Nov 04, 2010 
The Pan Pacific Microelectronics Symposium promotes International technical interchange and provides a premier forum for extensive networking among professionals and business leaders throughout the Pacific Basin. Participants come from Australia, China, India, Japan, Korea, North America, Southeast Asia, and Taiwan as well as Europe!
The conference will feature topics including packaging, interconnection, assembly, microsystems, nanotechnology, and business issues. This international event provides the ideal environment for conducting business, networking, meeting old friends and making new ones.
Important note: hotel room block and early bird rates expire on December 15.
Please register now: http://www.smta.org/panpac/register_now.cfm
You won't want to miss the keynote address: 3D Nanofabrication Using Heated Probe by Armin Knoll, IBM
Access the latest research on:
- 3D Package on Package (PoP) and Through Silicon Vias (TSV)
- Materials Advances: Connections, Substrates, and Reliability
- Strategic Manufacturing: Challenges and Reliability
- New Technology: LEDs, Green Electronics Design, and Photovoltaics
- Laser Processes
- and much more...
Exhibition and sponsorship opportunities are available; please link to http://www.smta.org/panpac/exhibitor_info.cfm for full information.
Please register now to receive your early bird conference discount and secure your hotel room.
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