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Pan Pacific 2011 Call for Abstracts

Aug 17, 2010

Pan Pacific Microelectronics Symposium's Technical Committee.

Pan Pacific Microelectronics Symposium's Technical Committee.

The Pan Pacific Microelectronics Symposium promotes International technical interchange and provides a premier forum for extensive networking among microelectronics professionals and business leaders throughout the Pacific Basin. Participants come from Australia, China, India, Japan, Korea, North America, Southeast Asia, and Taiwan as well as Europe!

The Pan Pacific Microelectronics Symposium focuses on the critical business markets and technologies of microelectronic packaging, interconnection, microsystems technology and assembly. The Program Committee invites you to submit your recent results for presentation at the Symposium on any of the topics listed below.

Papers should be 6-10 pages in length including graphics and they should offer original, previously unpublished, non-commercial research results on any of the topics listed below. Abstracts of 500 words should be submitted by August 16, 2010, with title and author contact information. Click the "Submit Abstract" button below to submit your abstract directly to the SMTA server, for review by the the Pan Pacific Technical Committee.

You will be notified by October 2010 if your abstract has been accepted and scheduled for presentation.

3D Technologies

  • Package on Package (PoP)

  • Thru Si Vias (TSV)

  • Module Stacking

  • Origami Flex Packages

  • Shaped Circuits

  • Build Up/Blind & Buried Via PWBs

  • Cu Pillars & Posts

  • Si Interposers

  • MCM/SiP Advances

Lighting & Displays

  • LED Packaging & Assembly

  • Compact Fluorescent Systems

  • OLED Developments

  • Display Drivers

  • Chip on Glass (CoG)

  • MEMS/MOEMS

  • Flat Panel Processes

Materials Advances

  • Nano Materials Applications

  • Thin & Thick Film Systems

  • Pb & Halogen Free

  • Thermal Management

  • Phosphors & Light Absorption

  • Interface Metallurgy (FC, WB, TAB, Pb Free Solder, etc.)

  • Integrated Passive Devices

  • Embedded Approaches (Passive & Actives)

  • Failure Analysis and Reliability

Renewable Energy Technologies

  • Photovoltaics

  • Power Control/Conversion/Distribution

  • Green Manufacturing

  • Power Packaging

  • Environmental Impact Analysis

  • Solar Thermal Conversion

  • Large Area/Module Assembly

Strategic Direction

  • Supply Chain & Operations Management

  • Economics & Cost Analysis

  • Trends, Forecasts & Roadmaps

  • Penetration Strategies

  • Technology Drivers

  • Health & Prognostics

  • Manufacturing Management & Control

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