Feb 22, 2011 
With somewhere between half and three-quarters of all SMT defects attributed to the printing process, keeping it in control is absolutely essential to a profitable operation. This presentation begins with a review of the basic mechanics of solder paste printing, the key elements of a robust process, the principles of automated inspection, and typical methods of process control. It continues with the general steps used to check a process that is not producing good prints, and then moves into specific defects like solder bridges, insufficient deposits and poor print definition.
The 45-minute presentation is designed to provide practical, useful troubleshooting skills for beginner to intermediate level SMT process engineers, technicians or production support personnel.
Shea is the founder and owner of Shea Engineering Services, a consulting firm that serves the electronics manufacturing industry. Prior to launching Shea Engineering, Chrys spent nearly 20 years working in various PCB assembly process engineering and management roles for Compaq Computer, Texas Instruments, Siemens, Motorola and Cookson Electronics.
With more than 200 technical publications to her credit, Chrys is a frequent presenter and instructor at SMTA functions and IPC international conferences. Chrys is an active member and former president of the Philadelphia SMTA chapter. She holds a B.S. in Mechanical Engineering from the University of Massachusetts and an M.S. in Manufacturing Engineering from the University of Rhode Island.
