Yincae’s SMT 158 Capillary Underfill is a combination of capillary flow and no-flow underfills, rapid curing, fast flowing and easy reworking liquid epoxy that can be used as an underfill for chip scale packages, ball grid array devices, PoP (package-on-package) and land grid arrays as well as some flip chip applications. Additionally, SMT 158 is suitable for bare chip protection in a variety of advanced packages such as memory cards, chip carriers, hybrid circuits and multichip modules.
The underfill was designed for high-volume production environments where process speed and mechanical shock are key concerns. The material is dispensed easily, minimizes induced stresses, and provides outstanding reliability performance (e.g. temperature cycling performance) and excellent mechanical resistance.
The SMT 256 Individual Solder Joint Encapsulation Adhesive is the world’s first combined flux gel/individual solder joint encapsulation adhesive. The adhesive works like a flux gel but also surrounds the ball with a strong polymer adhesive film and bonds the ball to the component body and PCB without filling all of the space between the balls.
SMT 256 series dip adhesives were designed to enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA, flip chip and PoP, particularly for lead-free applications. SMT 256 can encapsulate the bumps on a component after dipping the component into the adhesive film. The implementation of SMT 256 can improve process yields, eliminating voids and crack in solder joint, removing head-in-pillow issues for large components during the lead-free reflow process.