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ECT’s CPG To Showcase the ZIP® Family at BiTS™ Burn-In & Test Socket Workshop

Feb 26, 2011

The ZIP® patented 2-D design features planar contact surfaces fabricated by a unique manufacturing process, delivering performance and cost advantages. The ZIP® Series is designed to meet today's demanding test requirements and economics.

The ZIP® patented 2-D design features planar contact surfaces fabricated by a unique manufacturing process, delivering performance and cost advantages. The ZIP® Series is designed to meet today's demanding test requirements and economics.

Everett Charles Technologies’ (ECT) Contact Products Group (CPG) will showcase the latest additions to its ZIP® family of flat technology Pogo® pins in Booth A04 at the upcoming BiTS™ Burn-In & Test Socket Workshop, scheduled to take place March 6-9, 2011 at the Hilton Phoenix East/Mesa Hotel in Mesa, AZ.

A new eight-page ZIP® Product Portfolio brochure will be available for the first time at the ECT CPG booth. ZIP® recently has been granted US Patent Number 7,862,391.

In addition to the ZIP® family, ECT’s Contact Products Group’s display will highlight its expanded line of available pitches from 0.8 mm down to 0.2 mm center spacing. ECT also will feature the high-performance Bantam®, the pin of choice for the most demanding test applications; the Mini-Mite™, for higher current and consistent C-res requirements; and the CSP series, for a wide variety of double-ended Pogo technology applications with drop-in compatibility for many competitor test probes. ECT CPG personnel will be on hand to demonstrate the company’s latest technologies and answer customer inquiries related to its new range of products including:

ZIP® SCRUB™ ― The ZIP® SCRUB pin features a positive scrub-action pad and ball contact on lead-free plated array and peripheral devices where solder transfer causes frequent cleaning and maintenance cycles.

ZIP® KELVIN ― ECT’s ZIP® KELVIN is ideal for voltage sensitive device tests on array or peripheral devices requiring sub-1 ohm resistance measurements typical in RDSON and high-power applications.

ZIP® SUPER SHORT ― The SUPER SHORT is designed for 0.5nH low impedance, high frequency testing.

ZIP® Long-Travel ― The ZIP® Long-Travel, with an OAL up to 6.7mm, was developed for contacting large devices and strip tests where planarity and compliance are an issue.

Z8 ―The Z8 is suited for burn-in applications and combines the performance features of the standard ZIP® in a burn-in-price-point replaceable compliant pin.

The ZIP® patented 2-D design features planar contact surfaces fabricated by a unique manufacturing process, delivering performance and cost advantages. The ZIP® Series is designed to meet today's demanding test requirements and economics.

For more information about Everett Charles Technologies’ ZIP® family or to request advanced copies of the new product portfolio, e-mail ZIP_Info@ectinfo.com.


Everett Charles Technologies (http://www.ectinfo.com) is a subsidiary of Dover Corporation (NYSE: DOV) a leading manufacturer of electrical test products and services, including Pogo® test contacts, semiconductor test products, bare-board automatic test systems, and bare and loaded PCB test fixtures. ECT manufacturing, service, and support facilities are ISO registered with locations throughout the United States, Europe, and Asia. The company has been awarded numerous patents and participates actively in developing industry standards. Corporate offices for Everett Charles Technologies are located at 700 E. Harrison Ave., Pomona, California, USA, 91767.

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