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STI Electronics' BGA Reballer Kit Saves Money and Components

Sep 26, 2010

BGA Reballer Kit.

BGA Reballer Kit.

MADISON, AL - STI Electronics, Inc., a full service organization providing training, electronic and industrial distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, announces that its BGA Reballer Kit allows components to be reused. The unique reballing system enables users to remove existing spheres from components and re-establish the spheres on the ball grid array (BGA) component.

STI's BGA Reballer is both easy to use and cost effective. The kit includes the reballer fixture, 10,000 spheres, flux, tweezers and a brush. To use STI's BGA Reballer, follow six simple steps:

  • Using a soldering iron, remove the excess solder and spheres

  • Apply the flux

  • Insert the component into the reballer fixture

  • Pour in the spheres from the kit

  • Drain off the extra spheres

  • Heat the fixture and component to attach the spheres (profile suggestions included)

Each reballer is designed to fit a BGA package, ensuring that the spheres are placed correctly each time. The reballer also is available for chip scale and flash memory devices.

For more information about the BGA Reballer or STI Electronics Inc., visit http://www.stielectronicsinc.com or e-mail sales@stielectronicsinc.com.

Since 1982, STI Electronics, Inc. (STI) has been the premier full service organization for training, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly in the electronics industry. STI also produces a complete line of solder training kits and training support products. Additionally, the company distributes products for the electronics and industrial markets. For more information, visit http://www.stielectronicsinc.com.

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