Attendees enjoyed strong presentations from 50+ speakers covering three tracks: wafer-level packaging, 3D packaging, and MEMS packaging. Attendance was up 10% from last year with international representation from 13 countries.
The event commenced on Monday with tutorials from leading industry experts. Opening speaker Peter Ramm, Fraunhofer EMFT, opened with a presentation on "The European 3D Technology Platform for Heterogeneous Systems" on Tuesday evening.
The Technical Conference continued on Wednesday with an all-star Marketing Panel Discussion featuring three of the semiconductor industry's most respected forecasters: Jim Walker, Dataquest/Gartner Group, Jan Vardaman, TechSearch International, and Jean-Marc Yannou, Yole Développement. Terry Davis, Amkor Technology, moderated the discussion. Keynote speaker, Bradley McCredie, Ph.D., IBM, engaged his audience with his rousing presentation "Scaling, Packaging and System Integration, Who's Gonna Carry the Mail?"
Thursday featured a Supply Chain Panel Discussion by Beth Keser, Qualcomm, Luu Nguyen, Ph.D., National Semiconductor; Takeshi Wakabayashi, Casio; and Matt Kaufmann, Ph.D., Broadcom; moderated by Jan Vardaman, TechSearch International. The conference ended strong with Closing Speaker Rozalia Beica, Applied Materials, discussing "TSV Challenges and Integrated Solutions with EMC3D Consortium."
Sponsored jointly by the SMTA and Chip Scale Review magazine, the annual IWLPC explores cutting edge topics in wafer-level packaging and IC/MEMS/MOEMS packaging, including 3D/Stacked/CSP/SiP/SoP and mixed technology packages. The event was sponsored by Amkor Technology, EV Group, NEXX Systems, Pac Tech USA, and Technic Inc.
Plans are now underway for the 2011 event. Visit http://www.iwlpc.com to view the full program and watch for a complete event review. Contact Melissa Serres at 952-920-7682 or email@example.com with questions.
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.