Several different methods of attaching PV ribbon were investigated, and the Unisonik was selected for its ease of use, flexibility and low cost of ownership.
The Unisonik system, developed exclusively by Japan Unix, uses a proprietary combination of heat and vibration to allow soldering to previously difficult substrates. Stainless steel, aluminum, coated or uncoated glass, and many other substrates that were difficult to work with in the past now are standard processes due to this advanced system.
The Unisonik-M uses ultrasonic waves of 60 kHz to remove oxidation, diffuse the metal into the substrate and reduce voids in the solder joints. The Unisonik-M system is a manual system for small applications or lab work, and the Unisonik-F system is a fully automated robotic soldering system for use in production environments.
Uniquely suited for soldering to difficult substrates, the Unisonik has shown excellent results in multiple areas outside the Photovoltaic manufacturing process as well.
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