SMT, PCB Electronics Industry News

Stamped Spring Pin BGA Socket for IDT's FCBGA144

Mar 22, 2011

Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for BGA devices - CBT-BGA-6014.

Socket your 144 pin BGA using Extreme Temperature Socket with Superior Electrical Performance

The contactor is a stamped spring pin with 19 gram actuation force per ball and cycle life of 500,000 insertions. Low force eliminates ball sticking issues due to temperature testing. The self inductance of the contactor is 0.93 nH, insertion loss < 1 dB at 23.2 GHz and contact resistance is <16mOhms. The current capacity of each contactor is 8 amps at 80C temperature rise. Socket temperature range is -55C to +180C. Socket also features a floating guide for precise ball to pin alignment. The specific configuration of the package to be tested in the CBT-BGA-6014 is a BGA, 13x13mm, 1mm pitch, 144 position, 12x12 ball array.

The socket is mounted using supplied hardware on the target PCB with no soldering, and uses smallest footprint for nearby passive components. To use, place the BGA device into the socket base and close the socket lid assembly on to the base using the double latch. This socket utilizes compression screw integrated with compression plate mechanism for precise actuation of varying chip thickness. This socket can be used for hand test and temperature characterization as well as debugging application in system development.

Pricing for the CBT-BGA-6014 is $689 at qty 1 with reduced pricing available depending on quantity required.

Apr 06, 2011 -

8 GHz Bandwidth Socket for Intel's ICH6 (I/O Controller Hub 6) BGA Package

Mar 11, 2011 -

Elastomer Socket for Infineon's BGA221

Feb 26, 2011 -

GHz Bandwidth Socket for Dual WLCSP

Feb 14, 2011 -

Prototype and Debug 96 ball BGA with Ease

Feb 03, 2011 -

Stamped Spring Pin BGA Socket for Burn-in Characterization

Jan 12, 2011 -

ATE Spring Pin BGA Socket for Digital Camera Processor

Dec 10, 2010 -

Spring Pin Socket for Kelvin Resistance Measurement

Nov 30, 2010 -

Package Converters Enable Testing Generation I product on Generation II System

May 10, 2024 -

ViTrox Presents Next-Gen Intelligent Manufacturing Solutions at SEMICON Southeast Asia 2024

May 10, 2024 -

ViTrox Collaborates with EAMAX to Showcase Cutting-Edge Technologies at Metaltech and Automex 2024

May 09, 2024 -

Purbest | 2024 IPC APEX EXPO Review

May 06, 2024 -

Aven Introduces New 9 Piece E-Z Pik Tweezers Set for Precision Work

May 06, 2024 -

KYZEN to Highlight AQUANOX A4618 and ANALYST2 at SMTA Rocky Mountain Expo and Tech Forum

May 06, 2024 -

VJ Electronix Introduces New Cost-Effective X-ray Inspection Solution with Superior Performance

May 06, 2024 -

Kimchuk, Inc. Elevates Testing Capabilities with Seica PILOT V8 NEXT Flying Probe Tester

May 06, 2024 -

Electronics Industry Sentiment Rose in April, Hitting New High

May 06, 2024 -

IPC's letter to Congress.

May 06, 2024 -

Murray Percival Company Awarded Top Representative of 2023 by MIRTEC

See electronics manufacturing industry news »

Stamped Spring Pin BGA Socket for IDT's FCBGA144 news release has been viewed 1181 times

Fluid Dispensing, Staking, TIM, Solder Paste

Sell Your Used SMT & Test Equipment