SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Association Connecting Electronics Industries (IPC)


IPC and SMTA Announce Schedule for Session 4 of the High Performance Cleaning and Coating Conference

Oct 11, 2010

ROSEMONT, IL - Industry-leading associations IPC and SMTA jointly announce the agenda for Session 4 of the High Performance Cleaning and Coating Conference, scheduled to take place November 16-18, 2010 at the Renaissance Hotel & Convention Center in Schaumburg, Illinois.

As technology advances, new challenges arise. A critical element in meeting these challenges is an open communication channel between suppliers and users. Session 4, chaired by Bill Vuono of Raytheon, will address cleaning challenges such as cleaning agent component entrapment, removal of water soluble fluxes with DI water only, and the challenge of cleaning while meeting new air emissions standards. The topics in this session will target a sampling of manufacturing challenges and how working and partnering with the suppliers can help users continuously improve while meeting each new requirement. The following presentations will be held during Session 4:

  • Bill Vuono of Raytheon will discuss cleaning fluid entrapment under vented flip chip packages and new design developments that resolve this issue.

  • Seth Binfield of DfR Solutions and Jeannette Plante of NASA discuss a high reliability perspective on organic water soluble fluxes and cleanliness.

  • Luke Flaherty and Randal Knar of Raytheon discuss building high reliability electronic hardware within the California Air Regulatory Environment.

For more information about the conference, visit http://www.ipc.org/calendar/2010/cleaning-coating-conference-1110/cleaning-coating1110-full-brochure.htm or http://www.smta.org/education/symposia/symposia.cfm#cleaning

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