SMT, PCB Electronics Industry News

AIM Introduces NC258 No Clean Solder Paste

Feb 28, 2011

AIM is pleased to announce the development of NC258 No Clean Solder Paste, designed to offer one of the longest pause-to-print windows in the industry while enhancing fine print definitions.

In addition to its best-in-class printing capabilities, NC258 has proven to reduce voiding and head-in-pillow, thereby reducing rework and rejected board costs to the manufacturer. The superior wetting ability of NC258 results in bright, smooth and shiny solder joints. NC258 offers very low post process residues, which remain crystal clear after soldering.

NC258 is halogen-free to Oxygen Bomb EN 14582:2007 SW 9056 SW 5050 and halide-free to IPC J-STD-004. NC258 No Clean Solder Paste is best used within 9 months when stored at 4°C – 12°C (40°F - 55°F) or 4 months at room temperature and is available in a wide variety of packaging.

Headquartered in Montreal, Canada, AIM is a leading global manufacturer of assembly materials for the electronics industry. The company produces solder paste, liquid flux, cored wire, bar solder, adhesives, preforms, and specialty alloys such as indium and gold for electronics assembly, PC fabrication, component manufacturing and other industries. For more information, visit AIM on the web at, or contact us through email at

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