Nov 03, 2010 
Nordson ASYMTEK's S-930N Selective Flux Jetting System improves package reliability, production throughput, and material utilization over other methods of applying flux and precise coatings. Separating flux and chip placement operations enables higher throughput. One customer reported throughput of 4,000 units per hour (UPH) using 5x10 pallets with 15mm2 die. The dual lane configuration increases UPH 60 to 85 percent.
The S-930N jets flux into tight places, producing highly accurate dots and lines with tight edge definition of 0.5 to 1mm as well as high-quality thin flux coatings > 5 microns. It minimizes flux residue and overspray saving process time and material costs. Factory space is saved with the small 600 x 1321mm footprint which is scalable in size and configuration to adapt to the needs and requirements of high-volume microelectronics manufacturing. Software and process controls ensure that the correct amount of flux is deposited, while calibrated process jetting (CPJ) enables uniform mass deposition and reduces process variability, providing a highly repeatable process while eliminating the need for operator interaction.
“Nordson ASYMTEK has a long history of innovation in the fields of coating and dispensing to give our customers a competitive advantage and enable them to make their designs a reality," said John Byers, president, Nordson ASYMTEK. "We continue to offer the best technology in addition to the best value over time."
The 2010 Global Technology Awards is an annual award sponsored by Global SMT & Packaging magazine. A team of international judges selected the best innovations for electronics manufacturing products and services. Entries were judged on innovation, speed/throughput improvements, quality contribution, cost benefits, environmental consideration, ease of use/implementation, and maintainability/repairability.
.gif)
