SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Nihon Superior’s Technical Director to Present Assessment of Microalloyed Sn-Zn as a Solder at ICSR 2011

Nihon Superior’s Technical Director to Present Assessment of Microalloyed Sn-Zn as a Solder at ICSR 2011

Apr 07, 2011

Keith Howell, Nihon Superior’s Technical Director,

Keith Howell, Nihon Superior’s Technical Director,

Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, announces that Keith Howell, Technical Director, will present a paper titled "Assessment of Microalloyed Sn-Zn as a Solder for Electronics Assembly" at the upcoming International Conference on Soldering & Reliability (ICSR), scheduled to take place May 3-6, 2011 at the Crowne Plaza Toronto Airport Hotel in Toronto, ON. The presentation will take place Wednesday, May 4, 2011 at 9:30 a.m.

Given the advantages of reduced damage to components and laminate, as well as energy savings that could accrue as a result of a melting point 20ºC lower than the liquidus temperature of SAC305, the tin-9 percent zinc eutectic alloy has been attracting the attention of the electronics industry as a potential lead-free solder. If solders based on the tin-zinc eutectic are to find wider application, the problem of corrosion will have to be addressed.

The presentation will provide a detailed assessment of the effect of a microalloying addition of manganese on the mechanical integrity of tin-zinc alloy joints on copper, nickel, and silver substrates after exposure to elevated temperature (150ºC) and humid heat (85ºC/85 percent RH) for up to 1000 hours. The nature and extent of corrosion on the surface, and the solder/substrate interface was examined using SEM/EDX and found to vary considerably with the substrate.

Keith has more than 25 years of industry experience including 20 years in the field of electronics assembly and soldering. He has been involved in various roles in the development, manufacture and marketing of new products, and is currently Technical Director for the Americas for Nihon Superior, the developer of SN100C lead-free solder. Keith has a Bachelor’s Degree in Mechanical Engineering from the University of Illinois and a Master’s Degree from the University of Rochester, and has presented at numerous seminars on lead-free soldering as well as on process improvements at past conferences.


Nihon Superior was founded in 1966 when it began marketing unique flux products imported from the US. The company made its mark on society by gathering the most advanced soldering and brazing technologies and products from around the world, and supplying them to companies in the metal-joining industry. A turning point for the company came when it started developing its own soldering materials and with the success of its unique SN100C lead-free solder alloy Nihon Superior has become a major player in the global market. To support the growing demand for its products Nihon Superior has established manufacturing and sales centers in Japan, China and other Asian countries and formed business partnerships with companies in other markets.

Aug 15, 2017 -

Nihon Superior Solves Industry Challenges with New Solder Pastes – Visit Booth #532 at SMTAI

Aug 10, 2017 -

SN100C Provides Faster Wetting and Increased Spreadability Over SAC305 – Visit Booth #1G08 at NEPCON South China

Feb 16, 2017 -

Nihon Superior Wins a 2017 NPI Award for the Latest SN100CVTM Lead-Free No-Clean Paste

Jan 10, 2017 -

Nihon Superior to Show Solder Pastes that Address Improvements in Reliability and Thermally Stable Joining

Aug 30, 2016 -

Nihon Superior to Debut a New Solder Paste to Solve New Challenges in the Electronics Industry at SMTA International

Mar 09, 2016 -

Nihon Superior Hosts Anniversary Celebration in Japan and Begins Its 50th Year with New Developments

Feb 16, 2016 -

Nihon Superior Will Show the Latest Advancements of the SN100C Alloy at IPC APEX EXPO

Dec 28, 2015 -

Nihon Superior Will Show the Latest Advancements of the SN100C Alloy at NEPCON Japan

Oct 21, 2015 -

Nihon Superior to Hold 50th Anniversary Celebration in Japan

Oct 11, 2015 -

Nihon Superior President Tetsuro Nishimura Recognized as Best Inventor during SMTAI

124 more news from Nihon Superior Co., Ltd. »

Sep 21, 2017 -

Logic PD Sponsoring, Exhibiting at American Medical Device 2017

Sep 20, 2017 -

Viscom AG adopts Valor Process Preparation solution for electronics manufacturing efficiency

Sep 20, 2017 -

COT Announces PB Swiss Tools’ Two New INSIDER Models: INSIDER STUBBY and INSIDER STUBBY RATCHET

Sep 20, 2017 -

New IPC Studies Show World PCB Market Up in 2016 as North American Market Shrinkage Slows World PCB Production and Annual North American PCB Industry Reports Released

Sep 20, 2017 -

ADLINK Technology invites clients to join the MEC Congress 2017

Sep 19, 2017 -

ASC International to Highlight 3D AOI/SPI Innovations at SMTA International

Sep 19, 2017 -

MicroCare Presents Radically Innovative ‘Greener’ Cleaning Fluid at Parts2Clean Stuttgart Hall 3 Stand A46

Sep 19, 2017 -

Aegis Software’s FactoryLogix a major step on Melecs journey towards Industry 4.0

Sep 19, 2017 -

IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2018 in San Diego

Sep 19, 2017 -

SCS Webinar to Address the Use of Parylene for Increased Reliability

See electronics manufacturing industry news »

Nihon Superior’s Technical Director to Present Assessment of Microalloyed Sn-Zn as a Solder at ICSR 2011 news release has been viewed 936 times

  • SMTnet
  • »
  • Industry News
  • »
  • Nihon Superior’s Technical Director to Present Assessment of Microalloyed Sn-Zn as a Solder at ICSR 2011
Metcal soldering rework

Fluid Dispense Pump Integration