Published biennially, the IPC Roadmap has served as the authoritative guide to interconnect technological trends, providing a visualization of imminent, innovative technology. Exclusive to the electronic interconnect industry, the roadmap provides a route for achieving the vision — going from today into the future — by guiding companies in identifying, selecting and developing the right technology alternatives needed to create the products needed for future markets.
“We’ve turned the roadmap inside out to help users connect the dots a little easier, in terms of translating OEM system level requirements into the materials, features, structures and process requirements for printed boards and assemblies to support those needs,” says John (Jack) Fisher, president of Interconnect Technology Analysis, Inc. and chairman of the IPC Roadmap Executive Committee. “But perhaps a little harder to swallow will be the eye-opening data they’ll discern from the new regional analysis we’ve added.”
The 2011 roadmap includes expanded regional analysis and comparison. In both the substrate and assembly sections, the 2011 roadmap will provide insight into the regional differences in capability between Asia, Europe and North America — an addition that Dieter Bergman, IPC director of technology transfer, believes will, “kick up a little controversy.” As Bergman explains, the new data will shed light on the important difference between acknowledging a technology and actually having the capability to employ it. “The implications for a company seeking a qualified supplier are profound,” expresses Bergman. “We’re equipping users, especially purchasing staff, with information to go from making a cheap decision to an informed decision.”
Another essential addition to the 2011 Roadmap is the link of emulators to industry standards and specifications. A new section will discuss the changes that need to occur in industry standards content to make them relevant to tomorrow’s needs, including the addition of a state-of-the-art level for product features that demand a higher degree of precision. “We’re talking about capabilities that very, very few manufacturers can provide,” says Bergman. “Nevertheless, it is important to recognize that some consumer products need these features to meet market demand.” A poignant look into the disparate attitudes toward and acceptance of standards in different regions of the world will also be included.
In areas like the environment, where changes occur on a regular basis, the roadmap has been updated to reflect the current state as well as future issues, including sustainability.
The IPC Roadmap Committee invites anyone interested in joining their final few meetings, including teleconferences, in November, December and January, to contact IPC. For details on the meeting dates, times and topics, contact IPC Manager Jeanne Cooney at JeanneCooney@ipc.org or +1 847-597-2842.
The 2011 IPC International Technology Roadmap for Electronic Interconnections will be unveiled at IPC APEX EXPO in April 2011. Published as a CD, the roadmap includes several technical resource presentations that users can access easily at their workplace.
IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.7 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; and Shanghai, Shenzhen and Beijing, China.