Apr 29, 2011 
Ed will present Advantages of Bismuth-based Alloys for Low Temperature Pb-free Soldering and Rework. This paper, co-authored with Ronald C. Lasky, Ph.D., P.E. and Brook Sandy , discusses the advantages of using bismuth to reduce the melting temperature of tin-based solder alloys. Ed’s research focuses on stencil printing characteristics, reflow profile optimization, and solder joint quality.
Ed is an SMTA-certified engineer and has earned a Green Belt Six-Sigma Certification from Dartmouth College for demonstrated proficiency in developing and executing design experiments to support continuous process improvement. He is also certified as an IPC-A-600 and IPC-A-610D specialist. Ed has worked for Indium Corporation for more than 19 years and is based at its global headquarters in Clinton, NY. He has an AS in Chemical Technology from Mohawk Valley Community College, where he was awarded the Douglas J. Bauer Award for Excellence in Chemistry.
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Indium Corporation (http://www.indium.com) is a premier materials supplier to the global electronics, semiconductor, solar, thin film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputter targets; indium, gallium, and germanium chemicals and sourcing; and Reactive NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.
