Pan Pacific 2011 Call for Abstracts

Aug 17, 2010

Pan Pacific Microelectronics Symposium's Technical Committee.

Pan Pacific Microelectronics Symposium's Technical Committee.

The Pan Pacific Microelectronics Symposium promotes International technical interchange and provides a premier forum for extensive networking among microelectronics professionals and business leaders throughout the Pacific Basin. Participants come from Australia, China, India, Japan, Korea, North America, Southeast Asia, and Taiwan as well as Europe!

The Pan Pacific Microelectronics Symposium focuses on the critical business markets and technologies of microelectronic packaging, interconnection, microsystems technology and assembly. The Program Committee invites you to submit your recent results for presentation at the Symposium on any of the topics listed below.

Papers should be 6-10 pages in length including graphics and they should offer original, previously unpublished, non-commercial research results on any of the topics listed below. Abstracts of 500 words should be submitted by August 16, 2010, with title and author contact information. Click the "Submit Abstract" button below to submit your abstract directly to the SMTA server, for review by the the Pan Pacific Technical Committee.

You will be notified by October 2010 if your abstract has been accepted and scheduled for presentation.

3D Technologies

  • Package on Package (PoP)

  • Thru Si Vias (TSV)

  • Module Stacking

  • Origami Flex Packages

  • Shaped Circuits

  • Build Up/Blind & Buried Via PWBs

  • Cu Pillars & Posts

  • Si Interposers

  • MCM/SiP Advances

Lighting & Displays

  • LED Packaging & Assembly

  • Compact Fluorescent Systems

  • OLED Developments

  • Display Drivers

  • Chip on Glass (CoG)

  • MEMS/MOEMS

  • Flat Panel Processes

Materials Advances

  • Nano Materials Applications

  • Thin & Thick Film Systems

  • Pb & Halogen Free

  • Thermal Management

  • Phosphors & Light Absorption

  • Interface Metallurgy (FC, WB, TAB, Pb Free Solder, etc.)

  • Integrated Passive Devices

  • Embedded Approaches (Passive & Actives)

  • Failure Analysis and Reliability

Renewable Energy Technologies

  • Photovoltaics

  • Power Control/Conversion/Distribution

  • Green Manufacturing

  • Power Packaging

  • Environmental Impact Analysis

  • Solar Thermal Conversion

  • Large Area/Module Assembly

Strategic Direction

  • Supply Chain & Operations Management

  • Economics & Cost Analysis

  • Trends, Forecasts & Roadmaps

  • Penetration Strategies

  • Technology Drivers

  • Health & Prognostics

  • Manufacturing Management & Control

You must be a registered user to talk back to us.

More News from Surface Mount Technology Association (SMTA)

Apr 26, 2017 -

SMTA/CALCE Announce Program for Symposium on Counterfeit Parts and Materials

Apr 11, 2017 -

IBM and Siemens Experts to Keynote Contamination, Cleaning and Coating Conference

Apr 07, 2017 -

The SMTA Capital Chapter to Host a Meeting April 25th at ZESTRON Americas

Mar 15, 2017 -

Contamination, Cleaning and Coating Conference Program Finalized

Feb 05, 2017 -

SMTA Announces 2017 Educational Programming

Jan 24, 2017 -

The SMTA Capital Chapter to Host First Meeting of the Year on February 23rd at The Test Connection

Jan 20, 2017 -

Symposium on Counterfeit Parts and Materials Call for Abstracts

Jan 17, 2017 -

International Conference on Soldering and Reliability Call for Abstracts

Dec 20, 2016 -

SMTA International 2016 Best Papers Announced

Nov 22, 2016 -

Hutchins Grant Award Winner Announced

(543) more news from Surface Mount Technology Association (SMTA)

Pan Pacific 2011 Call for Abstracts news release has been viewed 636 times

Reflow Oven

SMT Replacement Nozzles