPA in Litigation over Chemical Safety Act

Sep 11, 2017 -

IPC APEX EXPO 2018 Opening Keynote from Jared Cohen Will Highlight Technology’s Game Changers

Sep 07, 2017 -

Wage and Salary Survey Deadline for North American Electronics Assembly Industry Extended to September 29

Sep 07, 2017 -

IPC Praises Federal Court Decision to End Overtime Rule

Sep 06, 2017 -

Grupo Mirgor First Company in South America to Earn Certification as Qualified Manufacturer to IPC-J-STD-001/610 Recognized as IPC-Trusted Source and QML-Listed

Sep 03, 2017 -

North American PCB Orders Up, Sales Down, Raising Book-to-Bill Ratio

850 more news from Association Connecting Electronics Industries (IPC) »

Sep 21, 2017 -

Logic PD Sponsoring, Exhibiting at American Medical Device 2017

Sep 20, 2017 -

Viscom AG adopts Valor Process Preparation solution for electronics manufacturing efficiency

Sep 20, 2017 -

COT Announces PB Swiss Tools’ Two New INSIDER Models: INSIDER STUBBY and INSIDER STUBBY RATCHET

Sep 20, 2017 -

ADLINK Technology invites clients to join the MEC Congress 2017

Sep 19, 2017 -

ASC International to Highlight 3D AOI/SPI Innovations at SMTA International

Sep 19, 2017 -

MicroCare Presents Radically Innovative ‘Greener’ Cleaning Fluid at Parts2Clean Stuttgart Hall 3 Stand A46

Sep 19, 2017 -

Aegis Software’s FactoryLogix a major step on Melecs journey towards Industry 4.0

Sep 19, 2017 -

SCS Webinar to Address the Use of Parylene for Increased Reliability

Sep 19, 2017 -

BTU Introduces Profile Guardian Redundant Process Monitor during SMTAI

Sep 19, 2017 -

ADLINK Technology Showcasing Latest Rugged Embedded Railway Solutions at Major European Railway Exhibitions TRAKO, Expo Ferroviaria and Nordic Rail

See electronics manufacturing industry news »

Guidelines for Design and Assembly Process Implementation for Bottom Termination Components Released by IPC news release has been viewed 2107 times

  • SMTnet
  • »
  • Industry News
  • »
  • Guidelines for Design and Assembly Process Implementation for Bottom Termination Components Released by IPC
pcb components vacuum pick up

Reflow Oven